Process for preparing n-(5-(3-(7-(3-fluorophenyl)-3h-imidazo[4,5-c]pyridin-2-yl)-1h-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide

ABSTRACT

The disclosure also provides useful intermediates and salts, amorphous and polymorph forms of the compound of Formula (1). These compounds are useful for various disease including cancer, abnormal cellular proliferation, angiogenesis, Alzheimer&#39;s disease, and osteoarthritis as well as Wnt-related diseases.

RELATED APPLICATIONS

The application is a continuation application of U.S. application Ser.No. 16/115,222, Aug. 28, 2018, which is a continuation application ofU.S. application Ser. No. 15/611,150, filed Jun. 1, 2017, and claims thebenefit of U.S. Provisional Application Nos. 62/344,170, filed Jun. 1,2016 and 62/418,657, filed Nov. 7, 2016, which are incorporated hereinby reference in their entirety.

TECHNICAL FIELD

Provided herein is a process for preparingN-(5-(3-(7-(3-fluorophenyl)-3H-imidazo[4,5-c]pyridin-2-yl)-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide,including amorphous and polymorph forms thereof. Also provided hereinare intermediates and pharmaceutically acceptable salts ofN-(5-(3-(7-(3-fluorophenyl)-3H-imidazo[4,5-c]pyridin-2-yl)-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide.This compound is useful for the treatment of various diseases includingcancer, abnormal cellular proliferation, angiogenesis, Alzheimer'sdisease, osteoarthritis and other Wnt-related diseases.

BACKGROUND

The compound of Formula 1:

N-(5-(3-(7-(3-fluorophenyl)-3H-imidazo[4,5-c]pyridin-2-yl)-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide,is a Wnt inhibitor. The compound of Formula (1) can be prepared asdisclosed in U.S. Pat. No. 8,252,812, incorporated by reference hereinin its entirety. There exists a need for alternative syntheticprocedures for the preparation of the compound of Formula (1). Suchalternative synthetic procedures are disclosed herein.

SUMMARY

Provided herein is a process for preparing a compound of Formula (1)

or a pharmaceutically acceptable salt thereof, the process comprising:

(a) reacting a compound of Formula (2)

or a salt thereof, wherein:

R¹ is a nitrogen protecting group, and

X¹ is a first leaving group;

with a compound of Formula (4)

or a salt thereof, wherein X² is a second leaving group;to prepare a compound of Formula (5)

or a salt thereof;

(b) reacting the compound of Formula (5), or the salt thereof, with acompound of Formula (6)

or a salt thereof, to prepare a compound of Formula (7)

or a salt thereof; and

(c) deprotecting the compound of Formula (7), or the salt thereof, toprepare the compound of Formula (1), or the pharmaceutically acceptablesalt thereof.

Also provided herein is a process for preparing a compound of Formula(1):

or a pharmaceutically acceptable salt thereof, the process comprising:

(a) reacting a compound of Formula (2)

or salt thereof, wherein:

R¹ is a nitrogen protecting group, and

X¹ is selected from the group consisting of —Cl, —Br, —I, and —OTf;

with a boron reagent to prepare a compound of Formula (3)

or salt thereof, wherein A is selected from the group consisting of aboronic acid, a boronic ester, a boronate, a borinate, a boranate, aboranamide, an N-coordinated boronate, and a trifluoroborate;

(b) reacting the compound of Formula (3), or the salt thereof, with acompound of Formula (4)

or a salt thereof, wherein X² is selected from the group consisting of—Cl, —Br, —I, and —OTf; to prepare a compound of Formula (5)

or a salt thereof;

(c) reacting the compound of Formula (5), or the salt thereof, with acompound of Formula (6)

or a salt thereof, to prepare a compound of Formula (7)

or a salt thereof; and

(d) deprotecting the compound of Formula (7), or the salt thereof, toprepare the compound of Formula (1), or the pharmaceutically acceptablesalt thereof.

Further provided herein is a process for preparing a compound of Formula(1):

or a salt thereof, the process comprising:

(a) reacting a compound of Formula (8)

or a salt thereof, with bis(pinacolato)diboron to produce a compound ofFormula (9)

or a salt thereof;

(b) reacting the compound of Formula (9), or the salt thereof, with acompound of Formula (10)

or a salt thereof, to prepare a compound of Formula (11)

or a salt thereof;

(c) reacting the compound of Formula (11), or the salt thereof, with acompound of Formula (6)

or a salt thereof, to prepare a compound of Formula (12)

or a salt thereof; and

(d) deprotecting the compound of Formula (12), or the salt thereof, toprepare the compound of Formula (1), or a salt thereof.

The disclosure also provides a process for preparing a compound ofFormula (1)

or a salt thereof, the process comprising:

(a) reacting a compound of Formula (8)

or a salt thereof, with bis(pinacolato)diboron and Pd(dppf)Cl₂ toproduce a compound of Formula (9)

or a salt thereof;

(b) reacting the compound of Formula (9), or the salt thereof, with acompound of Formula (10)

or a salt thereof, with Pd(PPh₃)₄ and K₃PO₄ to prepare a compound ofFormula (11)

or a salt thereof;

(c) reacting the compound of Formula (11), or the salt thereof, with acompound of Formula (6)

or a salt thereof, to prepare a compound of Formula (12)

or a salt thereof; and

(d) deprotecting the compound of Formula (12), or the salt thereof, toprepare the compound of Formula (1), or a salt thereof, whereindeprotecting the compound of Formula (12) to prepare the compound ofFormula (1) comprises reacting the compound of Formula (12) with TFA. Insome embodiments, the TFA is neat TFA. In some embodiments, the ratio ofmass equivalents of TFA to the compound of Formula (12), or a saltthereof, is about 2:1 to about 16:1. In some embodiments, the ratio ofmass equivalents of TFA to the compound of Formula (12), or a saltthereof, is about 7:1 to about 9:1. In some embodiments, the ratio ofmass equivalents of TFA to the compound of Formula (12), or a saltthereof, is about 8:1.

In some embodiments of the process provided herein, deprotecting thecompound of Formula (12), or a salt thereof, is performed at atemperature of about 15° C. to about 25° C. In some embodiments,deprotecting the compound of Formula (12), or a salt thereof, isperformed at a temperature of about 20° C.

In some embodiments of the process provided herein, deprotecting thecompound of Formula (12), or a salt thereof, is performed for a time ofabout 2 hours to about 7 hours. In some embodiments, deprotecting thecompound of Formula (12), or a salt thereof, is performed for a time ofabout 3 hours to about 7 hours. In some embodiments, deprotecting thecompound of Formula (12), or a salt thereof, is performed for a time ofabout 2 hours to about 4 hours. In some embodiments, deprotecting thecompound of Formula (12), or a salt thereof, is performed for a time ofabout 5 hours. In some embodiments, deprotecting the compound of Formula(12), or a salt thereof, is performed for a time of about 3 hours.

In some embodiments of the process provided herein, deprotecting thecompound of Formula (12), or a salt thereof, comprises forming a firstmixture; and adding water to the first mixture at a temperature of about0° C. to about 10° C. to form a second mixture. In some embodiments,water is added at a temperature of about 5° C. to form the secondmixture. In some embodiments, the process comprises reslurrying thesecond mixture for a time of about 0.5 hours to about 1 hour. In someembodiments, the process comprises reslurrying the second mixture for atime of about 0.75 hours. In some embodiments, the process comprisesreslurrying the second mixture at a temperature of about 0° C. to about10° C. In some embodiments, the process comprises reslurrying the secondmixture at a temperature of about 5° C.

In some embodiments, the process further comprises filtering the secondmixture to provide a filtrate. In some embodiments, the process furthercomprises adding water to the filtrate at a temperature of about 0° C.to about 10° C. to form a third mixture. In some embodiments, water isadded to the filtrate at a temperature of about 5° C. to form the thirdmixture. In some embodiments, the process comprises reslurrying thethird mixture at a temperature of about 5° C. to about 15° C. In someembodiments, the process comprises reslurrying the third mixture at atemperature of about 10° C. In some embodiments, the process comprisesreslurrying the third mixture for a time of about 1 hour to about 2hours. In some embodiments, the process comprises reslurrying the thirdmixture for a time of about 1.5 hours. In some embodiments, the processfurther comprises filtering the third mixture to provide a firstresidual solid.

In some embodiments of the process provided herein, the process furthercomprises adding ethanol to the first residual solid to form a fourthmixture. In some embodiments, the process comprises reslurrying thefourth mixture at a temperature of about 25° C. to about 35° C. In someembodiments, the process comprises reslurrying the fourth mixture at atemperature of about 30° C. In some embodiments, the process comprisesreslurrying the fourth mixture for a time of about 2 hours to about 4hours. In some embodiments, the process comprises reslurrying the fourthmixture for a time of about 3 hours. In some embodiments, the processcomprises filtering the fourth mixture to provide a second residualsolid.

In some embodiments of the process provided herein, the processcomprises adding water to the second residual solid to form a fifthmixture. In some embodiments, the process comprises reslurrying thefifth mixture at a temperature of about 20° C. to about 30° C. In someembodiments, the process comprises reslurrying the fifth mixture at atemperature of about 25° C. In some embodiments, the process comprisesreslurrying the fifth mixture for a time of about 0.5 hour to about 1.5hours. In some embodiments, the process comprises reslurrying the fifthmixture for a time of about 1 hour.

In some embodiments of the process provided herein, the processcomprises adding a base to the fifth mixture to form a sixth mixture. Insome embodiments, the base is selected from the group consisting of:lithium carbonate, sodium carbonate, potassium carbonate, cesiumcarbonate, sodium hydrogen carbonate, potassium hydrogen carbonate,sodium sulfate, potassium sulfate, cesium sulfate, lithium phosphate,sodium phosphate, potassium phosphate, and cesium phosphate. In someembodiments, the base is sodium carbonate. In some embodiments, theprocess comprises reslurrying the sixth mixture at a temperature ofabout 20° C. to about 30° C. In some embodiments, the process comprisesreslurrying the sixth mixture at a temperature of about 25° C. In someembodiments, the process comprises reslurrying the sixth mixture for atime of about 5 hours to about 7 hours. In some embodiments, the processcomprises reslurrying the sixth mixture for a time of about 6 hours. Insome embodiments, the process further comprises filtering the sixthmixture to provide a third residual solid.

In some embodiments of the process provided herein, the process furthercomprises adding water to the third residual solid to form a seventhmixture. In some embodiments, the process comprises reslurrying theseventh mixture at a temperature of about 20° C. to about 30° C. In someembodiments, the process comprises reslurrying the seventh mixture at atemperature of about 25° C. In some embodiments, the process comprisesreslurrying the seventh mixture for a time of about 5 hours to about 8hours. In some embodiments, the process comprises reslurrying theseventh mixture for a time of about 6.5 hours. In some embodiments, theprocess further comprises filtering the seventh mixture to provide afourth residual solid.

In some embodiments of the process provided herein, the process furthercomprises (a) adding water to the fourth residual solid to provide aneighth mixture; (b) reslurrying the eighth mixture; and (c) filteringthe eighth mixture to provide a fifth residual solid. In someembodiments, steps (a)-(c) are performed an additional one or moretimes.

In some embodiments of the process provided herein, the process furthercomprises adding isopropanol to the fifth residual solid to form a ninthmixture. In some embodiments, the process comprises reslurrying theninth mixture at a temperature of about 20° C. to about 30° C. In someembodiments, the process comprises reslurrying the ninth mixture at atemperature of about 25° C. In some embodiments, the process comprisesreslurrying the ninth mixture for a time of about 1 hour to about 3hours. In some embodiments, the process comprises reslurrying the ninthmixture for a time of about 2 hours. In some embodiments, the processfurther comprises filtering the ninth mixture to provide a sixthresidual solid.

Also provided herein is a process for preparing a compound of Formula(1)

or a salt thereof, the process comprising:

(a) reacting the compound of Formula (5)

or a salt thereof, wherein R¹ is a nitrogen protecting group, with acompound of Formula (6)

or a salt thereof, to prepare a compound of Formula (7)

or a salt thereof.

Further provided herein is a process for preparing a compound of Formula(1)

or a salt thereof, the process comprising:

reacting a compound of Formula (2)

or a salt thereof, wherein X¹ is selected from the group consisting of—Cl, —Br, —I, and —OTf, and R¹ is a nitrogen protecting group, with aboron reagent to prepare a compound of Formula (3)

or a salt thereof, wherein:

A is selected from the group consisting of a boronic acid, a boronicester, a boronate, a borinate, a boranate, a boranamide, anN-coordinated boronate, and a trifluoroborate.

This disclosure also provides a process for preparing a compound ofFormula (7)

or a salt thereof, wherein R¹ is nitrogen protecting group, comprisingreacting a compound of Formula (5)

or a salt thereof, with a compound of Formula (6)

or a salt thereof, to prepare a compound of Formula (7), or the saltthereof.

Also provided herein is a process for preparing a compound of Formula(3)

or a salt thereof, wherein:

R¹ is a nitrogen protecting group, and

A is selected from the group consisting of a boronic acid, a boronicester, a boronate, a borinate, a boranate, a boranamide, anN-coordinated boronate, and a trifluoroborate;

comprising reacting a compound of Formula (2)

or a salt thereof, wherein X¹ is selected from the group consisting of—Cl, —Br, —I, and —OTf with a boron reagent to prepare a compound ofFormula (3), or the salt thereof.

Further provided herein is a process for preparing a compound of Formula(1)

or a salt thereof, the process comprising deprotecting a compound ofFormula (12)

or a salt thereof, to prepare the compound of Formula (1) or a saltthereof.

This disclosure provides a process for preparing a pharmaceuticalcomposition, including mixing (i) a compound of Formula (1)

or salt thereof, prepared by any of the processes described herein, and(ii) a pharmaceutically acceptable carrier (excipient), to form thecomposition.

Also provided is a process for preparing a polymorph form of a compoundof Formula (1)

the process comprising: (a) preparing the compound of Formula (1)according to any one of the processes provided herein; and (b)converting the compound of Formula (1) to the polymorph form. In someembodiments, step (b) comprises reslurrying the compound of Formula (1)or a composition comprising the compound of Formula (1) in a solvent ormixture of solvents to generate the polymorph form. In some embodiments,reslurrying is performed at room temperature. In some embodiments,reslurrying is performed at a temperature of about 50° C. In someembodiments, reslurrying is performed at a temperature of about 30° C.to about 35° C. In some embodiments, reslurrying is performed for a timeof about 10 hours to about 80 hours. In some embodiments, reslurrying isperformed for a time of about 58 hours to about 80 hours.

In some embodiments, the process further comprises a filtering step toprovide the polymorph form as a residual solid.

In some embodiments, the reslurrying comprises a solvent or mixture ofsolvents selected from methanol, water, or a mixture thereof.

In some embodiments, the polymorph form of the compound of Formula (1)is a non-stoichiometric hydrate of polymorph Form 1 having between 1%and about 20% by weight water.

Also provided is a process for preparing a polymorph form of a compoundof Formula (1)

the process comprising converting the compound of Formula (1) to thepolymorph form. In some embodiments, the process comprises reslurryingthe compound of Formula (1) or a composition comprising the compound ofFormula (1) in a solvent or mixture of solvents to generate thepolymorph form. In some embodiments, the reslurrying is performed atroom temperature. In some embodiments, the reslurrying is performed at atemperature of about 50° C. In some embodiments, the reslurrying isperformed at a temperature of about 30° C. to about 35° C. In someembodiments, the reslurrying is performed for a time of about 10 hoursto about 80 hours. In some embodiments, the reslurrying is performed fora time of about 58 hours to about 80 hours. In some embodiments, theprocess further comprises a filtering step to provide the polymorph formas a residual solid.

In some embodiments, the reslurrying comprises a solvent or mixture ofsolvents selected from methanol, water, or a mixture thereof.

In some embodiments, the polymorph form of the compound of Formula (1)is a non-stoichiometric hydrate of polymorph Form 1 having between 1%and about 20% by weight water.

DESCRIPTION OF DRAWINGS

FIGS. 1A-1D are scans of polymorph Form 1 of the compound of Formula(I). FIG. 1A is an x-ray powder diffraction scan of fully dried Form 1.FIG. 1B is a differential scanning calorimetry scan of Form 1. FIG. 1Cis a thermal gravimetric analysis scan of Form 1. FIG. 1D is a dynamicvapor sorption scan of Form 1.

FIGS. 2A-21I are scans of polymorph Forms 2, 2*, and 2** of the compoundof Formula (I). FIG. 2A is an x-ray powder diffraction scan of fullydried Form 2. FIG. 2B is a differential scanning calorimetry scan ofForm 2. FIG. 2C is a thermal gravimetric analysis scan of Form 2.

FIG. 2D is an x-ray powder diffraction scan of fully dried Form 2*. FIG.2E is a differential scanning calorimetry scan of Form 2*. FIG. 2F is athermal gravimetric analysis scan of Form 2*.

FIG. 2G is an x-ray powder diffraction scan of Form 2**. FIG. 2H is adifferential scanning calorimetry scan of Form 2**.

FIGS. 3A-3C are scans of polymorph Form 3 of the compound of Formula(I). FIG. 3A is an x-ray powder diffraction scan of fully dried Form 3.FIG. 3B is a differential scanning calorimetry scan of Form 3. FIG. 3Cis a thermal gravimetric analysis scan of Form 3.

FIGS. 4A-4I are scans of polymorph Forms 4, 4*, and 4** of the compoundof Formula (I). FIG. 4A is an x-ray powder diffraction scan of fullydried Form 4. FIG. 4B is a differential scanning calorimetry scan ofForm 4. FIG. 4C is a thermal gravimetric analysis scan of Form 4. FIG.4D is an x-ray powder diffraction scan of fully dried Form 4*. FIG. 4Eis a differential scanning calorimetry scan of Form 4*. FIG. 4F is athermal gravimetric analysis scan of Form 4*. FIG. 4G is an x-ray powderdiffraction scan of Form 4**. FIG. 411 is a differential scanningcalorimetry scan of Form 4**. FIG. 4I is a thermal gravimetric analysisscan of Form 4**.

FIGS. 5A-5D are scans of polymorph Forms 5 and 5* of the compound ofFormula (I). FIG. 5A is an x-ray powder diffraction scan of fully driedForm 5. FIG. 5B is a differential scanning calorimetry scan of Form 5.FIG. 5C is a thermal gravimetric analysis scan of Form 5. FIG. 5D is anx-ray powder diffraction scan of Form 5*.

FIGS. 6A and 6B are scans of polymorph Form 6 of the compound of Formula(I). FIG. 6A is an x-ray powder diffraction scan of Form 6. FIG. 6B is adifferential scanning calorimetry scan of Form 6.

FIGS. 7A-7C are scans of polymorph Form 7 of the compound of Formula(I). FIG. 7A is an x-ray powder diffraction scan of fully dried Form 7.FIG. 7B is a differential scanning calorimetry scan of Form 7. FIG. 7Cis a thermal gravimetric analysis scan of Form 7.

FIGS. 8A-8C are scans of polymorph Form 8 of the compound of Formula(I). FIG. 8A is an x-ray powder diffraction scan of fully dried Form 8.FIG. 8B is a differential scanning calorimetry scan of Form 8. FIG. 8Cis a thermal gravimetric analysis scan of Form 8.

FIGS. 9A-9D are scans of polymorph Form 9 of the compound of Formula(I). FIG. 9A is an x-ray powder diffraction scan of fully dried Form 9.FIG. 9B is a differential scanning calorimetry scan of Form 9. FIG. 9Cis a thermal gravimetric analysis scan of Form 9. FIG. 9D is a dynamicvapor sorption scan of Form 9.

FIGS. 10A-10E are scans of polymorph Forms 10 and 10* of the compound ofFormula (I). FIG. 10A is an x-ray powder diffraction scan of fully driedForm 10. FIG. 10B is a differential scanning calorimetry scan of Form10. FIG. 10C is a thermal gravimetric analysis scan of Form 10. FIG. 10Dis an x-ray powder diffraction scan of Form 10*. FIG. 10E is adifferential scanning calorimetry scan of Form 10*.

FIGS. 11A-11F are scans of polymorph Forms 11 and 11* of the compound ofFormula (I). FIG. 11A is an x-ray powder diffraction scan of fully driedForm 11. FIG. 11B is a differential scanning calorimetry scan of Form11. FIG. 11C is a thermal gravimetric analysis scan of Form 11. FIG. 11Dis an x-ray powder diffraction scan of fully dried Form 11*. FIG. 11E isa differential scanning calorimetry scan of Form 11*. FIG. 11F is athermal gravimetric analysis scan of Form 11*.

FIGS. 12A-12C are scans of Form 12, an example of a non-stoichiometrichydrate of polymorph Form 1 of the compound of Formula (I). FIG. 12A isan x-ray powder diffraction scan of Form 12. FIG. 12B is a differentialscanning calorimetry scan of Form 12. FIG. 12C is a thermal gravimetricanalysis scan of Form 12.

FIGS. 13A-13D are scans of Form 13, an example of a non-stoichiometrichydrate of polymorph Form 1 of the compound of Formula (I). FIG. 13A isan x-ray powder diffraction scan of Form 13. FIG. 13B is a differentialscanning calorimetry scan of Form 13. FIG. 13C is a thermal gravimetricanalysis scan of Form 13. FIG. 13D is a dynamic vapor sorption scan ofForm 13.

DETAILED DESCRIPTION 1. Definitions

It is appreciated that certain features of the disclosure, which are,for clarity, described in the context of separate embodiments, can alsobe provided in combination in a single embodiment. Conversely, variousfeatures of the disclosure which are, for brevity, described in thecontext of a single embodiment, can also be provided separately or inany suitable subcombination.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as is commonly understood by one of ordinary skillin the art to which this disclosure belongs. In the event that there isa plurality of definitions for terms cited herein, those in this sectionprevail unless otherwise stated. All patents, applications, publishedapplications, and other publications cited herein are incorporated byreference in their entirety.

For the terms “for example” and “such as,” and grammatical equivalencesthereof, the phrase “and without limitation” is understood to followunless explicitly stated otherwise. As used herein, the term “about” ismeant to account for variations due to experimental error. As usedherein, the singular forms “a,” “an,” and “the” include plural referentsunless the context clearly dictates otherwise.

The term “salt” includes any ionic form of a compound and one or morecounter-ionic species (cations and/or anions). Salts also includezwitterionic compounds (i.e., a molecule containing one more cationicand anionic species, e.g., zwitterionic amino acids). Counter ionspresent in a salt can include any cationic, anionic, or zwitterionicspecies. Exemplary anions include, but are not limited to: chloride,bromide, iodide, nitrate, sulfate, bisulfate, sulfite, bisulfite,phosphate, acid phosphate, perchlorate, chlorate, chlorite,hypochlorite, periodate, iodate, iodite, hypoiodite, carbonate,bicarbonate, isonicotinate, acetate, trichloroacetate, trifluoroacetate,lactate, salicylate, citrate, tartrate, pantothenate, bitartrate,ascorbate, succinate, maleate, gentisinate, fumarate, gluconate,glucaronate, saccharate, formate, benzoate, glutamate, methanesulfonate,trifluoromethanesulfonate, ethanesulfonate, benzenesulfonate,p-toluenesulfonate, p-trifluoromethylbenzenesulfonate, hydroxide,aluminates, and borates. Exemplary cations include, but are not limitedto: monovalent alkali metal cations, such as lithium, sodium, potassium,and cesium, and divalent alkaline earth metals, such as beryllium,magnesium, calcium, strontium, and barium. Also included are transitionmetal cations, such as gold, silver, copper and zinc, as well asnon-metal cations, such as ammonium salts.

Compounds provided herein can also include all isotopes of atomsoccurring in the intermediates or final compounds. Isotopes includethose atoms having the same atomic number but different mass numbers.For example, isotopes of hydrogen include hydrogen, deuterium, andtritium.

The term “compound,” as used herein, is meant to include allstereoisomers, geometric isomers, tautomers, and isotopes of thestructures depicted. Compounds herein identified by name or structure asone particular tautomeric form are intended to include other tautomericforms unless otherwise specified.

The term “polymorph,” as used herein, refers to crystals of the samemolecule having different physical properties as a result of the orderof the molecules in the crystal lattice. Polymorphs of a single compoundhave one or more different chemical, physical, mechanical, electrical,thermodynamic, and/or biological properties from each other. Differencesin physical properties exhibited by polymorphs can affect pharmaceuticalparameters such as storage stability, compressibility, density(important in composition and product manufacturing), dissolution rates(an important factor in determining bio-availability), solubility,melting point, chemical stability, physical stability, powderflowability, water sorption, compaction, and particle morphology.Differences in stability can result from changes in chemical reactivity(e.g. differential oxidation, such that a dosage form discolors morerapidly when comprised of one polymorph than when comprised of anotherpolymorph) or mechanical changes (e.g., crystal changes on storage as akinetically favored polymorph converts to a thermodynamically morestable polymorph) or both (e.g., one polymorph is more hygroscopic thanthe other). As a result of solubility/dissolution differences, sometransitions affect potency and/or toxicity. In addition, the physicalproperties of the crystal may be important in processing; for example,one polymorph might be more likely to form solvates or might bedifficult to filter and wash free of impurities (i.e., particle shapeand size distribution might be different between one polymorph relativeto the other). “Polymorph” does not include amorphous forms of thecompound. As used herein, “amorphous” refers to a noncrystalline form ofa compound which may be a solid state form of the compound or asolubilized form of the compound. For example, “amorphous” refers to acompound without a regularly repeating arrangement of molecules orexternal face planes.

The term “anhydrous,” as used herein, refers to a crystal form of thecompound of Formula (I) that has 1% or less by weight water. Forexample, 0.5% or less, 0.25% or less, or 0.1% or less by weight water.

The term “solvate” as used herein refers to a crystalline form of acompound of Formula (I), such as a polymorph form of the compound, wherethe crystal lattice comprises one or more solvents of crystallization.

The term “non-stoichiometric hydrate” refers to a crystalline form of acompound of Formula I that comprises water, but wherein variations inthe water content do not cause significant changes to the crystalstructure. In some embodiments, a non-stoichiometric hydrate can referto a crystalline form of a compound of Formula I that has channels ornetworks throughout the crystal structure into which water molecules candiffuse. During drying of non-stoichiometric hydrates, a considerableproportion of water can be removed without significantly disturbing thecrystal network, and the crystals can subsequently rehydrate to give theinitial non-stoichiometric hydrated crystalline form. Unlikestoichiometric hydrates, the dehydration and rehydration ofnon-stoichiometric hydrates is not accompanied by a phase transition,and thus all hydration states of a non-stoichiometric hydrate representthe same crystal form. In some embodiments, a non-stoichiometric hydratecan have up to about 20% by weight water, such as, about 20%, about 19%,about 18%, about 17%, about 16%, about 15%, about 14%, about 13%, about12%, about 11%, about 10%, about 9%, about 8%, about 7%, about 6%, about5%, about 4%, about 3%, about 2%, or greater than 1% water by weight. Insome embodiments, a non-stoichiometric hydrate can have between 1% andabout 20% by weight water, such as between 1% and about 5%, 1% and about10%, 1% and about 15%, about 2% and about 5%, about 2% and about 10%,about 2% and about 15%, about 2% and about 20%, about 5% and about 10%,about 5% and about 15%, about 5% and about 20%, about 10% and about 15%,about 10% and about 20%, or about 15% and about 20% by weight water.

In some embodiments the % water by weight in a crystal form, such as anon-stoichiometric hydrate, is determined by the Karl Fischer titrationmethod. In some embodiments, the crystal form is dried prior to KarlFischer titration.

“Purity,” when used in reference to a composition including a polymorphof the compound of Formula (1), refers to the percentage of one specificpolymorph form relative to another polymorph form or an amorphous formof the compound of Formula (1) in the referenced composition. Forexample, a composition comprising polymorph Form 1 having a purity of90% would comprise 90 weight parts Form 1 and 10 weight parts of otherpolymorph and/or amorphous forms of the compound of Formula (1).

As used herein, a compound or composition is “substantially free of” oneor more other components if the compound or composition contains nosignificant amount of such other components. Such components can includestarting materials, residual solvents, or any other impurities that canresult from the preparation of and/or isolation of the compounds andcompositions provided herein. In some embodiments, a polymorph formprovided herein is substantially free of other polymorph forms. In someembodiments, a particular polymorph of the compound of Formula (1) is“substantially free” of other polymorphs if the particular polymorphconstitutes at least about 95% by weight of the compound of Formula (1)present. In some embodiments, a particular polymorph of the compound ofFormula (1) is “substantially free” of other polymorphs if theparticular polymorph constitutes at least about 97%, about 98%, about99%, or about 99.5% by weight of the compound of Formula (1) present. Incertain embodiments, a particular polymorph of the compound of Formula(1) is “substantially free” of water if the amount of water constitutesno more than about 2%, about 1%, or about 0.5% by weight of thepolymorph.

As used herein, a compound is “substantially present” as a givenpolymorph if at least about 50% by weight of the compound is in the formof that polymorph. In some embodiments, at least about 60% by weight ofthe compound is in the form of that polymorph. In some embodiments, atleast about 70% by weight of the compound is in the form of thatpolymorph. In some embodiments, at least about 80% by weight of thecompound is in the form of that polymorph. In some embodiments, at leastabout 90% by weight of the compound is in the form of that polymorph. Insome embodiments, at least about 95% by weight of the compound is in theform of that polymorph. In some embodiments, at least about 96% byweight of the compound is in the form of that polymorph. In someembodiments, at least about 97% by weight of the compound is in the formof that polymorph. In some embodiments, at least about 98% by weight ofthe compound is in the form of that polymorph. In some embodiments, atleast about 99% by weight of the compound is in the form of thatpolymorph. In some embodiments, at least about 99.5% by weight of thecompound is in the form of that polymorph.

In some embodiments, the compounds provided herein, including salts andamorphous and polymorph forms thereof, are substantially isolated. By“substantially isolated” is meant that the compound is at leastpartially or substantially separated from the environment in which itwas formed or detected. Partial separation can include, for example, acomposition enriched in the compounds provided herein. Substantialseparation can include compositions containing at least about 50%, atleast about 60%, at least about 70%, at least about 80%, at least about90%, at least about 95%, at least about 97%, or at least about 99% byweight of the compounds provided herein, or salt or amorphous orpolymorph form thereof. Methods for isolating compounds and their saltsare routine in the art.

As used herein, the term “inert atmosphere” refers to a substantiallyoxygen free environment and primarily consists of non-reactive gases.Exemplary inert atmospheres include a nitrogen atmosphere or an argonatmosphere.

The phrase “pharmaceutically acceptable” is employed herein to refer tothose compounds, materials, compositions, and/or dosage forms which are,within the scope of sound medical judgment, suitable for use in contactwith the tissues of human beings and animals without excessive toxicity,irritation, allergic response, or other problem or complication,commensurate with a reasonable benefit/risk ratio.

The terms “ambient temperature” and “room temperature” or “RT”, as usedherein, are understood in the art, and refer generally to a temperature,e.g. a reaction temperature, that is about the temperature of the roomin which the reaction is carried out, for example, a temperature fromabout 20° C. to about 30° C., typically around 25° C.

Also provided herein are pharmaceutically acceptable salts of thecompounds described herein. As used herein, “pharmaceutically acceptablesalts” refers to derivatives of the disclosed compounds wherein theparent compound is modified by converting an existing acid or basemoiety to its salt form. Examples of pharmaceutically acceptable saltsinclude, but are not limited to, mineral or organic acid salts of basicresidues such as amines; alkali or organic salts of acidic residues suchas carboxylic acids; and the like. The pharmaceutically acceptable saltsof the compounds provided herein include the conventional non-toxicsalts of the parent compound formed, for example, from non-toxicinorganic or organic acids. The pharmaceutically acceptable salts of thecompounds provided herein can be synthesized from the parent compoundwhich contains a basic or acidic moiety by conventional chemicalmethods. Generally, such salts can be prepared by reacting the free acidor base forms of these compounds with a stoichiometric amount of theappropriate base or acid in water or in an organic solvent, or in amixture of the two; in some embodiments, a non-aqueous media like ether,ethyl acetate, alcohol (e.g., methanol, ethanol, isopropanol, orbutanol), or acetonitrile (ACN) can be used. Lists of suitable salts canbe found in Remington's Pharmaceutical Sciences, 17th ed., MackPublishing Company, Easton, Pa., 1985, p. 1418 and Journal ofPharmaceutical Science, 66, 2 (1977), each of which is incorporatedherein by reference in its entirety. Conventional methods for preparingsalt forms are described, for example, in Handbook of PharmaceuticalSalts: Properties, Selection, and Use, Wiley-VCH, 2002.

2. Processes for Preparing a Compound of Formula (1) and IntermediatesThereof

Provided herein is a process for preparing a compound of Formula (1)

including salts and amorphous and polymorph forms thereof. The processincludes:

(a) reacting a compound of Formula (2)

or a salt thereof, wherein R¹ is a nitrogen protecting group, and X¹ isa first leaving group, with a compound of Formula (4)

or a salt thereof, wherein X² is a second leaving group; to prepare acompound of Formula (5)

or a salt thereof;

(b) reacting the compound of Formula (5), or the salt thereof, with acompound of Formula (6)

or a salt thereof, to prepare a compound of Formula (7)

or a salt thereof; and

(c) deprotecting the compound of Formula (7), or the salt thereof, toprepare the compound of Formula (1). In some embodiments, the processfurther comprises forming a salt of the compound of Formula (1). In someembodiments, the process further comprises preparing a polymorph form ofthe compound of Formula (1). In some embodiments, the polymorph form ofthe compound of Formula (1) is Form 1. In some embodiment, the polymorphform of the compound of Formula (1) is a non-stoichiometric hydrate ofpolymorph Form 1 having between 1% and about 20% by weight water.

As used herein, the term “leaving group” refers to an atom or group ofatoms that departs with a pair of electrons in heterolytic bondcleavage. A leaving group can be a stable anion of a strong acid, suchas a halide (e.g., fluoride, chloride, bromide, iodide) or a sulfonateester (e.g., methanesulfonate, trifluoromethanesulfonate,4-methylbenzenesulfonate). A leaving group can also be a group, such asa chloride, a bromide, an iodide, or a trifluoromethanesulfonate group,that is capable of undergoing oxidative addition to palladium during apalladium-catalyzed reaction, such as a palladium-catalyzedSuzuki-Miyaura cross-coupling reaction.

As used herein, the term “nitrogen protecting group” refers to any groupthat is capable of reversibly protecting a nitrogen functionality (e.g.,an amine). Suitable nitrogen protecting groups can be found in therelevant chapters of standard reference works such as Protective Groupsin Organic Chemistry, J. F. W. McOmie, Plenum Press, London and NewYork, 1973; Greene's Protective Groups in Organic Synthesis, P. G. M.Wuts, fourth edition, Wiley, New York, 2006; and Protecting Groups, P.J. Kocienski, third edition, Thieme, New York, 2005.

Non-limiting examples of nitrogen protecting groups include acetyl,benzyl, cumyl, benzhydryl, trityl (Trt), benzyloxycarbonyl (Cbz),9-fluorenylmethyloxycarbonyl (Fmoc), benzyloxymethyl (BOM),pivaloyl-oxy-methyl (POM), trichloroethoxycarbonyl (Troc),1-adamantyloxycarbonyl (Adoc), allyl, allyloxycarbonyl, trimethylsilyl,tert-butyl-dimethylsilyl, triethylsilyl (TES), triisopropylsilyl,trimethylsilylethoxymethyl (SEM), t-butoxycarbonyl (BOC), t-butyl,1-methyl-1,1-dimethylbenzyl, (phenyl)methyl benzene, pyridinyl, andpivaloyl.

As an example, the compound of Formula (1), or a salt or amorphous orpolymorph form thereof, can be prepared as shown in Scheme 1, whereinX¹, X², and R¹ are as defined above.

In some embodiments, reacting a compound of Formula (2), or a saltthereof, with a compound of Formula (4), or a salt thereof, to prepare acompound of Formula (5), or a salt thereof, is performed in the presenceof a palladium catalyst, a nickel catalyst, a tin catalyst, a coppercatalyst, or combinations thereof. In some embodiments, reacting acompound of Formula (2), or a salt thereof, with a compound of Formula(4), or a salt thereof, to prepare a compound of Formula (5), or a saltthereof, is performed in the presence of a palladium catalyst.

As used herein, the term “palladium catalyst” refers to a catalyst thatcontains palladium, such as Pd(0) and Pd(II), and any necessary ligandsrequired for the catalyst to react. The term “palladium catalyst” canalso refer to a palladium catalyst on a solid support.

As used herein, the term “nickel catalyst” refers to a catalyst thatcontains nickel, such as Ni(0) and Ni(II), and any necessary ligandsrequired for the catalyst to react. The term “nickel catalyst” can alsorefer to a nickel catalyst on a solid support.

As used herein, the term “copper catalyst” refers to a catalyst thatcontains copper, such as Cu(0) and Cu(II), and any necessary ligandsrequired for the catalyst to react. The term “copper catalyst” can alsorefer to a copper catalyst on a solid support.

In some embodiments, a compound of Formula (2), or a salt thereof, canbe converted into a more reactive intermediate prior to reacting with acompound of Formula (4), or a salt thereof. In some embodiments, acompound of Formula (2), or a salt thereof, can be converted into a morereactive intermediate via borylation prior to reacting with a compoundof Formula (4), or a salt thereof.

Reacting a compound of Formula (5), or a salt thereof, with a compoundof Formula (6), or a salt thereof, to prepare a compound of Formula (7),or a salt thereof, can be performed in the presence of Na₂SO₃, elementalsulfur, or a combination thereof. In some embodiments, reacting acompound of Formula (5), or a salt thereof, with a compound of Formula(6), or a salt thereof, to prepare a compound of Formula (7), or a saltthereof, is performed in the presence of Na₂SO₃. The Na₂SO₃ can beground Na₂SO₃. For example, the ground Na₂SO₃ can have a particle sizeof about 100 microns to about 300 microns or about 150 microns to about250 microns. In some embodiments, the ground Na₂SO₃ has a particle sizeof about 150 microns to about 250 microns. In some embodiments, reactingthe compound of Formula (5), or a salt thereof, with the compound ofFormula (6), or a salt thereof, to prepare the compound of Formula (7),or a salt thereof, is performed in the presence of SO₂.

Reacting a compound of Formula (5), or a salt thereof, with a compoundof Formula (6), or a salt thereof, to prepare the compound of Formula(7), or a salt thereof, can be performed in the presence of an organicsolvent. In some embodiments, the organic solvent isN-methyl-2-pyrrolidone, dimethylacetamide, n-butanol, or a combinationthereof. In some embodiments, reacting the compound of Formula (5), or asalt thereof, with the compound of Formula (6), or a salt thereof, toprepare the compound of Formula (7), or a salt thereof, is performed inthe presence of N-methyl-2-pyrrolidone.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed under an inertatmosphere. For example, the inert atmosphere can be a nitrogen (N₂)atmosphere or an argon atmosphere. In some embodiments, reacting thecompound of Formula (5), or a salt thereof, with the compound of Formula(6), or a salt thereof, to prepare the compound of Formula (7), or asalt thereof, is performed under a N₂ atmosphere.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed at atemperature of about 75° C. to about 150° C., about 100° C. to about120° C., or about 110° C. to about 115° C. In some embodiments, reactingthe compound of Formula (5), or a salt thereof, with the compound ofFormula (6), or a salt thereof, to prepare the compound of Formula (7),or a salt thereof, is performed at a temperature of about 100° C., 105°C., 110° C., 115° C., or about 120° C.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed for a time ofabout 5 hours to about 10 hours or about 7 hours to about 9 hours. Insome embodiments, reacting the compound of Formula (5), or a saltthereof, with the compound of Formula (6), or a salt thereof, to preparethe compound of Formula (7), or a salt thereof, is performed for a timeof about 5 hours, 6 hours, 7 hours, 8 hours, 9 hours, or about 10 hours.

Reacting a compound of Formula (5), or a salt thereof, with a compoundof Formula (6), or a salt thereof, to prepare a compound of Formula (7),or a salt thereof, can be performed at a temperature of about 75° C. toabout 150° C. or about 100° C. to about 120° C. for a time of about 5hours to about 10 hours. In some embodiments, reacting the compound ofFormula (5), or a salt thereof, with the compound of Formula (6), or asalt thereof, to prepare the compound of Formula (7), or a salt thereof,is performed at a temperature of about 110° C. to about 115° C. for atime of about 7 hours to about 9 hours.

In some embodiments, the process further includes preparing a salt ofthe compound of Formula (7) prior to deprotecting the compound ofFormula (7) to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof. In some embodiments, the processfurther includes preparing an oxalate salt, a citrate salt, or anacetate salt of the compound of Formula (7) prior to deprotecting thecompound of Formula (7), or the salt thereof, to prepare the compound ofFormula (1), or a salt or amorphous or polymorph form thereof. In someembodiments, the process further includes preparing an oxalate salt ofthe compound of Formula (7) prior to deprotecting the compound ofFormula (7), or the salt thereof, to prepare the compound of Formula(1), or salt or amorphous or polymorph form thereof.

Preparing a salt of a compound can include preparing the salt of thecompound from the free base form of the compound; for example byreacting the compound with an acid or preparing it from another salt, byanion exchange.

In some embodiments, the process further includes preparing a free baseform of the compound of Formula (7) prior to deprotecting the compoundof Formula (7) to prepare the compound of Formula (1), or salt oramorphous or polymorph form thereof.

In some embodiments, the process further includes precipitating thecompound of Formula (7), or a salt thereof, in an organic solvent priorto deprotecting the compound of Formula (7), or the salt thereof, toprepare the compound of Formula (1), or a salt or amorphous or polymorphform thereof. In some embodiments, the process further includesprecipitating the compound of Formula (7), or a salt thereof, in anon-polar organic solvent prior to deprotecting the compound of Formula(7), or the salt thereof, to prepare the compound of Formula (1), or asalt or amorphous or polymorph form thereof. In some embodiments, theorganic solvent is an aromatic hydrocarbon, such as benzene, toluene,and xylene, or an aliphatic organic solvent, such as hexane, heptane andoctane. In some embodiments, the process further includes precipitatingthe compound of Formula (7), or a salt thereof, in n-heptane prior todeprotecting the compound of Formula (7), or the salt thereof, toprepare the compound of Formula (1), or a salt or amorphous or polymorphform thereof.

In some embodiments, prior to deprotecting the compound of Formula (7),or a salt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof, the process further includes one ormore of: (a) preparing a salt of the compound of Formula (7); (b)preparing a free base form of the compound of Formula (7) from the saltof the compound of Formula (7); and (c) precipitating the free base formof the compound of Formula (7) in a non-polar organic solvent.

In some embodiments, prior to deprotecting a compound of Formula (7), ora salt thereof, to prepare a compound of Formula (1), or a salt oramorphous or polymorph form thereof, the process further includes one ormore of: (a) preparing an oxalate salt, a citrate salt, or an acetatesalt of a compound of Formula (7); (b) preparing a free base form of acompound of Formula (7) from the salt of a compound of Formula (7); and(c) precipitating the free base form of a compound of Formula (7) in analiphatic organic solvent such as hexane, heptane and octane.

In some embodiments, prior to deprotecting the compound of Formula (7),or a salt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof, the process further includes one ormore of: (a) preparing an oxalate salt of the compound of Formula (7);(b) preparing a free base form of the compound of Formula (7) from theoxalate salt of the compound of Formula (7); and (c) precipitating thefree base form compound of Formula (7) in n-heptane, prior todeprotecting the compound of Formula (7) to prepare the compound ofFormula (1), or a salt or amorphous or polymorph form thereof.

In some embodiments, the compound of Formula (7), or a salt thereof, isisolated prior to preparing the compound of Formula (1), or a salt oramorphous or polymorph form thereof. In some embodiments, the compoundof Formula (7), or a salt thereof, is isolated with a purity of greaterthan about 90%, 92%, 94%, 96%, 98%, or greater than about 99%. In someembodiments, the compound of Formula (7), or a salt thereof, is isolatedwith a purity of greater than about 99%. In some embodiments, the purityis determined by chromatography. In some embodiments, the purity isdetermined by high-performance liquid chromatography (HPLC) analysis.

Also provided herein is a process for preparing a compound of Formula(1):

including salts and amorphous and polymorph forms thereof. The processincludes:

(a) reacting a compound of Formula (2)

or salt thereof, wherein R¹ is a nitrogen protecting group, and X¹ is ahalide or a sulfonate (e.g., —Cl, —Br, —I, or —OTf), with a boronreagent to prepare a compound of Formula (3)

or salt thereof, wherein A is selected from the group consisting of aboronic acid, a boronic ester, a boronate, a borinate, a boranate, aboranamide, an N-coordinated boronate, and a trifluoroborate;

(b) reacting the compound of Formula (3), or the salt thereof, with acompound of Formula (4)

or salt thereof, wherein X² is a halide or a sulfonate (e.g., —Cl, —Br,—I, or —OTf); to prepare a compound of Formula (5)

or a salt thereof;

(c) reacting the compound of Formula (5), or the salt thereof, with acompound of Formula (6)

or a salt thereof, to prepare a compound of Formula (7)

or a salt thereof; and

(d) deprotecting the compound of Formula (7), or the salt thereof, toprepare the compound of Formula (1). In some embodiments, the processfurther comprises forming a salt of the compound of Formula (1). In someembodiments, the process further comprises forming a polymorph form ofthe compound of Formula (1) thereof. In some embodiments, the polymorphform of the compound of Formula (1) is Form 1. In some embodiments, thepolymorph form of the compound of Formula (1) is a non-stoichiometrichydrate of polymorph Form 1 having between 1% and about 20% by weightwater.

In some embodiments, a compound of Formula (1), or a salt or amorphousor polymorph form thereof, can be prepared as shown in Scheme 2, whereinX¹, X², A, and R¹ are as defined above.

In some embodiments, the nitrogen protecting group is an acetyl, benzyl,cumyl, benzhydryl, trityl, benzyloxycarbonyl (Cbz),9-fluorenylmethyloxycarbonyl (Fmoc), benzyloxymethyl (BOM),pivaloyl-oxy-methyl (POM), trichloroethoxycarbonyl (Troc),1-adamantyloxycarbonyl (Adoc), allyl, allyloxycarbonyl, trimethylsilyl,tert-butyl-dimethylsilyl, triethylsilyl (TES), triisopropylsilyl,trimethylsilylethoxymethyl (SEM), t-butoxycarbonyl (BOC), t-butyl,1-methyl-1,1-dimethylbenzyl, (phenyl)methyl benzene, pyridinyl, andpivaloyl. In some embodiments, the nitrogen protecting group is a trityl(triphenylmethyl) group.

In some embodiments, X¹ is selected from the group consisting of —Cl,—Br, —I, and —OTf. In some embodiments, X¹ is —OTf.

In some embodiments, X² is selected from the group consisting of —Cl,—Br, —I, and —OTf. In some embodiments, X² is —OTf.

In some embodiments, the nitrogen protecting group is not atetrahydropyran-2-yl.

In some embodiments, A is selected from the group consisting of:

where the wavy line indicates the point of attachment of A.

In some embodiments, A is

In some embodiments, X¹ is —Br. In some embodiments, X¹ is —I. In someembodiments, X¹ is not —I.

In some embodiments, X² is —Br. In some embodiments, X² is —I. In someembodiments, X² is not —I.

Reacting a compound of Formula (2), or a salt thereof, with the boronreagent to prepare a compound of Formula (3), or a salt thereof, can beperformed in the presence of a palladium catalyst. The palladiumcatalyst can be a Pd(0) catalyst. In some embodiments, the palladiumcatalyst is selected from the group consisting of palladium(II)acetate,Pd(dppf)Cl₂, Pd(dba)₂, tetrakis(triphenylphosphine)palladium(0),(MeCN)₂PdCl₂, and tris(dibenzylideneacetone)dipalladium(0). In someembodiments, the palladium catalyst is Pd(dppf)Cl₂.

In some embodiments, the ratio of molar equivalents of the palladiumcatalyst to the compound of Formula (2) is about 0.01:1 to about 0.1:1or about 0.02:1 to about 0.5:1. The ratio of molar equivalents of thepalladium catalyst to the compound of Formula (2) can be about 0.01:1,0.02:1, 0.03:1, 0.04:1, 0.05:1, or about 0.1:1. In some embodiments, theratio of molar equivalents of the palladium catalyst to the compound ofFormula (2) is 0.03:1.

In some embodiments, reacting a compound of Formula (2), or a saltthereof, with the boron reagent to prepare a compound of Formula (3), ora salt thereof, is performed in the presence of a polar aprotic solvent.In some embodiments, reacting a compound of Formula (2), or a saltthereof, with the boron reagent to prepare a compound of Formula (3) isperformed in the presence of N,N-dimethylformamide (DMF), 1,4-dioxane,N,N-dimethylacetamide, or combinations thereof.

Reacting a compound of Formula (2), or a salt thereof, with the boronreagent to prepare a compound of Formula (3), or a salt thereof, can beperformed at a temperature of about 80° C. to about 110° C., about 85°C. to about 100° C., or about 90° C. to about 95° C. For example,reacting the compound of Formula (2), or a salt thereof, with the boronreagent to prepare the compound of Formula (3), or a salt thereof, canbe performed at a temperature of about 80° C., 85° C., 90° C., 95° C.,100° C., 105° C., or about 110° C. In some embodiments, reacting thecompound of Formula (2), or a salt thereof, with the boron reagent toprepare the compound of Formula (3), or a salt thereof, is performed ata temperature of about 92° C.

Reacting a compound of Formula (2), or a salt thereof, with the boronreagent to prepare a compound of Formula (3) can be performed for a timeof about 10 hours to about 25 hours or about 16 hours to about 20 hours.For example, reacting the compound of Formula (2), or a salt thereof,with the boron reagent to prepare the compound of Formula (3), or a saltthereof, can be performed for a time of about 10 hours, 11 hours, 12hours, 13 hours, 14 hours, 15 hours, 16 hours, 17 hours, 18 hours, 19hours, 20 hours, 21 hours, 22 hours, 23 hours, 24 hours, or about 25hours. In some embodiments, the period of time is between about 15 hoursand about 25 hours.

In some embodiments, reacting a compound of Formula (2), or a saltthereof, with the boron reagent to prepare a compound of Formula (3), ora salt thereof, is performed at a temperature of about 80° C. to about110° C. for a time of about 15 hours to about 25 hours. In someembodiments, reacting the compound of Formula (2), or a salt thereof,with the boron reagent to prepare the compound of Formula (3), or a saltthereof, is performed at a temperature of about 85° C. to about 95° C.for a time of about 16 hours to about 20 hours.

Reacting a compound of Formula (3), or a salt thereof, with a compoundof Formula (4), or a salt thereof, to prepare a compound of Formula (5),or a salt thereof, can be performed in the presence of a palladiumcatalyst. In some embodiments, a Suzuki-Miyaura cross-coupling reactionis used to prepare the compound of Formula (5), or a salt thereof, fromthe compound of Formula (3), or a salt thereof, and Formula (4), or asalt thereof. In some embodiments, the palladium catalyst is selectedfrom the group consisting of PdCl₂(PPh₃)₂, Pd(t-Bu)₃, PdCl₂ dppf CH₂Cl₂,Pd(PPh₃)₄, Pd(OAc)/PPh₃, Cl₂Pd[(Pet₃)]₂, Pd(DIPHOS)₂, Cl₂Pd(Bipy), [PdCl(Ph₂PCH₂PPh₂)]₂, Cl₂Pd[P(o-tolyl)₃]₂, Pd₂(dba)₃/P(o-tolyl)₃,Pd₂(dba)/P(furyl)₃, Cl₂Pd[P(furyl)₃]₂, Cl₂Pd(PMePh₂)₂,Cl₂Pd[P(4-F-Ph)₃]₂, Cl₂Pd[P(C₆F₆)₃]₂, Cl₂Pd[P(2-COOH-Ph)(Ph)₂]₂,Pd[P(t-Bu)₃]₂, PdCl₂(dppe), PdCl₂(dppp), PdCl₂[PCy₃]₂, andCl₂Pd[P(4-COOH-Ph)(Ph)₂]₂. In some embodiments, the palladium catalystis Pd(PPh₃)₄.

The ratio of molar equivalents of the palladium catalyst to the compoundof Formula (3), or a salt thereof, can be about 0.01:1 to about 0.1:1 orabout 0.02:1 to about 0.5:1. The ratio of molar equivalents of thepalladium catalyst to the compound of Formula (3) or a salt thereof, canbe about 0.01:1, 0.02:1, 0.03:1, 0.04:1, 0.05:1, or about 0.1:1. In someembodiments, the ratio of molar equivalents of the palladium catalyst tothe compound of Formula (3) is 0.03:1.

Reacting a compound of Formula (3), or a salt thereof, with a compoundof Formula (4), or a salt thereof, can be performed in the presence of abase. In some embodiments, the base is selected from the groupconsisting of Na₂CO₃, Ba(OH)₂, K₃PO₄, Cs₂CO₃, K₂CO₃, TlOH, KF, CsF,KOtBu, NEt₃, Bu₄F, and NaOH. In some embodiments, the base is K₃PO₄. Theratio of base to the compound of Formula (4) can be about 0.5:1, 1:1,1.5:1, 2:1, 3.0:1, 4:1 or about 5:1. In some embodiments, the ratio ofbase to the compound of Formula (4), or a salt thereof, is about 3.0:1.

Reacting a compound of Formula (3), or a salt thereof, with a compoundof Formula (4), or a salt thereof, to prepare a compound of Formula (5),or a salt thereof, can be performed in the presence of an organicsolvent. In some embodiments, the organic solvent is selected from thegroup consisting of toluene, dimethylsulfoxide (DMSO), dimethylformamide(DMF), acetone, acetonitrile, 1,4-dioxane, dimethylacetamide (DMA),tetrahydrofuran (THF), and dimethoxyethane, or a combination thereof. Insome embodiments, reacting the compound of Formula (3), or a saltthereof, with the compound of Formula (4), or a salt thereof, to preparethe compound of Formula (5), or a salt thereof, is performed in thepresence of 1,4-dioxane. In some embodiments, reacting the compound ofFormula (3), or a salt thereof, with the compound of Formula (4), or asalt thereof, to prepare the compound of Formula (5), or a salt thereof,is performed in the presence 1,4-dioxane, DMA, THF, dimethoxyethane, ora combination thereof and water. In some embodiments, reacting thecompound of Formula (3), or a salt thereof, with the compound of Formula(4), or a salt thereof, to prepare the compound of Formula (5), or asalt thereof, is performed in the presence of 1,4-dioxane and water.

In some embodiments, reacting a compound of Formula (3), or a saltthereof, with a compound of Formula (4), or a salt thereof, to prepare acompound of Formula (5), or a salt thereof, is performed under an inertatmosphere. For example, the inert atmosphere can be a nitrogen (N₂)atmosphere or an argon atmosphere. In some embodiments, reacting thecompound of Formula (3), or a salt thereof, with the compound of Formula(4), or a salt thereof, to prepare the compound of Formula (5), or asalt thereof, is performed under an N₂ atmosphere.

In some embodiments, reacting the compound of Formula (3), or a saltthereof, with the compound of Formula (4), or a salt thereof, to preparethe compound of Formula (5), or a salt thereof, is performed at atemperature of about 70° C. to about 110° C., 80° C. to about 100° C.,or about 85° C. to about 95° C. In some embodiments, reacting thecompound of Formula (3), or a salt thereof, with the compound of Formula(4), or a salt thereof, to prepare the compound of Formula (5), or asalt thereof, is performed at a temperature of about 70° C., 80° C., 85°C., 90° C., 95° C., 100° C., or about 110° C. In some embodiments,reacting the compound of Formula (3), or a salt thereof, with thecompound of Formula (4), or a salt thereof, to prepare the compound ofFormula (5), or a salt thereof, is performed at a temperature of about90° C.

In some embodiments, reacting a compound of Formula (3), or a saltthereof, with a compound of Formula (4), or a salt thereof, to prepare acompound of Formula (5), or a salt thereof, is performed for a time ofabout 1 hour to about 5 hours or about 2 to about 3 hours. For example,reacting the compound of Formula (3), or a salt thereof, with thecompound of Formula (4), or a salt thereof, to prepare the compound ofFormula (5), or a salt thereof, can be performed for a time of about 1hour, 2 hours, 3 hours, 4 hours, or about 5 hours.

Reacting a compound of Formula (3) or a salt thereof, with a compound ofFormula (4), or a salt thereof, to prepare a compound of Formula (5), ora salt thereof, can be performed at a temperature of about 80° C. toabout 100° C. for a time of about 1 hour to about 5 hours. In someembodiments, reacting the compound of Formula (3), or a salt thereof,with the compound of Formula (4), or a salt thereof, to prepare thecompound of Formula (5), or a salt thereof, is performed at atemperature of about 85° C. to about 95° C. for a time of about 2 hoursto about 3 hours.

In some embodiments, the process further includes precipitating acompound of Formula (5), or a salt thereof, prior to reacting a compoundof Formula (5), or a salt thereof, with a compound of Formula (6), or asalt thereof, to prepare a compound of Formula (7), or a salt thereof.In some embodiments, the process further includes precipitating acompound of Formula (5) in water prior to reacting a compound of Formula(5) with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof.

In some embodiments, the process further includes preparing a salt of acompound of Formula (5) prior to reacting a compound of Formula (5), orthe salt thereof, with a compound of Formula (6), or a salt thereof, toprepare a compound of Formula (7), or a salt thereof. For example, theprocess can further include preparing an oxalate salt, citrate salt, oracetate salt of the compound of Formula (5) prior to reacting thecompound of Formula (5), or the salt thereof, with the compound ofFormula (6), or a salt thereof, to prepare the compound of Formula (7),or a salt thereof. In some embodiments, the process further includespreparing an oxalate salt of the compound of Formula (5) prior toreacting the compound of Formula (5), or the salt thereof, with thecompound of Formula (6), or a salt thereof, to prepare the compound ofFormula (7), or a salt thereof.

In some embodiments, the process can further include preparing a freebase form of a compound of Formula (5) prior to reacting a compound ofFormula (5) with a compound of Formula (6), or a salt thereof, toprepare a compound of Formula (7), or a salt thereof.

In some embodiments, the process further includes precipitating acompound of Formula (5), or a salt thereof, in an organic solvent priorto reacting a compound of Formula (5), or a salt thereof, with acompound of Formula (6), or a salt thereof, to prepare a compound ofFormula (7), or a salt thereof. In some embodiments, the process furtherincludes precipitating the compound of Formula (5), or a salt thereof,in a non-polar organic solvent prior to reacting the compound of Formula(5), or a salt thereof, with the compound of Formula (6), or a saltthereof, to prepare the compound of Formula (7), or a salt thereof. Insome embodiments, the non-polar organic solvent is an aromatichydrocarbon, such as benzene, toluene and xylene, or an aliphaticorganic solvent, such as hexane, heptane and octane. In someembodiments, the process further includes precipitating the compound ofFormula (5), or a salt thereof, in n-heptane prior to reacting thecompound of Formula (5), or a salt thereof, with the compound of Formula(6), or a salt thereof, to prepare the compound of Formula (7), or asalt thereof.

In some embodiments, prior to reacting a compound of Formula (5), or asalt thereof, with a compound of Formula (6), or a salt thereof, toprepare a compound of Formula (7), or a salt thereof, the processfurther includes one or more of: (a) precipitating the compound ofFormula (5); (b) preparing a salt of the compound of Formula (5) fromthe precipitated compound of Formula (5); (c) preparing a free base formof the compound of Formula (5) from the salt of the compound of Formula(5); and (d) precipitating the free base form of the compound of Formula(5).

In some embodiments, prior to reacting a compound of Formula (5), or asalt thereof, with a compound of Formula (6), or a salt thereof, toprepare a compound of Formula (7), or a salt thereof, the processfurther includes one or more of: (a) precipitating the compound ofFormula (5) in water; (b) preparing an oxalate salt, a citrate salt, oran acetate salt of the compound of Formula (5) from the precipitatedcompound of Formula (5); (c) preparing a free base form of the compoundof Formula (5) from the salt of the compound of Formula (5); and (d)precipitating the free base form of the compound of Formula (5) in anon-polar organic solvent. In some embodiments, the non-polar organicsolvent is an aliphatic organic solvent. In some embodiments, thealiphatic organic solvent is selected from the group consisting ofhexane, heptane and octane.

In some embodiments, prior to reacting a compound of Formula (5), or asalt thereof, with the compound of Formula (6), or a salt thereof, toprepare a compound of Formula (7), or a salt thereof, the processfurther includes one or more of: (a) precipitating the compound ofFormula (5) in water; (b) preparing an oxalate salt of the compound ofFormula (5) from the precipitated compound of Formula (5); (c) preparinga free base form of the compound of Formula (5) from the salt of thecompound of Formula (5); and (d) precipitating the free base form of thecompound of Formula (5) in n-heptane.

In some embodiments, a compound of Formula (5), or a salt thereof, isisolated prior to preparing a compound of Formula (7), or a saltthereof. In some embodiments, a compound of Formula (5), or a saltthereof, is isolated with a purity of greater than about 90%, 92%, 94%,96%, 98%, or greater than about 99%. In some embodiments, the compoundof Formula (5), or a salt thereof, can be isolated with a purity ofgreater than about 98%. In some embodiments, the purity is determined bychromatography. In some embodiments, the purity is determined byhigh-performance liquid chromatography (HPLC) analysis.

Reacting a compound of Formula (5), or a salt thereof, with a compoundof Formula (6), or a salt thereof, to prepare a compound of Formula (7),or a salt thereof, can be performed in the presence of Na₂SO₃, elementalsulfur, or a combination thereof. In some embodiments, reacting acompound of Formula (5), or a salt thereof, with a compound of Formula(6), or a salt thereof, to prepare a compound of Formula (7), or a saltthereof, is performed in the presence of Na₂SO₃. The Na₂SO₃ can beground Na₂SO₃. For example, the ground Na₂SO₃ can have a particle sizeof about 100 microns to about 300 microns. In some embodiments, theground Na₂SO₃ has a particle size of about 150 microns to about 250microns. In some embodiments, reacting the compound of Formula (5), or asalt thereof, with the compound of Formula (6), or a salt thereof, toprepare the compound of Formula (7), or a salt thereof, is performed inthe presence of SO₂.

Reacting a compound of Formula (5), or a salt thereof, with a compoundof Formula (6), or a salt thereof, to prepare a compound of Formula (7),or a salt thereof, can be performed in the presence of an organicsolvent. In some embodiments, the organic solvent is selected from thegroup consisting of N-methyl-2-pyrrolidone, dimethylacetamide,n-butanol, or a combination thereof. In some embodiments, reacting thecompound of Formula (5), or a salt thereof, with the compound of Formula(6), or a salt thereof, to prepare the compound of Formula (7), or asalt thereof, is performed in the presence of N-methyl-2-pyrrolidone.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed under an inertatmosphere. For example, the inert atmosphere can be a nitrogen (N₂)atmosphere or an argon atmosphere. In some embodiments, reacting thecompound of Formula (5), or a salt thereof, with the compound of Formula(6), or a salt thereof, to prepare the compound of Formula (7), or asalt thereof, is performed under an N₂ atmosphere.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed at atemperature of about 75° C. to about 150° C., about 100° C. to about120° C., or about 110° C. to about 115° C. For example, reacting thecompound of Formula (5), or a salt thereof, with the compound of Formula(6), or a salt thereof, to prepare the compound of Formula (7), or asalt thereof, can be performed at a temperature of about 100° C., 105°C., 110° C., 115° C., or about 120° C.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed for a time ofabout 5 hours to about 10 hours or about 7 hours to about 9 hours. Forexample, reacting the compound of Formula (5), or a salt thereof, withthe compound of Formula (6), or a salt thereof, to prepare the compoundof Formula (7), or a salt thereof, can be performed for a time of about5 hours, 6 hours, 7 hours, 8 hours, 9 hours, or about 10 hours.

Reacting the compound of Formula (5), or a salt thereof, with a compoundof Formula (6), or a salt thereof, to prepare a compound of Formula (7),or a salt thereof, can be performed at a temperature of about 75° C. toabout 150° C., such as about 100° C. to about 120° C., for a time ofabout 5 hours to about 10 hours. In some embodiments, reacting thecompound of Formula (5), or a salt thereof, with the compound of Formula(6), or a salt thereof, to prepare the compound of Formula (7), or asalt thereof, is performed at a temperature of about 110° C. to about115° C. for a time of about 7 hours to about 9 hours.

In some embodiments, the process further includes preparing a salt of acompound of Formula (7) prior to deprotecting a compound of Formula (7),or the salt thereof, to prepare the compound of Formula (1), or a saltthereof. For example, the process can further include preparing anoxalate salt, a citrate salt, or an acetate salt of the compound ofFormula (7) prior to deprotecting the compound of Formula (7), or thesalt thereof, to prepare the compound of Formula (1), or a salt thereof.In some embodiments, the process further includes preparing an oxalatesalt of the compound of Formula (7) prior to deprotecting the compoundof Formula (7), or the salt thereof, to prepare the compound of Formula(1), or a salt or amorphous or polymorph form thereof.

In some embodiments, the process further includes preparing a free baseform of a compound of Formula (7) prior to deprotecting a compound ofFormula (7), or a salt thereof, to prepare the compound of Formula (1),or a salt or amorphous or polymorph form thereof.

In some embodiments, the process further includes precipitating acompound of Formula (7), or a salt thereof, prior to deprotecting acompound of Formula (7), or a salt thereof, to prepare the compound ofFormula (1), or a salt thereof. In some embodiments, the process furtherincludes precipitating a compound of Formula (7), or a salt thereof, inan organic solvent prior to deprotecting a compound of Formula (7), or asalt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof. For example, the process canfurther include precipitating the compound of Formula (7), or a saltthereof, in a non-polar organic solvent prior to deprotecting thecompound of Formula (7), or a salt thereof, to prepare the compound ofFormula (1), or a salt or amorphous or polymorph form thereof. In someembodiments, the non-polar organic solvent is an aromatic hydrocarbon,such as benzene, toluene and xylene, or an aliphatic organic solvent,such as hexane, heptane and octane. In some embodiments, the processfurther includes precipitating the compound of Formula (7), or a saltthereof, in n-heptane prior to deprotecting the compound of Formula (7),or a salt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof.

In some embodiments, prior to deprotecting the compound of Formula (7),or a salt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof, the process further includes one ormore of: (a) preparing a salt of the compound of Formula (7); (b)preparing a free base form of the compound of Formula (7) from the saltof the compound of Formula (7); and (c) precipitating the free base formcompound of Formula (7) in a non-polar organic solvent.

In some embodiments, prior to deprotecting the compound of Formula (7),or a salt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof, the process further includes one ormore of: (a) preparing an oxalate salt, a citrate salt, or an acetatesalt of the compound of Formula (7); (b) preparing a free base form ofthe compound of Formula (7) from the salt of the compound of Formula(7); and (c) precipitating the free base form of the compound of Formula(7) in an aliphatic organic solvent, such as hexane, heptane and octane.

In some embodiments, prior to deprotecting the compound of Formula (7),or a salt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof, the process further includes one ormore of: (a) preparing an oxalate salt of the compound of Formula (7);(b) preparing a free base form of the compound of Formula (7) from theoxalate salt of the compound of Formula (7); and (c) precipitating thefree base form compound of Formula (7) in n-heptane.

In some embodiments, the compound of Formula (7), or a salt thereof, isisolated prior to preparing the compound of Formula (1), or a salt oramorphous or polymorph form thereof. In some embodiments, the compoundof Formula (7), or a salt thereof, is isolated with a purity of greaterthan about 90%, 92%, 94%, 96%, 98%, or greater than about 99%. In someembodiments, the compound of Formula (7), or a salt thereof, is isolatedwith a purity of greater than about 99%. In some embodiments, the purityis determined by chromatography. In some embodiments, the purity isdetermined by high-performance liquid chromatography (HPLC) analysis.

Also provided herein is a process for preparing a compound of Formula(1):

including salts and amorphous and polymorph forms thereof. The processincludes:

(a) reacting a compound of Formula (8)

or a salt thereof, with bis(pinacolato)diboron to produce a compound ofFormula (9)

or a salt thereof;

(b) reacting the compound of Formula (9), or the salt thereof, with acompound of Formula (10)

or a salt thereof, to prepare a compound of Formula (11)

or a salt thereof;

(c) reacting the compound of Formula (11), or the salt thereof, with acompound of Formula (6)

or a salt thereof, to prepare a compound of Formula (12)

or a salt thereof; and

(d) deprotecting the compound of Formula (12), or the salt thereof, toprepare the compound of Formula (1), or a salt or amorphous or polymorphform thereof.

In some embodiments, a compound of Formula (1), or a salt or amorphousor polymorph form thereof, is prepared as shown in Scheme 3.

In some embodiments, reacting the compound of Formula (8), or a saltthereof, with the boron reagent to prepare the compound of Formula (9),or a salt thereof, is performed in the presence of a palladium catalyst.The palladium catalyst can be selected from the group consisting ofpalladium(II)acetate, Pd(dppf)Cl₂, Pd(dba)₂,tetrakis(triphenylphosphine)palladium(0), (MeCN)₂PdCl₂, andtris(dibenzylideneacetone)dipalladium(0). In some embodiments, thepalladium catalyst is Pd(dppf)Cl₂.

The ratio of molar equivalents of the palladium catalyst to the compoundof Formula (8), or a salt thereof, can be about 0.01:1 to about 0.1:1 orabout 0.02:1 to about 0.5:1. The ratio of molar equivalents of thepalladium catalyst to the compound of Formula (8), or a salt thereof,can be about 0.01:1, 0.02:1, 0.03:1, 0.04:1, 0.05:1, or about 0.1:1. Insome embodiments, the ratio of molar equivalents of the palladiumcatalyst to the compound of Formula (8), or a salt thereof, is 0.03:1.

Reacting the compound of Formula (8), or a salt thereof, with the boronreagent to prepare the compound of Formula (9), or a salt thereof, canbe performed at a temperature of about 80° C. to about 110° C., about85° C. to about 100° C., or about 90° C. to about 95° C. For example,reacting the compound of Formula (8), or a salt thereof, with the boronreagent to prepare the compound of Formula (9), or a salt thereof, canbe performed at a temperature of about 80° C., 85° C., 90° C., 95° C.,100° C., 105° C., or about 110° C. In some embodiments, reacting thecompound of Formula (8), or a salt thereof, with the boron reagent toprepare the compound of Formula (9), or a salt thereof, is performed ata temperature of about 92° C.

Reacting the compound of Formula (8), or a salt thereof, with the boronreagent to prepare the compound of Formula (9), or a salt thereof, canbe performed for a time of about 15 hours to about 25 hours or about 16hours to about 20 hours. For example, reacting the compound of Formula(8), or a salt thereof, with the boron reagent to prepare the compoundof Formula (9), or a salt thereof, can be performed for a time of about15 hours, 16 hours, 17 hours, 18 hours, 19 hours, 20 hours, 21 hours, 22hours, 23 hours, 24 hours, or about 25 hours.

In some embodiments, reacting the compound of Formula (8), or a saltthereof, with the boron reagent to prepare the compound of Formula (9),or a salt thereof, is performed at a temperature of about 80° C. toabout 110° C. for a time of about 15 hours to about 25 hours. In someembodiments, reacting the compound of Formula (8), or a salt thereof,with the boron reagent to prepare the compound of Formula (9), or a saltthereof, is performed at a temperature of about 85° C. to about 95° C.for a time of about 16 hours to about 20 hours.

Reacting the compound of Formula (9), or a salt thereof, with thecompound of Formula (10), or a salt thereof, to prepare the compound ofFormula (11), or a salt thereof, can be performed in the presence of apalladium catalyst. In some embodiments, a Suzuki-Miyaura cross-couplingreaction is used to prepare the compound of Formula (11), or a saltthereof, from the compounds of Formula (9), or a salt thereof, andFormula (10), or a salt thereof. In some embodiments, the palladiumcatalyst is selected from the group consisting of PdCl₂(PPh₃)₂,Pd(t-Bu)₃, PdCl₂ dppf CH₂Cl₂, Pd(PPh₃)₄, Pd(OAc)/PPh₃, Cl₂Pd[(Pet₃)]₂,Pd(DIPHOS)₂, Cl₂Pd(Bipy), [PdCl (Ph₂PCH₂PPh₂)]₂, Cl₂Pd[P(o-tolyl)₃]₂,Pd₂(dba)₃/P(o-tolyl)₃, Pd₂(dba)/P(furyl)₃, Cl₂Pd[P(furyl)₃]₂,Cl₂Pd(PMePh₂)₂, Cl₂Pd[P(4-F-Ph)₃]₂, Cl₂Pd[P(C₆F₆)₃]₂,Cl₂Pd[P(2-COOH-Ph)(Ph)₂]₂, Pd[P(t-Bu)₃]₂, PdCl₂(dppe), PdCl₂(dppp),PdCl₂[PCy₃]₂, and Cl₂Pd[P(4-COOH-Ph)(Ph)₂]₂. In some embodiments, thepalladium catalyst is Pd(PPh₃)₄.

The ratio of molar equivalents of the palladium catalyst to the compoundof Formula (9), or a salt thereof, can be about 0.01:1 to about 0.1:1 orabout 0.02:1 to about 0.5:1. The ratio of molar equivalents of thepalladium catalyst to the compound of Formula (9), or a salt thereof,can be about 0.01:1, 0.02:1, 0.03:1, 0.04:1, 0.05:1, or about 0.1:1. Insome embodiments, the ratio of molar equivalents of the palladiumcatalyst to the compound of Formula (9), or a salt thereof, is 0.03:1.

In some embodiments, reacting the compound of Formula (9), or a saltthereof, with the compound of Formula (10), or a salt thereof, toprepare the compound of Formula (11), or a salt thereof, is performed inthe presence of a base. The base can be selected from the groupconsisting of Na₂CO₃, Ba(OH)₂, K₃PO₄, Cs₂CO₃, K₂CO₃, TlOH, KF, CsF,Bu₄F, and NaOH. In some embodiments, the base is K₃PO₄.

Reacting the compound of Formula (9), or a salt thereof, with thecompound of Formula (10), or a salt thereof, to prepare the compound ofFormula (11), or a salt thereof, can be performed in the presence of anorganic solvent. For example, the organic solvent can be toluene,dimethylsulfoxide (DMSO), dimethylformamide (DMF), acetone,acetonitrile, 1,4-dioxane, dimethylacetamide (DMA), tetrahydrofuran(THF), dimethoxyethane, or a combination thereof. In some embodiments,reacting the compound of Formula (9), or a salt thereof, with thecompound of Formula (10), or a salt thereof, to prepare the compound ofFormula (11), or a salt thereof, is performed in the presence of1,4-dioxane. In some embodiments, reacting the compound of Formula (9),or a salt thereof, with the compound of Formula (10), or a salt thereof,to prepare the compound of Formula (11), or a salt thereof, is performedin the presence 1,4-dioxane, DMA, THF, dimethoxyethane, or a combinationthereof and water. In some embodiments, reacting the compound of Formula(9), or a salt thereof, with the compound of Formula (10), or a saltthereof, to prepare the compound of Formula (11), or a salt thereof, isperformed in the presence of 1,4-dioxane and water.

In some embodiments, reacting the compound of Formula (9), or a saltthereof, with the compound of Formula (10), or a salt thereof, toprepare the compound of Formula (11), or a salt thereof, is performedunder an inert atmosphere. For example, the inert atmosphere can be anitrogen (N₂) atmosphere or an argon atmosphere. In some embodiments,reacting the compound of Formula (9), or a salt thereof, with thecompound of Formula (10), or a salt thereof, to prepare the compound ofFormula (11), or a salt thereof, is performed under a N₂ atmosphere.

In some embodiments, reacting the compound of Formula (9), or a saltthereof, with the compound of Formula (10), or a salt thereof, toprepare the compound of Formula (11), or a salt thereof, is performed ata temperature of about 70° C. to about 110° C., 80° C. to about 100° C.,or about 85° C. to about 95° C. For example, reacting the compound ofFormula (9), or a salt thereof, with the compound of Formula (10), or asalt thereof, to prepare the compound of Formula (11), or a saltthereof, can be performed at a temperature of about 70° C., 80° C., 85°C., 90° C., 95° C., 100° C., or about 110° C. In some embodiments,reacting the compound of Formula (9), or a salt thereof, with thecompound of Formula (10), or a salt thereof, to prepare the compound ofFormula (11), or a salt thereof, is performed at a temperature of about90° C.

Reacting the compound of Formula (9), or a salt thereof, with thecompound of Formula (10), or a salt thereof, to prepare the compound ofFormula (11), or a salt thereof, can be performed at a temperature ofabout 80° C. to about 100° C. for a time of about 1 hour to about 5hours. In some embodiments, reacting the compound of Formula (9), or asalt thereof, with the compound of Formula (10), or a salt thereof, toprepare the compound of Formula (11), or a salt thereof, is performed ata temperature of about 85° C. to about 95° C. for a time of about 2hours to about 3 hours.

In some embodiments, reacting the compound of Formula (9), or a saltthereof, with the compound of Formula (10), or a salt thereof, toprepare the compound of Formula (11), or a salt thereof, is performed inthe presence of a palladium catalyst and a base; under an inertatmosphere; and performed at a temperature of about 85° C. to about 95°C. for a time of about 2 hours to about 3 hours.

In some embodiments, the process further includes precipitating thecompound of Formula (11) in water prior to reacting the compound ofFormula (11), or a salt thereof, with the compound of Formula (6), or asalt thereof, to prepare the compound of Formula (12), or a saltthereof.

In some embodiments, the process further includes preparing a salt ofthe compound of Formula (11) prior to reacting the compound of Formula(11), or the salt thereof, with the compound of Formula (6), or a saltthereof, to prepare the compound of Formula (12), or a salt thereof. Forexample, the process can further include preparing an oxalate salt,citrate salt, or acetate salt of the compound of Formula (11) prior toreacting the compound of Formula (11), or the salt thereof, with thecompound of Formula (6), or a salt thereof, to prepare the compound ofFormula (12), or a salt thereof. In some embodiments, the processfurther includes preparing an oxalate salt of the compound of Formula(11), or a salt thereof, prior to reacting the compound of Formula (11),or a salt thereof, with the compound of Formula (6), or a salt thereof,to prepare the compound of Formula (12), or a salt thereof.

In some embodiments, the process further includes preparing a free baseform of the compound of Formula (11) prior to reacting the compound ofFormula (11) with the compound of Formula (6), or a salt thereof, toprepare the compound of Formula (12), or a salt thereof.

In some embodiments, the process further includes precipitating thecompound of Formula (11), or a salt thereof, in an organic solvent priorto reacting the compound of Formula (11), or a salt thereof, with thecompound of Formula (6), or a salt thereof, to prepare the compound ofFormula (12), or a salt thereof. For example, the process can furtherinclude precipitating the compound of Formula (11), or a salt thereof,in a non-polar organic solvent prior to reacting the compound of Formula(11), or a salt thereof, with the compound of Formula (6), or a saltthereof, to prepare the compound of Formula (12), or a salt thereof. Insome embodiments, the non-polar organic solvent is an aromatichydrocarbon, such as benzene, toluene and xylene, or an aliphaticorganic solvent, such as hexane, heptane and octane. In someembodiments, the process further includes precipitating the compound ofFormula (11), or a salt thereof, in n-heptane prior to reacting thecompound of Formula (11), or a salt thereof, with the compound ofFormula (6), or a salt thereof, to prepare the compound of Formula (12),or a salt thereof.

In some embodiments, prior to reacting the compound of Formula (11), ora salt thereof, with the compound of Formula (6), or a salt thereof, toprepare the compound of Formula (12), or a salt thereof, the processfurther includes one or more of: (a) precipitating the compound ofFormula (11) in water; (b) preparing a salt of the compound of Formula(11) from the precipitated compound of Formula (11); (c) preparing afree base form of the compound of Formula (11) from the salt of thecompound of Formula (11); and (d) precipitating the free base form ofthe compound of Formula (11) in a non-polar organic solvent prior toreacting the compound of Formula (11) with the compound of Formula (6),or a salt thereof, to prepare the compound of Formula (12), or a saltthereof.

In some embodiments, prior to reacting the compound of Formula (11), ora salt thereof, with the compound of Formula (6), or a salt thereof, toprepare the compound of Formula (12), or a salt thereof, the processfurther includes one or more of (a) precipitating the compound ofFormula (11) in water; (b) preparing an oxalate salt of the compound ofFormula (11) from the precipitated compound of Formula (11); (c)preparing a free base form of the compound of Formula (11) from the saltof the compound of Formula (11); and (d) precipitating the free baseform of the compound of Formula (11) in n-heptane.

In some embodiments, the compound of Formula (11), or a salt thereof, isisolated prior to preparing the compound of Formula (11), or a saltthereof. In some embodiments, the compound of Formula (11), or a saltthereof, is isolated with a purity of greater than about 90%, 92%, 94%,96%, 98%, or greater than about 99%. In some embodiments, the compoundof Formula (11), or a salt thereof, is isolated with a purity of greaterthan about 98%. In some embodiments, the purity is determined bychromatography. In some embodiments, the purity is determined byhigh-performance liquid chromatography (HPLC) analysis.

Reacting the compound of Formula (11), or a salt thereof, with thecompound of Formula (6), or a salt thereof, to prepare the compound ofFormula (12), or a salt thereof, can be performed in the presence ofNa₂SO₃, elemental sulfur, or a combination thereof. In some embodiments,reacting the compound of Formula (11), or a salt thereof, with thecompound of Formula (6), or a salt thereof, to prepare the compound ofFormula (12), or a salt thereof, is performed in the presence of Na₂SO₃.The Na₂SO₃ can be ground Na₂SO₃. For example, the ground Na₂SO₃ can havea particle size of about 100 microns to about 300 microns or about 150microns to about 250 microns. In some embodiments, the ground Na₂SO₃ hasa particle size of about 150 microns to about 250 microns. In someembodiments, reacting the compound of Formula (11), or a salt thereof,with the compound of Formula (6), or a salt thereof, to prepare thecompound of Formula (12), or a salt thereof, is performed in thepresence of SO₂.

Reacting the compound of Formula (11), or a salt thereof, with thecompound of Formula (6), or a salt thereof, to prepare the compound ofFormula (12), or a salt thereof, can be performed in the presence of anorganic solvent. In some embodiments, the organic solvent isN-methyl-2-pyrrolidone, dimethylacetamide, n-butanol, or a combinationthereof. In some embodiments, reacting the compound of Formula (11), ora salt thereof, with the compound of Formula (6), or a salt thereof, toprepare the compound of Formula (12), or a salt thereof, is performed inthe presence of N-methyl-2-pyrrolidone.

In some embodiments, reacting the compound of Formula (11), or a saltthereof, with the compound of Formula (6), or a salt thereof, to preparethe compound of Formula (12), or a salt thereof, is performed under aninert atmosphere. For example, the inert atmosphere can be a nitrogen(N₂) atmosphere or an argon atmosphere. In some embodiments, reactingthe compound of Formula (11), or a salt thereof, with the compound ofFormula (6), or a salt thereof, to prepare the compound of Formula (12),or a salt thereof, is performed under an N₂ atmosphere.

In some embodiments, reacting the compound of Formula (11), or a saltthereof, with the compound of Formula (6), or a salt thereof, to preparethe compound of Formula (12), or a salt thereof, is performed at atemperature of about 100° C. to about 120° C. or about 110° C. to about115° C. For example, reacting the compound of Formula (11), or a saltthereof, with the compound of Formula (6), or a salt thereof, to preparethe compound of Formula (12), or a salt thereof, can be performed at atemperature of about 100° C., 105° C., 110° C., 115° C., or about 120°C.

In some embodiments, reacting the compound of Formula (11), or a saltthereof, with the compound of Formula (6), or a salt thereof, to preparethe compound of Formula (12), or a salt thereof, is performed for a timeof about 5 hours to about 10 hours or about 7 hours to about 9 hours.For example, reacting the compound of Formula (11), or a salt thereof,with the compound of Formula (6), or a salt thereof, to prepare thecompound of Formula (12), or a salt thereof, can be performed for a timeof about 5 hours, 6 hours, 7 hours, 8 hours, 9 hours, or about 10 hours.

Reacting the compound of Formula (11), or a salt thereof, with thecompound of Formula (6), or a salt thereof, to prepare the compound ofFormula (12), or a salt thereof, can be performed at a temperature ofabout 75° C. to about 150° C., such as 100° C. to about 120° C., for atime of about 5 hours to about 10 hours. In some embodiments, reactingthe compound of Formula (11), or a salt thereof, with the compound ofFormula (6), or a salt thereof, to prepare the compound of Formula (12),or a salt thereof, is performed at a temperature of about 110° C. toabout 115° C. for a time of about 7 hours to about 9 hours.

In some embodiments, the process further includes preparing a salt ofthe compound of Formula (12) prior to deprotecting the compound ofFormula (12), or the salt thereof, to prepare the compound of Formula(1), or a salt thereof. For example, the process can further includepreparing an oxalate salt, a citrate salt, or an acetate salt of thecompound of Formula (12) prior to deprotecting the compound of Formula(12), or the salt thereof, to prepare the compound of Formula (1), or asalt or amorphous or polymorph form thereof. In some embodiments, theprocess further includes preparing an oxalate salt of the compound ofFormula (12) prior to deprotecting the compound of Formula (12), or thesalt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof.

In some embodiments, the process further includes preparing a free baseform of the compound of Formula (12) prior to deprotecting the compoundof Formula (12) to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof.

In some embodiments, the process further includes precipitating thecompound of Formula (12), or a salt thereof, in an organic solvent priorto deprotecting the compound of Formula (12), or a salt thereof, toprepare the compound of Formula (1), or a salt or amorphous or polymorphform thereof. For example, the process can further include precipitatingthe compound of Formula (12), or a salt thereof, in an organic solventprior to deprotecting the compound of Formula (12), or a salt thereof,to prepare the compound of Formula (1), or a salt or amorphous orpolymorph form thereof. In some embodiments, the process furtherincludes precipitating the compound of Formula (12), or a salt thereof,in n-heptane prior to deprotecting the compound of Formula (12), or asalt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof.

In some embodiments, prior to deprotecting the compound of Formula (12),or a salt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof, the process further includes one ormore of: (a) preparing a salt of the compound of Formula (12); (b)preparing a free base form of the compound of Formula (12) from the saltof the compound of Formula (12); and (c) precipitating the free baseform compound of Formula (12) in a non-polar organic solvent.

In some embodiments, prior to deprotecting the compound of Formula (12),or a salt thereof, to prepare the compound of Formula (1), or a salt oramorphous or polymorph form thereof, the process further includes one ormore of: (a) preparing an oxalate salt of the compound of Formula (12);(b) preparing a free base form of the compound of Formula (12) from theoxalate salt of the compound of Formula (12); and (c) precipitating thefree base form compound of Formula (12) in n-heptane.

In some embodiments, the compound of Formula (12), or a salt thereof, isisolated prior to preparing the compound of Formula (1), or a salt oramorphous or polymorph form thereof. In some embodiments, the compoundof Formula (12) or a salt thereof, is isolated with a purity of greaterthan about 90%, 92%, 94%, 96%, 98%, or greater than about 99%. In someembodiments, the compound of Formula (12), or a salt thereof, isisolated with a purity of greater than about 99%. In some embodiments,the purity is determined by chromatography. In some embodiments, thepurity is determined by high-performance liquid chromatography (HPLC)analysis.

In some embodiments, the process further includes preparing the compoundof Formula (8), or a salt thereof, by a process including protecting thecompound (14)

or a salt thereof, with a trityl group. The process can further includepreparing compound (14) from compound (13)

or a salt thereof, by reacting compound (13) with sodium nitrite toprepare the compound of Formula (14)

or a salt thereof.

In some embodiments, the process further includes preparing the compoundof Formula (8), or a salt thereof, by a process including: (i) reactinga compound of Formula (13)

or a salt thereof, with a nitrite to prepare the compound of Formula(14)

or a salt thereof; and (ii) protecting the compound of Formula (14), orthe salt thereof, with a trityl group to prepare the compound of Formula(8), or the salt thereof. In some embodiments, the nitrite is selectedfrom the group consisting of sodium nitrite, silver nitrite, calciumnitrite, and potassium nitrite.

For example, a compound of Formula (8), or a salt thereof, can beprepared as shown in Scheme 4.

In some embodiments, the process further includes preparing the compoundof Formula (10) by a process including: (i) reacting a compound ofFormula (15)

or a salt thereof, with a compound of Formula (20)

or a salt thereof, wherein X³ is a leaving group, to prepare a compoundof Formula (10), or the salt thereof.

For example, a compound of Formula (10) can be prepared as shown inScheme 5.

In some embodiments, X³ can be a halide. In some embodiments, X³ is —Cl.For example, the compound of Formula (20) can be isovaleryl chloride(i.e., where X³ is —Cl).

The ratio of molar equivalents of the compound of Formula (10), or asalt thereof, to the compound of Formula (20), or a salt thereof, can beat least 1:1, 1:1.1, 1:1.2, 1:1.3, 1:1.5, or at least 1:2. The ratio ofmolar equivalents of the compound of Formula (10), or a salt thereof, tothe compound of Formula (20), or a salt thereof, can be about 1:1,1:1.1, 1:1.2, 1:1.3, 1:1.5, or about 1:2. In some embodiments, the ratioof molar equivalents of the compound of Formula (10), or a salt thereof,to the compound of Formula (20), or a salt thereof, is about 1:1.3.

In some embodiments, the compound of Formula (6), or a salt thereof, isprepared by a process including: (i) reacting a compound of Formula (16)

or a salt thereof, with Bra to prepare a compound of Formula (17)

or a salt thereof; (ii) reacting the compound of Formula (17), or thesalt thereof, with a compound of Formula (18)

or a salt thereof, to prepare a compound of Formula (19)

or a salt thereof; and (iii) selectively reducing the nitro group of thecompound of Formula (19), or the salt thereof, to prepare a compound ofFormula (6), or the salt thereof.

For example, a compound of Formula (6), or a salt thereof, can beprepared as shown in Scheme 6.

Reacting the compound of Formula (17), or a salt thereof, with thecompound of Formula (18), or a salt thereof, to prepare the compound ofFormula (19), or a salt thereof, can be performed in the presence of apalladium catalyst. In some embodiments, reacting the compound ofFormula (17), or a salt thereof, with the compound of Formula (18), or asalt thereof, to prepare the compound of Formula (19), or a saltthereof, is carried out under an N₂ atmosphere. In some embodiments,reacting the compound of Formula (17), or a salt thereof, with thecompound of Formula (18), or a salt thereof, to prepare the compound ofFormula (19), or a salt thereof, further comprises a palladium catalystand is carried out under an N₂ atmosphere.

In some embodiments, deprotecting the compound of Formula (12), or asalt thereof, to prepare the compound of Formula (1), or a salt thereof,is performed in the presence of an acid. In some embodiments, the acidis TFA. The TFA can be neat TFA. In some embodiments, deprotecting thecompound of Formula (12), or a salt thereof, to prepare the compound ofFormula (1), or a salt thereof, is accomplished by hydrogenolysis.

Also provided herein is a process for preparing a compound of Formula(1)

including salts and amorphous and polymorph forms thereof. The processincludes: (a) reacting a compound of Formula (8)

or a salt thereof, with bis(pinacolato)diboron and Pd(dppf)Cl₂ toproduce a compound of Formula (9)

or a salt thereof; (b) reacting the compound of Formula (9), or the saltthereof, with a compound of Formula (10)

or a salt thereof, with Pd(PPh₃)₄ and K₃PO₄ to prepare a compound ofFormula (11)

or a salt thereof; (c) reacting the compound of Formula (11), or thesalt thereof, with a compound of Formula (6)

or a salt thereof, to prepare a compound of Formula (12)

or a salt thereof; and (d) deprotecting the compound of Formula (12), orthe salt thereof, to prepare the compound of Formula (1), whereindeprotecting the compound of Formula (12) to prepare the compound ofFormula (1) comprises reacting the compound of Formula (12) with TFA. Insome embodiments, the process further comprises forming a salt of thecompound of Formula (1). In some embodiments, the process furthercomprises forming a polymorph form of the compound of Formula (1). Insome embodiments, the polymorph form of the compound of Formula (1) isForm 1. In some embodiments, the polymorph form of the compound ofFormula (1) is a non-stoichiometric hydrate of polymorph Form 1 havingbetween 1% and about 20% by weight water.

In some embodiments, the ratio of molar equivalents of Pd(dppf)Cl₂ tothe compound of Formula (8), or a salt thereof, is about 0.01:1 to about0.1:1 or about 0.02:1 to about 0.5:1. For example, the ratio of molarequivalents of Pd(dppf)Cl₂ to the compound of Formula (8), or a saltthereof, can be about 0.01:1 to about 0.1:1. The ratio of Pd(dppf)Cl₂ tothe compound of Formula (8), or a salt thereof, can be about 0.01:1,0.02:1, 0.03:1, 0.04:1, 0.05:1, or about 0.1:1. In some embodiments, theratio of molar equivalents of Pd(dppf)Cl₂ to the compound of Formula(8), or a salt thereof, is about 0.03:1.

In some embodiments, the ratio of molar equivalents of Pd(PPh₃)₄ to thecompound of Formula (9), or a salt thereof, is about 0.01:1 to about0.1:1 or about 0.02:1 to about 0.5:1. For example, the ratio of molarequivalents of Pd(PPh₃)₄ to the compound of Formula (9), or a saltthereof, can be about 0.01:1 to about 0.1:1. The ratio of Pd(PPh₃)₄ tothe compound of Formula (9), or a salt thereof, can be about 0.01:1,0.02:1, 0.03:1, 0.04:1, 0.05:1, or about 0.1:1. In some embodiments, theratio of molar equivalents of Pd(PPh₃)₄ to the compound of Formula (9),or a salt thereof, is about 0.03:1.

Further provided herein is a process for preparing a compound of Formula(1)

including salts and amorphous and polymorph forms thereof. The processincludes reacting the compound of Formula (5)

or a salt thereof, with a compound of Formula (6)

or a salt thereof, wherein R¹ is a nitrogen protecting group, to preparea compound of Formula (7)

or a salt thereof.

In some embodiments, the nitrogen protecting group is an acetyl, benzyl,cumyl, benzhydryl, trityl, benzyloxycarbonyl (Cbz),9-fluorenylmethyloxycarbonyl (Fmoc), benzyloxymethyl (BOM),pivaloyl-oxy-methyl (POM), trichloroethoxycarbonyl (Troc),1-adamantyloxycarbonyl (Adoc), allyl, allyloxycarbonyl, trimethylsilyl,tert-butyl-dimethylsilyl, triethylsilyl (TES), triisopropylsilyl,trimethylsilylethoxymethyl (SEM), t-butoxycarbonyl (BOC), t-butyl,1-methyl-1,1-dimethylbenzyl, (phenyl)methyl benzene, pyridinyl, andpivaloyl. In some embodiments, the nitrogen protecting group is a tritylgroup.

In some embodiments, the nitrogen protecting group is not atetrahydropyran-2-yl.

In some embodiments, the process further includes deprotecting thecompound of Formula (7) or a salt thereof to prepare the compound ofFormula (1)

including salts and amorphous and polymorph forms thereof.

In some embodiments, the nitrogen protecting group is a trityl group anddeprotecting the compound of Formula (7), or a salt thereof, to preparethe compound of Formula (1), or a salt thereof, includes reacting thecompound of Formula (7), or a salt thereof, with TFA.

Also provided herein is a process for preparing a compound of Formula(1)

including salts and amorphous and polymorph forms thereof. The processincludes reacting a compound of Formula (2)

or a salt thereof, wherein X¹ is selected from the group consisting of—Cl, —Br, —I, and —OTf, and R¹ is an nitrogen protecting group, with aboron reagent to prepare a compound of Formula (3)

or a salt thereof, wherein A is selected from the group consisting of aboronic acid, a boronic ester, a boronate, a borinate, a boranate, aboranamide, an N-coordinated boronate, and a trifluoroborate.

In some embodiments, the nitrogen protecting group is selected from thegroup consisting of acetyl, benzyl, cumyl, benzhydryl, trityl,benzyloxycarbonyl (Cbz), 9-fluorenylmethyloxycarbonyl (Fmoc),benzyloxymethyl (BOM), pivaloyl-oxy-methyl (POM),trichloroethoxycarbonyl (Troc), 1-adamantyl oxycarbonyl (Adoc), allyl,allyloxycarbonyl, trimethyl silyl, tert-butyl-dimethyl silyl,triethylsilyl (TES), triisopropylsilyl, trimethylsilylethoxymethyl(SEM), t-butoxycarbonyl (BOC), t-butyl, 1-methyl-1, 1-dimethylbenzyl,(phenyl)methyl benzene, pyridinyl, and pivaloyl. In some embodiments,the nitrogen protecting group is a trityl.

In some embodiments, the nitrogen protecting group is not atetrahydropyran-2-yl.

In some embodiments, A is selected from the group consisting of:

In some embodiments, A is:

In some embodiments, X¹ is —Br. In some embodiments, X¹ is —I.

Reacting a compound of Formula (2), or a salt thereof, with the boronreagent to prepare a compound of Formula (3), or a salt thereof, can beperformed in the presence of a palladium catalyst. The palladiumcatalyst can be selected from the group consisting ofpalladium(II)acetate, Pd(dppf)Cl₂, Pd(dba)₂,tetrakis(triphenylphosphine)palladium(0), (MeCN)₂PdCl₂, andtris(dibenzylideneacetone)dipalladium(0). In some embodiments, thepalladium catalyst is Pd(dppf)Cl₂.

In some embodiments, the ratio of molar equivalents of the palladiumcatalyst to a compound of Formula (2), or a salt thereof, is about0.01:1 to about 0.1:1 or about 0.02:1 to about 0.5:1. The ratio of molarequivalents of the palladium catalyst to the compound of Formula (2), ora salt thereof, can be about 0.01:1, 0.02:1, 0.03:1, 0.04:1, 0.05:1, orabout 0.1:1. In some embodiments, the ratio of molar equivalents of thepalladium catalyst to the compound of Formula (2), or a salt thereof, is0.03:1.

In some embodiments, the process further includes isolating the compoundof Formula (3), or a salt thereof.

In some embodiments, the process further includes reacting the compoundof Formula (3), or the salt thereof, with a compound of Formula (4)

or a salt thereof, wherein X² is a leaving group; to prepare a compoundof Formula (5)

or a salt thereof.

In some embodiments, X² is selected from the group consisting of —Cl,—Br, —I, and —OTf. In some embodiments, X² is —Br.

In some embodiments, reacting a compound of Formula (3), or a saltthereof, with a compound of Formula (4), or a salt thereof, to prepare acompound of Formula (5), or a salt thereof, is performed in the presenceof a palladium catalyst. The palladium catalyst can be selected from thegroup consisting of PdCl₂(PPh₃)₂, Pd(t-Bu)₃, PdCl₂ dppf CH₂Cl₂,Pd(PPh₃)₄, Pd(OAc)/PPh₃, Cl₂Pd[(Pet₃)]₂, Pd(DIPHOS)₂, Cl₂Pd(Bipy), [PdCl(Ph₂PCH₂PPh₂)]₂, Cl₂Pd[P(o-tolyl)₃]₂, Pd₂(dba)₃/P(o-tolyl)₃,Pd₂(dba)/P(furyl)₃, Cl₂Pd[P(furyl)₃]₂, Cl₂Pd(PMePh₂)₂,Cl₂Pd[P(4-F-Ph)₃]₂, Cl₂Pd[P(C₆F₆)₃]₂, Cl₂Pd[P(2-COOH-Ph)(Ph)₂]₂,Pd[P(t-Bu)₃]₂, PdCl₂(dppe), PdCl₂(dppp), PdCl₂[PCy₃]₂, andCl₂Pd[P(4-COOH-Ph)(Ph)₂]₂. In some embodiments, the palladium catalystis Pd(PPh₃)₄.

The ratio of molar equivalents of the palladium catalyst to the compoundof Formula (3), or a salt thereof, can be about 0.01:1 to about 0.1:1 orabout 0.02:1 to about 0.5:1. The ratio of molar equivalents of thepalladium catalyst to the compound of Formula (3), or a salt thereof,can be about 0.01:1, 0.02:1, 0.03:1, 0.04:1, 0.05:1, or about 0.1:1. Insome embodiments, the ratio of molar equivalents of the palladiumcatalyst to the compound of Formula (3), or a salt thereof, is 0.03:1.

In some embodiments, reacting a compound of Formula (3), or a saltthereof, with a compound of Formula (4), or a salt thereof, is performedin the presence of a base. The base can be selected from the groupconsisting of Na₂CO₃, Ba(OH)₂, K₃PO₄, Cs₂CO₃, K₂CO₃, TlOH, KF, CsF,KOtBu, NEt₃, Bu₄F, and NaOH. In some embodiments, the base is K₃PO₄. Theratio of base to the compound of Formula (4), or a salt thereof, can beabout 0.5:1, 1:1, 1.5:1, 2:1, 3.0:1, 4:1 or about 5:1. In someembodiments, the ratio of base to the compound of Formula (4), or a saltthereof, is about 3.0:1. In some embodiments, the ratio K₃PO₄ to thecompound of Formula (4), or a salt thereof, is about 3.0:1.

Also provided herein is a process for preparing a compound of Formula(7)

or a salt thereof, wherein R¹ is a nitrogen protecting group. Theprocess includes reacting a compound of Formula (5)

or a salt thereof, with a compound of Formula (6)

or a salt thereof, to prepare a compound of Formula (7). In someembodiments, the process further comprises forming a salt of thecompound of Formula (7). In some embodiments, the process comprisesperforming the reaction between a compound of Formula (5) and a compoundof Formula (6) in the presence of an acid. In some embodiments, the acidis hydrochloric acid (HCl). In some embodiments, up to 1 molarequivalent of an acid (with respect to a compound of Formula (6)) isadded.

In some embodiments, the nitrogen protecting group is selected from thegroup consisting of acetyl, benzyl, cumyl, benzhydryl, trityl,benzyloxycarbonyl (Cbz), 9-fluorenylmethyloxycarbonyl (Fmoc),benzyloxymethyl (BOM), pivaloyl-oxy-methyl (POM),trichloroethoxycarbonyl (Troc), 1-adamantyl oxycarbonyl (Adoc), allyl,allyloxycarbonyl, trimethyl silyl, tert-butyl-dimethyl silyl,triethylsilyl (TES), triisopropylsilyl, trimethylsilylethoxymethyl(SEM), t-butoxycarbonyl (BOC), t-butyl, 1-methyl-1,1-dimethylbenzyl,(phenyl)methyl benzene, pyridinyl, and pivaloyl. In some embodiments,the nitrogen protecting group is a trityl.

In some embodiments, the nitrogen protecting group is not atetrahydropyran-2-yl.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed in the presenceof Na₂SO₃, elemental sulfur, or a combination thereof. In someembodiments, reacting the compound of Formula (5), or a salt thereof,with the compound of Formula (6), or a salt thereof, to prepare thecompound of Formula (7), or a salt thereof, is performed in the presenceof Na₂SO₃. In some embodiments, the Na₂SO₃ is ground Na₂SO₃. Forexample, the ground Na₂SO₃ can have a particle size of about 100 micronsto about 300 microns or about 150 microns to about 250 microns. In someembodiments, the ground Na₂SO₃ has a particle size of about 150 micronsto about 250 microns. In some embodiments, reacting the compound ofFormula (5), or a salt thereof, with the compound of Formula (6), or asalt thereof, to prepare the compound of Formula (7), or a salt thereof,is performed in the presence of SO₂.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed in the presenceof an organic solvent. In some embodiments, the organic solvent isN-methyl-2-pyrrolidone, dimethylacetamide, n-butanol, or a combinationthereof. In some embodiments, reacting the compound of Formula (5), or asalt thereof, with the compound of Formula (6), or a salt thereof, toprepare the compound of Formula (7), or a salt thereof, is performed inthe presence of N-methyl-2-pyrrolidone.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed under an inertatmosphere. For example, the inert atmosphere can be a nitrogen (N₂)atmosphere or an argon atmosphere. In some embodiments, reacting thecompound of Formula (5), or a salt thereof, with the compound of Formula(6), or a salt thereof, to prepare the compound of Formula (7), or asalt thereof, is performed under a N₂ atmosphere.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed at atemperature of about 75° C. to about 150° C., about 100° C. to about120° C., or about 110° C. to about 115° C. For example, reacting thecompound of Formula (5), or a salt thereof, with the compound of Formula(6), or a salt thereof, to prepare the compound of Formula (7), can beperformed at a temperature of about 100° C., 105° C., 110° C., 115° C.,or about 120° C.

In some embodiments, reacting a compound of Formula (5), or a saltthereof, with a compound of Formula (6), or a salt thereof, to prepare acompound of Formula (7), or a salt thereof, is performed for a time ofabout 5 hours to about 10 hours or about 7 hours to about 9 hours. Forexample, reacting the compound of Formula (5), or a salt thereof, withthe compound of Formula (6), or a salt thereof, to prepare the compoundof Formula (7), or a salt thereof, can be performed for a time of about5 hours, 6 hours, 7 hours, 8 hours, 9 hours, or about 10 hours.

Reacting a compound of Formula (5) or a salt thereof, with a compound ofFormula (6) or a salt thereof, to prepare a compound of Formula (7) or asalt thereof, can be performed at a temperature of about 75° C. to about150° C., about 100° C. to about 120° C. for a time of about 5 hours toabout 10 hours. For example, reacting the compound of Formula (5) or asalt thereof, with the compound of Formula (6) or a salt thereof, toprepare the compound of Formula (7) or a salt thereof, can be performedat a temperature of about 110° C. to about 115° C. for a time of about 7hours to about 9 hours.

Also provided herein is a process for preparing a compound of Formula(3)

or a salt thereof, wherein R¹ is a nitrogen protecting group and A isselected from the group consisting of a boronic acid, a boronic ester, aboronate, a borinate, a boranate, a boranamide, an N-coordinatedboronate, and a trifluoroborate. The process includes reacting acompound of Formula (2)

or a salt thereof, with a boron reagent to prepare a compound of Formula(3), or the salt thereof. In some embodiments, X¹ is selected from thegroup consisting of —Cl, —Br, —I, and —OTf.

In some embodiments, the nitrogen protecting group is selected from thegroup consisting of acetyl, benzyl, cumyl, benzhydryl, trityl,benzyloxycarbonyl (Cbz), 9-fluorenylmethyloxycarbonyl (Fmoc),benzyloxymethyl (BOM), pivaloyl-oxy-methyl (POM),trichloroethoxycarbonyl (Troc), 1-adamantyl oxycarbonyl (Adoc), allyl,allyloxycarbonyl, trimethylsilyl, tert-butyl-dimethyl silyl,triethylsilyl (TES), triisopropylsilyl, trimethyl silylethoxymethyl(SEM), t-butoxycarbonyl (BOC), t-butyl, 1-methyl-1, 1-dimethylbenzyl,(phenyl)methyl benzene, pyridinyl, and pivaloyl.

In some embodiments, the nitrogen protecting group is a trityl group.

In some embodiments, the nitrogen protecting group is not atetrahydropyran-2-yl.

In some embodiments, A is selected from the group consisting of:

wherein the wavy line indicates the point of attachment of A.

In some embodiments, A is

In some embodiments, X¹ is —Br. In some embodiments, X¹ is —I. In someembodiments, X¹ is not —I.

In some embodiments, X² is —Br. In some embodiments, X² is —I. In someembodiments, X² is not —I.

In some embodiments, reacting a compound of Formula (2), or a saltthereof, with the boron reagent to prepare a compound of Formula (3), ora salt thereof, can be performed in the presence of a palladiumcatalyst. In some embodiments, the palladium catalyst is a Pd(0)catalyst. In some embodiments, the palladium catalyst is selected fromthe group consisting of palladium(II)acetate, Pd(dppf)Cl₂, Pd(dba)₂,tetrakis(triphenylphosphine)palladium(0), (MeCN)₂PdCl₂, andtris(dibenzylideneacetone)dipalladium(0). In some embodiments, thepalladium catalyst is Pd(dppf)Cl₂.

In some embodiments, the ratio of molar equivalents of the palladiumcatalyst to the compound of Formula (2), or a salt thereof, is about0.01:1 to about 0.1:1 or about 0.02:1 to about 0.5:1. The ratio of molarequivalents of the palladium catalyst to the compound of Formula (2), ora salt thereof, can be about 0.01:1, 0.02:1, 0.03:1, 0.04:1, 0.05:1, orabout 0.1:1. In some embodiments, the ratio of molar equivalents of thepalladium catalyst to the compound of Formula (2), or a salt thereof, is0.03:1.

In some embodiments, reacting a compound of Formula (2), or a saltthereof, with the boron reagent to prepare a compound of Formula (3), ora salt thereof, is performed at a temperature of about 80° C. to about110° C., about 85° C. to about 100° C., or about 90° C. to about 95° C.In some embodiments, reacting the compound of Formula (2), or a saltthereof, with the boron reagent to prepare the compound of Formula (3)is performed at a temperature of about 80° C., 85° C., 90° C., 95° C.,100° C., 105° C., or about 110° C. Reacting the compound of Formula (2),or a salt thereof, with the boron reagent to prepare the compound ofFormula (3), or a salt thereof, can be performed at a temperature ofabout 92° C.

Reacting a compound of Formula (2), or a salt thereof, with the boronreagent to prepare a compound of Formula (3), or a salt thereof, can beperformed for a time of about 15 hours to about 25 hours or about 16hours to about 20 hours. For example, reacting the compound of Formula(2), or a salt thereof, with the boron reagent to prepare the compoundof Formula (3) can be performed for a time of about 15 hours, 16 hours,17 hours, 18 hours, 19 hours, 20 hours, 21 hours, 22 hours, 23 hours, 24hours, or about 25 hours.

In some embodiments, reacting a compound of Formula (2), or a saltthereof, with the boron reagent to prepare a compound of Formula (3), ora salt thereof, can be performed at a temperature of about 80° C. toabout 110° C. for a time of about 15 hours to about 25 hours. In someembodiments, reacting a compound of Formula (2), or a salt thereof, withthe boron reagent to prepare a compound of Formula (3), or a saltthereof, is performed at a temperature of about 85° C. to about 95° C.for a time of about 16 hours to about 20 hours.

In some embodiments, the process further includes isolating the compoundof Formula (3), or a salt thereof. In some embodiments, the compound ofFormula (3), or a salt thereof, is isolated by filtration.

Also provided herein is a process for preparing a compound of Formula(4)

or a salt thereof, wherein X² is selected from the group consisting of—Cl, —Br, —I, and —OTf. The process includes reacting a compound ofFormula (21)

or a salt thereof, wherein X² is as defined above, with a compound ofFormula (22)

wherein X⁴ is a leaving group, to prepare the compound of Formula (4),or a salt thereof. In some embodiments, the leaving group is a halide oran activated ester.

Also provided herein is a process for preparing a compound of Formula(5)

or a salt thereof, wherein R¹ is a nitrogen protecting group. Theprocess includes reacting the compound of Formula (3)

or the salt thereof, wherein A is selected from the group consisting ofa boronic acid, a boronic ester, a boronate, a borinate, a boranate, aboranamide, an N-coordinated boronate, and a trifluoroborate, with acompound of Formula (4)

or salt thereof, wherein X² is selected from the group consisting of—Cl, —Br, —I, and —OTf; to prepare the compound of Formula (5).

Also provide herein is a process for preparing a compound of Formula (1)

or a salt or amorphous or polymorph form thereof. The process includesdeprotecting a compound of Formula (12)

or a salt thereof, to prepare the compound of Formula (1). In someembodiments, the process further comprises forming a salt of thecompound of Formula (1). In some embodiments, the process furthercomprises forming a polymorph form of the compound of Formula (1). Insome embodiments, the polymorph is Form 1. In some embodiments, thepolymorph is a non-stoichiometric hydrate of polymorph Form 1 havingbetween 1% and about 20% by weight water.

Also provided herein is a process for preparing a polymorph form of acompound of Formula (1)

The process includes deprotecting a compound of Formula (12)

or a salt thereof, to prepare the compound of Formula (1), and preparinga polymorph form of the compound of Formula (1). In some embodiments,the polymorph form of the compound of Formula (1) is Form 1. In someembodiments, the polymorph form of the compound of Formula (1) is anon-stoichiometric hydrate of polymorph Form 1 having between 1% andabout 20% by weight water.

In some embodiments, deprotecting the compound of Formula (12) toprepare the compound of Formula (1) comprises reacting the compound ofFormula (12) with TFA to obtain a compound of Formula (1). In someembodiments, the process further comprises preparing a polymorph form ofthe compound of Formula (1). In some embodiments, the process comprisesconverting the compound of Formula (1) to a polymorph form. In someembodiments, the process comprises reslurrying a compound of Formula (I)or a composition comprising the compound of Formula (1) in a solvent ormixture of solvents to generate a polymorph form of the compound ofFormula (1) as a residual solid. In some embodiments, the compositioncomprises a non-stoichiometric hydrate of polymorph Form 1 havingbetween 1% and about 20% by weight water. In some embodiments, thereslurrying takes place at RT. In some embodiments, the reslurryingtakes place at around 50° C. In some embodiments, the process furthercomprises drying the residual solid, for example, under vacuum. In someembodiments, the drying is at a temperature of between about 60° C. and90° C., such as, e.g., around 75° C.

The compounds and intermediates provided herein, including saltsthereof, can be prepared using known organic synthesis techniques andcan be synthesized according to any of numerous possible syntheticroutes.

The reactions for preparing the compounds provided herein can be carriedout in suitable solvents which can be readily selected by one of skillin the art of organic synthesis. Suitable solvents can be substantiallynon-reactive with the starting materials (reactants), the intermediates,or products, at the temperatures at which the reactions are carried out,e.g., temperatures that can range from the solvent's freezingtemperature to the solvent's boiling temperature. A given reaction canbe carried out in one solvent or a mixture of more than one solvent.Depending on the particular reaction step, suitable solvents for aparticular reaction step can be selected by the skilled artisan.

Preparation of the compounds provided herein can involve the protectionand deprotection of various chemical groups. The chemistry of protectinggroups can be found, for example, in Protecting Group Chemistry, 1^(st)Ed., Oxford University Press, 2000; March's Advanced Organic Chemistry:Reactions, Mechanisms, and Structure, 6^(th) Ed., Wiley-IntersciencePublication, 2006; and Peturssion, S. et al., “Protecting Groups inCarbohydrate Chemistry,” J. Chem. Educ., 74(11), 1297 (1997) (each ofwhich is incorporated herein by reference in its entirety).

Reactions can be monitored according to any suitable method known in theart. For example, product formation can be monitored by spectroscopicmeans, such as nuclear magnetic resonance spectroscopy (e.g., ¹H or¹³C), infrared spectroscopy, spectrophotometry (e.g., UV-visible), massspectrometry, or by chromatographic methods such as high performanceliquid chromatography (HPLC), liquid chromatography-mass spectroscopy(LCMS), or thin layer chromatography (TLC). Compounds can be purified bythose skilled in the art by a variety of methods, including highperformance liquid chromatography (HPLC) (“Preparative LC-MSPurification: Improved Compound Specific Method Optimization” K. F.Blom, et al., J. Combi. Chem. 6(6), 874 (2004), which is incorporatedherein by reference in its entirety) and normal phase silicachromatography.

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 20:

where:

X³ is selected from the group consisting of —Cl, —Br, —I, —OH, and

wherein each R² is independently selected from alkyl or cycloalkyl.

In some embodiments of Formula 20, X³ is Cl.

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 20 has the structure of Formula 22:

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 21:

where:

X² is selected from the group consisting of —Cl, —Br, —I, and —OTf.

In some embodiments of Formula 21, X² is Br.

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 21 has the structure of Formula 15:

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 4:

where:

X² is selected from the group consisting of —Cl, —Br, —I, and —OTf.

In some embodiments of Formula 4, X² is Br.

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 4 has the structure of Formula 10:

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 23:

where:

X² is selected from the group consisting of —Cl, —Br, —I, and —OTf.

In some embodiments of Formula 23, X² is Br.

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 23 has the structure of Formula 17:

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 24:

where:

A is selected from the group consisting of a boronic acid, a boronicester, a boronate, a borinate, a boranate, a boranamide, anN-coordinated boronate, and a trifluoroborate.

In some embodiments of Formula 24, A is selected from the groupconsisting of:

wherein the wavy line indicates the point of attachment of A.

In some embodiments of Formula 24, A is

In some embodiments of Formula 24, A is

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 24 has the structure of Formula 18:

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 2:

where:

X¹ is selected from the group consisting of —Cl, —Br, —I, and —OTf; and

R¹ is selected from the group consisting of an acetyl, benzyl, cumyl,benzhydryl, trityl, benzyloxycarbonyl (Cbz), 9-fluorenylmethyloxycarbonyl (Fmoc), benzyloxymethyl (BOM), pivaloyl-oxy-methyl (POM),trichloroethoxycarbonyl (Troc), 1-adamantyloxycarbonyl (Adoc), allyl,allyloxycarbonyl, trimethylsilyl, tert-butyl-dimethylsilyl,triethylsilyl (TES), triisopropylsilyl, trimethylsilylethoxymethyl(SEM), t-butoxycarbonyl (BOC), t-butyl, 1-methyl-1,1-dimethylbenzyl,(phenyl)methyl benzene, pyridinyl, and pivaloyl.

In some embodiments of Formula 2, X¹ is Br.

In some embodiments of Formula 2, R¹ is a trityl group.

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 2 has the structure of Formula 8:

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 3:

where:

A is selected from the group consisting of a boronic acid, a boronicester, a boronate, a borinate, a boranate, a boranamide, anN-coordinated boronate, and a trifluoroborate; and

R¹ is selected from the group consisting of an acetyl, benzyl, cumyl,benzhydryl, trityl, benzyloxycarbonyl (Cbz), 9-fluorenylmethyloxycarbonyl (Fmoc), benzyloxymethyl (BOM), pivaloyl-oxy-methyl (POM),trichloroethoxycarbonyl (Troc), 1-adamantyloxycarbonyl (Adoc), allyl,allyloxycarbonyl, trimethylsilyl, tert-butyl-dimethylsilyl,triethylsilyl (TES), triisopropylsilyl, trimethylsilylethoxymethyl(SEM), t-butoxycarbonyl (BOC), t-butyl, 1-methyl-1,1-dimethylbenzyl,(phenyl)methyl benzene, pyridinyl, and pivaloyl.

In some embodiments of Formula 3, A is selected from the groupconsisting of:

wherein the wavy line indicates the point of attachment of A.

In some embodiments of Formula 3, A is

In some embodiments of Formula 3, A is

In some embodiments of Formula 3, R¹ is a trityl group.

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 3 has the structure of Formula 9:

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 5:

where:

R¹ is selected from the group consisting of an acetyl, benzyl, cumyl,benzhydryl, trityl, benzyloxycarbonyl (Cbz),9-fluorenylmethyloxycarbonyl (Fmoc), benzyloxymethyl (BOM),pivaloyl-oxy-methyl (POM), trichloroethoxycarbonyl (Troc),1-adamantyloxycarbonyl (Adoc), allyl, allyloxycarbonyl, trimethylsilyl,tert-butyl-dimethylsilyl, triethylsilyl (TES), triisopropylsilyl,trimethylsilylethoxymethyl (SEM), t-butoxycarbonyl (BOC), t-butyl,1-methyl-1,1-dimethylbenzyl, (phenyl)methyl benzene, pyridinyl, andpivaloyl.

In some embodiments of Formula 5, R¹ is a trityl group.

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 5 has the structure of Formula 11:

In some embodiments, provided herein is a compound, or apharmaceutically acceptable salt thereof, of Formula 7:

wherein:

R¹ is selected from the group consisting of an acetyl, benzyl, cumyl,benzhydryl, trityl, benzyloxycarbonyl (Cbz), 9-fluorenylmethyloxycarbonyl (Fmoc), benzyloxymethyl (BOM), pivaloyl-oxy-methyl (POM),trichloroethoxycarbonyl (Troc), 1-adamantyloxycarbonyl (Adoc), allyl,allyloxycarbonyl, trimethylsilyl, tert-butyl-dimethylsilyl,triethylsilyl (TES), triisopropylsilyl, trimethylsilylethoxymethyl(SEM), t-butoxycarbonyl (BOC), t-butyl, 1-methyl-1,1-dimethylbenzyl,(phenyl)methyl benzene, pyridinyl, and pivaloyl.

In some embodiments of Formula 7, R¹ is a trityl group.

In some embodiments, a compound, or a pharmaceutically acceptable saltthereof, of Formula 7 has the structure of Formula 12:

3. Process for Preparing Polymorph Forms of the Compound of Formula (1)

Provided is a process for preparing polymorph forms of the compound ofFormula (1):

The polymorph forms of the compound of Formula (1) include, e.g.,solvates, hydrates, non-stoichiometric hydrates, and non-solvated formsof the compound of Formula (1), including, for example, polymorph Forms1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, and 13.

One such polymorph is a polymorph known as Form 1. Form 1 is ananhydrous polymorph of the compound of Formula (I). In one embodiment,Form 1 has an X-ray powder diffraction (XRPD or XRD) pattern, obtainedwith CuKα1-radiation, with at least peaks at ° 2θ values of 6.8±0.2,12.4±0.2, and 18.5±0.2. In some embodiments, Form 1 has an XRPD patternwith at least peaks at ° 2θ values of 6.8±0.2, 12.4±0.2, 16.5±0.2,18.5±0.2, and 19.2±0.2. In some embodiments, Form 1 has an XRPD patternwith at least peaks at ° 2θ values of 6.8±0.2, 9.3±0.2, 12.4±0.2,13.9±0.2, 16.5±0.2, 18.5±0.2, 19.2±0.2, and 24.6±0.2. For example, insome embodiments, Form 1 has an XRPD pattern with at least peaks at ° 2θvalues of 6.8±0.2, 9.3±0.2, 12.4±0.2, 13.9±0.2, 14.5±0.2, 16.5±0.2,18.5±0.2, 19.2±0.2, 20.3±0.2, and 24.6±0.2.

In some embodiments, a composition comprising polymorph Form 1 issubstantially pure. For example, the composition has a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than about 15%by weight of other forms of the compound of Formula (1). For example,the composition can contain less than 14%, 13%, 12%, 11%, 10%, 9%, 8%,7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weight of other anhydrous forms ofthe compound of Formula (1). In some embodiments, the compositioncontains less than about 15% by weight of the polymorph Form 9. Forexample, the composition can contain less than 14%, 13%, 12%, 11%, 10%,9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weight of the polymorph ofForm 9. In some embodiments, the composition contains less than about15% by weight of one or more other forms of the compound of Formula (1),such as less than 14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%,2%, 1% or less by weight of one or more other forms of the compound ofFormula (1). For example, the composition can contain less than about15% of Form 2, Form 3, Form 4, Form 5, Form 6, Form 7, Form 8, Form 9,Form 10, Form 11, a non-stoichiometric hydrate of Form 1 having between1% and about 20% by weight water, or a combination of two or morethereof. In some embodiments, the composition contains less than 1% byweight water.

In some embodiments, polymorph Form 1 exhibits an endotherm betweenabout 50-100° C. as measured by differential scanning calorimetry (DSC)related to sorbed water. In some embodiments, polymorph Form 1 exhibitsa recrystallization event that is observed between about 270-290° C.,e.g., around 280° C. In some embodiments, the endotherm and exotherm areobserved when using a scan rate of 10° C. per minute.

In some embodiments, polymorph Form 1 recrystallizes into polymorph Form9 with a melting point of around 363° C. In some embodiments, polymorphForm 1 undergoes a total mass loss of about 0.33% before around 100° C.,e.g., from about 39° C. to about 100° C., as measured by thermalgravimetric analysis (TGA).

Provided herein is a process of preparing polymorph Form 1. In someembodiments, the process comprises drying a composition comprising thecompound of Formula (1), including amorphous and polymorph formsthereof, to generate polymorph Form 1. In some embodiments, thecomposition comprises a non-stoichiometric hydrate of polymorph Form 1having between 1% and about 20% by weight water. In some embodiments,the process comprises reslurrying a composition comprising the compoundof Formula (1), including amorphous and polymorph forms thereof, in asolvent or mixture of solvents to generate polymorph Form 1 as aresidual solid. In some embodiments, the reslurrying takes place at roomtemperature (RT). In some embodiments, the reslurrying takes place ataround 50° C. In some embodiments, the process further comprises dryingthe residual solid, for example, under vacuum. In some embodiments, thedrying is at a temperature of between about 60° C. and 90° C., such as,e.g., around 75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising the compound of Formula (1), including amorphous andpolymorph forms thereof, in a solvent or mixture of solvents to generatepolymorph Form 1 as a residual solid. In some embodiments, the compoundof Formula (1) is a non-stoichiometric hydrate of polymorph Form 1having between 1% and about 20% by weight water. In some embodiments,the solvent is methanol. In some embodiments, the solvent is toluene. Insome embodiments, the solvent is heptane. In some embodiments, thesolvent is dichloromethane (DCM). In some embodiments, the solvent iswater. In some embodiments, the solvent is in a mixture with water, forexample the solvent can be a mixture of water and acetonitrile,methanol, ethyl acetate (EA), methyl tert-butyl ether (MtBE), isopropylalcohol (IPAc), methyl acetate (MA), methyl isobutyl ketone (MIBK), DCM,n-butyl acetate, heptane, toluene, or n-butanol. In some embodiments,the water is present in an amount of about 5% by weight. In someembodiments, the reslurrying takes place at room temperature. In someembodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a non-stoichiometric hydrate of polymorph Form 1 having between 1%and about 20% by weight water. In some embodiments, for example, above30% relative humidity (RH), Form 1 readily sorbs water and shows adistinctive shift in Form 1 peaks from 6.8±0.2 to 6.2±0.2 and 12.6±0.2to 11±0.2. In some embodiments, a non-stoichiometric hydrate of Form 1comprises up to about 20% by weight water. For example, up to about 20%,about 19%, about 18%, about 17%, about 16%, about 15%, about 14%, about13%, about 12%, about 11%, about 10%, about 9%, about 8%, about 7%,about 6%, about 5%, about 4%, about 3%, about 2%, or greater than 1%water by weight. In some embodiments, a non-stoichiometric hydrate ofForm 1 has between 1 to about 20% water by weight, e.g., between 1% andabout 10%, about 5% and about 15%, about 10% and about 20%, 1% and about5%, about 5% and about 10%, about 10% and about 15%, about 15% and about20%, or about 17% and about 20% water by weight.

In some embodiments, a composition comprising a non-stoichiometrichydrate of polymorph Form 1 having between 1% and about 20% by weightwater is substantially pure. For example, the composition can have apurity of at least about 90%. In some embodiments, the composition has apurity of at least about 95%. In some embodiments, the composition has apurity of at least about 98%. For example, the composition can have apurity of at least 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%,99.3%, 99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments,the composition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of anhydrous forms of the compound of Formula (1). Insome embodiments, the composition contains less than 15% by weight ofother forms of the compound of Formula (1), such as less than 14%, 13%,12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weight ofother forms of the compound of Formula (1) (e.g., anhydrous forms of thecompound of Formula (1)). In some embodiments, the composition containsless than 20% by weight of polymorph Form 9 having X-ray powderdiffraction pattern comprising peaks at ° 2θ values of 4.9±0.2,18.6±0.2, and 21.1±0.2. For example, the composition contains less than15% by weight of Form 9, such as less than 14%, 13%, 12%, 11%, 10%, 9%,8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weight of other forms of thecompound of Form 9. In some embodiments, the composition contains lessthan 15% of one or more other forms of the compound of Formula (1), suchas less than 14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%or less of one or more other forms of the compound of Formula (1). Forexample, the composition can contain less than about 15% of Form 1, Form2, Form 3, Form 4, Form 5, Form 6, Form 7, Form 8, Form 9, Form 10, Form11, or a combination of two or more thereof.

One example of a non-stoichiometric hydrate of polymorph Form 1 isreferred to as Form 12.

In one embodiment, provided herein is a polymorph Form 12 having an XRPDpattern, obtained with CuKα1-radiation, with at least peaks at ° 2θpositions 6.4±0.2, 11.0±0.2, and 18.4±0.2. In some embodiments, Form 12has an XRPD pattern with at least peaks at ° 20 positions 6.4±0.2,9.2±0.2, 11.0±0.2, 18.4±0.2, and 19.7±0.2. In some embodiments, Form 12has an XRPD pattern with at least peaks at ° 2θ positions 6.4±0.2,9.2±0.2, 11.0±0.2, 15.6±0.2, 18.4±0.2, 19.7±0.2, 24.4±0.2, and 25.2±0.2.For example, in some embodiments, Form 12 has an XRPD pattern with atleast peaks at ° 2θ positions 6.4±0.2, 9.2±0.2, 11.0±0.2, 15.6±0.2,16.1±0.2, 18.4±0.2, 19.7±0.2, 20.8±0.2, 24.4±0.2, and 25.2±0.2.

In some embodiments, provided herein is polymorph Form 12 that exhibitsan endotherm between about 50-100° C. as measured by DSC. In someembodiments, polymorph Form 12 exhibits an exotherm at around 283° C. Insome embodiments, the endotherms and exotherms are observed when using ascan rate of 10° C. per minute.

In some embodiments, provided herein is polymorph Form 12 that has amelting point of around 364° C. In some embodiments, polymorph Form 12undergoes a weight loss of about 1.4% before around 100° C., e.g., fromabout 30° C. to about 100° C., as measured by TGA.

Another example of a non-stoichiometric hydrate of polymorph Form 1 isreferred to as Form 13.

In one embodiment, polymorph Form 13 has an XRPD pattern, obtained withCuKα1-radiation, with at least peaks at ° 2θ values of 6.4±0.2,11.0±0.2, and 18.4±0.2. In some embodiments, Form 13 has an XRPD patternwith at least peaks at ° 2θ values of 6.4±0.2, 9.2±0.2, 11.0±0.2,18.4±0.2, and 19.7±0.2. In some embodiments, Form 13 has an XRPD patternwith at least peaks at ° 2θ values of 6.4±0.2, 9.2±0.2, 11.0±0.2,15.6±0.2, 18.4±0.2, 19.7±0.2, 24.4±0.2, and 25.2±0.2. For example, insome embodiments, Form 13 has an XRPD pattern with at least peaks at °2θ values of 6.4±0.2, 9.2±0.2, 11.0±0.2, 15.6±0.2, 16.1±0.2, 18.4±0.2,19.7±0.2, 20.8±0.2, 24.4±0.2, and 25.2±0.2.

In some embodiments, polymorph Form 13 exhibits an endotherm betweenabout 50-100° C. as measured by DSC. In some embodiments, polymorph Form13 exhibits an exotherm at between about 265-285° C., e.g., around 278°C. For example, in some embodiments, the endotherms and exotherms areobserved when using a scan rate of 10° C. per minute.

In some embodiments, polymorph Form 13 has a melting point of around363° C. In some embodiments, polymorph Form 13 undergoes a weight lossof about 1.9% before around 100° C. as measured by TGA.

Provided herein are methods of preparing a non-stoichiometric hydrate ofpolymorph Form 1. In some embodiments, the method comprises reslurryinga composition comprising the compound of Formula (I), includingamorphous and polymorph forms thereof, in a solvent or mixture ofsolvents to generate a non-stoichiometric hydrate of polymorph Form 1 asa residual solid. In some embodiments, the composition comprising thecompound of Formula (I) is a mixture of a non-stoichiometric hydrate ofpolymorph Form 1 and Form 1. In some embodiments, the reslurrying takesplace at RT. In some embodiments, the reslurrying takes place at around50° C. In some embodiments, the method further comprises drying theresidual solid, for example, under vacuum. In some embodiments, thedrying is at a temperature of between about 60° C. and 90° C., such as,e.g., around 75° C.

In some embodiments, the method comprises reslurrying a compositioncomprising a mixture of a non-stoichiometric hydrate of polymorph Form 1and Form 1 in a solvent or mixture of solvents to generate anon-stoichiometric hydrate of polymorph Form 1 as a residual solid. Insome embodiments, the solvent is in a mixture with water, for examplethe solvent can be a mixture of water and acetonitrile, methanol, MtBE,MA, MIBK, DCM, IPAc, n-butyl acetate, heptane, toluene, or n-butanol. Insome embodiments, the water is present in an amount of about 5% byweight. In some embodiments, the reslurrying takes place at RT. In someembodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 2. Form 2 is an anhydrous polymorph of thecompound of Formula (1). In one embodiment, polymorph Form 2 has an XRPDpattern, obtained with CuKα1-radiation, with at least peaks at ° 2θvalues of 7.0±0.2, 21.5±0.2, and 22.0±0.2. In some embodiments, Form 2has an XRPD pattern with at least peaks at ° 2θ values of 7.0±0.2,18.9±0.2, 21.5±0.2, 22.0±0.2, and 24.2±0.2. In some embodiments, Form 2has an XRPD pattern with at least peaks at ° 2θ values of 7.0±0.2,14.1±0.2, 18.9±0.2, 19.2±0.2, 21.5±0.2, 22.0±0.2, 24.2±0.2, and26.4±0.2. For example, in some embodiments, Form 2 has an XRPD patternwith at least peaks at ° 2θ values of 7.0±0.2, 10.4±0.2, 14.1±0.2,17.6±0.2, 18.9±0.2, 19.2±0.2, 21.5±0.2, 22.0±0.2, 24.2±0.2, and26.4±0.2.

In some embodiments, a composition comprising polymorph Form 2 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 3, Form4, Form 5, Form 6, Form 7, Form 8, Form 9, Form 10, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 2 exhibits an endotherm betweenabout 50-100° C. as measured by DSC. In some embodiments, polymorph Form2 exhibits an endotherm between about 220-230° C. In some embodiments,polymorph Form 2 exhibits an exotherm between about 233-238° C. In someembodiments, polymorph Form 2 exhibits an exotherm between about290-295° C. In some embodiments, the endotherms and exotherms areobserved when using a scan rate of 10° C. per minute.

In some embodiments, polymorph Form 2 has a melting point of around 363°C. In some embodiments, polymorph Form 2 undergoes a weight loss ofabout 2.7% before around 116° C., e.g., from about 36° C. to about 116°C., as measured by TGA.

Provided herein is a process of preparing polymorph Form 2. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 2 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of polymorph Form 1 having between 1% andabout 20% by weight water. In some embodiments, the reslurrying takesplace at RT. In some embodiments, the reslurrying takes place at around50° C. In some embodiments, the process further comprises drying theresidual solid, for example, under vacuum. In some embodiments, thedrying is at a temperature of between about 60° C. and 90° C., such as,e.g., around 75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of polymorph Form 1 havingbetween 1% and about 20% by weight water in a solvent or mixture ofsolvents to generate polymorph Form 2 as a residual solid. In someembodiments, the solvent is acetonitrile. In some embodiments, thesolvent is ethanol. In some embodiments, the solvent is in a mixturewith water, for example the solvent can be a mixture of water andethanol or water and n-propanol. In some embodiments, the water ispresent in an amount of about 5% by weight. In some embodiments, thereslurrying takes place at RT. In some embodiments, the reslurryingtakes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 3. Form 3 is an anhydrous polymorph of thecompound of Formula (1). In one embodiment, polymorph Form 3 has an XRPDpattern, obtained with CuKα1-radiation, with at least peaks at ° 2θvalues of 7.2±0.2, 22.2±0.2, and 24.4±0.2. In some embodiments, Form 3has an XRPD pattern with at least peaks at ° 2θ values of 6.3±0.2,7.2±0.2, 21.6±0.2, 22.2±0.2, and 24.4±0.2. In some embodiments, Form 3has an XRPD pattern with at least peaks at ° 2θ values of 6.3±0.2,7.2±0.2, 11.0±0.2, 18.4±0.2, 19.0±0.2, 21.6±0.2, 22.2±0.2, and 24.4±0.2.For example, in some embodiments, Form 3 has an XRPD pattern with atleast peaks at ° 2θ values of 6.3±0.2, 7.2±0.2, 11.0±0.2, 14.2±0.2,17.8±0.2, 18.4±0.2, 19.0±0.2, 21.6±0.2, 22.2±0.2, and 24.4±0.2.

In some embodiments, a composition comprising polymorph Form 3 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form4, Form 5, Form 6, Form 7, Form 8, Form 9, Form 10, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 3 exhibits an exotherm between about190-220° C., as measured by DSC. In some embodiments, polymorph Form 3exhibits an exotherm at between about 225-235° C., e.g., around 230° C.,as measured by DSC. In some embodiments, polymorph Form 3 exhibits anexotherm at between about 292-300° C., e.g., around 297° C., as measuredby DSC. For example, in some embodiments, the endotherms and exothermsare observed when using a scan rate of 10° C. per minute.

In some embodiments, polymorph Form 3 has a melting point of around 365°C. In some embodiments, polymorph Form 3 undergoes a weight loss ofabout 1.6% before around 81° C. and a weight loss of about 1.7% betweenabout 81-169° C. as measured by TGA.

Provided herein is a process of preparing polymorph Form 3. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 3 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 3 as a residual solid. In some embodiments, thesolvent is IPAc. In some embodiments, the solvent is n-butyl acetate. Insome embodiments, the reslurrying takes place at RT. In someembodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 4. Form 4 is an anhydrous polymorph of thecompound of Formula (1). In one embodiment, polymorph Form 4 has an XRPDpattern, obtained with CuKα1-radiation, with at least peaks at ° 2θvalues of 7.0±0.2, 21.8±0.2, and 25.1±0.2. In some embodiments, Form 4has an XRPD pattern with at least peaks at ° 2θ values of 7.0±0.2,19.5±0.2, 21.8±0.2, 23.2±0.2, and 25.1±0.2. In some embodiments, Form 4has an XRPD pattern with at least peaks at ° 2θ values of 7.0±0.2,17.6±0.2, 18.3±0.2, 19.5±0.2, 21.8±0.2, 23.2±0.2, 25.1±0.2, and25.8±0.2. For example, in some embodiments, Form 4 has an XRPD patternwith at least peaks at ° 2θ values of 7.0±0.2, 9.6±0.2, 17.6±0.2,18.3±0.2, 19.5±0.2, 21.8±0.2, 23.2±0.2, 25.1±0.2, 25.8±0.2, and29.3±0.2.

In some embodiments, a composition comprising polymorph Form 4 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form3, Form 5, Form 6, Form 7, Form 8, Form 9, Form 10, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 4 exhibits an endotherm betweenabout 50-100° C. as measured by DSC. In some embodiments, polymorph Form4 exhibits an endotherm at between about 180-215° C. In someembodiments, polymorph Form 4 exhibits an endotherm between about220-230° C. In some embodiments, polymorph Form 4 exhibits an exothermat between about 230-240° C., e.g., around 235° C. In some embodiments,polymorph Form 4 exhibits an exotherm at between about 300-310° C. Forexample, in some embodiments, the endotherms and exotherms are observedwhen using a scan rate of 10° C. per minute.

In some embodiments, polymorph Form 4 has a melting point of betweenabout 366-369° C., e.g., around 367° C. In some embodiments, polymorphForm 4 undergoes a weight loss of about 8.3% before around 200° C.,e.g., from about 42° C. to about 200° C., as measured by TGA.

Provided herein is a process of preparing polymorph Form 4. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 4 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 4 as a residual solid. In some embodiments, thesolvent is EA. In some embodiments, the solvent is MA. In someembodiments, the solvent is MtBE. In some embodiments, the solvent isn-propanol. In some embodiments, the solvent is acetone. In someembodiments, the solvent is in a mixture with water, for example thesolvent can be a mixture of water and MA, EA, or acetone. In someembodiments, the water is present in an amount of about 5% by weight. Insome embodiments, the reslurrying takes place at RT. In someembodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 5. Form 5 is an anhydrous polymorph of thecompound of Formula (1). In one embodiment, polymorph Form 5 has an XRPDpattern, obtained with CuKα1-radiation, with at least peaks at ° 2θvalues of 7.3±0.2, 22.3±0.2, and 24.5±0.2. In some embodiments, Form 5has an XRPD pattern with at least peaks at ° 2θ values of 6.3±0.2,7.3±0.2, 21.7±0.2, 22.3±0.2, and 24.5±0.2. In some embodiments, Form 5has an XRPD pattern with at least peaks at ° 2θ values of 6.3±0.2,7.3±0.2, 11.0±0.2, 19.1±0.2, 19.5±0.2, 21.7±0.2, 22.3±0.2, and 24.5±0.2.For example, in some embodiments, Form 5 has an XRPD pattern with atleast peaks at ° 2θ values of 6.3±0.2, 7.3±0.2, 11.0±0.2, 14.3±0.2,19.1±0.2, 19.5±0.2, 21.7±0.2, 22.3±0.2, 24.5±0.2, and 26.5±0.2.

In some embodiments, a composition comprising polymorph Form 5 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form3, Form 4, Form 6, Form 7, Form 8, Form 9, Form 10, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 5 exhibits an endotherm betweenabout 50-100° C. as measured by DSC. In some embodiments, polymorph Form5 exhibits an endotherm at between about 210-235° C., e.g., around 222°C. In some embodiments, polymorph Form 5 exhibits an exotherm at betweenabout 227-240° C., e.g., around 235° C. In some embodiments, polymorphForm 5 exhibits an exotherm at between about 280-300° C., e.g., around293° C. For example, in some embodiments, the endotherms and exothermsare observed when using a scan rate of 10° C. per minute.

In some embodiments, polymorph Form 5 has a melting point of around 363°C. In some embodiments, polymorph Form 5 undergoes a weight loss ofabout 3.1% before around 100° C. and about 1.7% between about 100-250°C. as measured by TGA.

Provided herein is a process of preparing polymorph Form 5. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 5 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 5 as a residual solid. In some embodiments, thesolvent is MtBE. In some embodiments, the reslurrying takes place at RT.In some embodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 6. Form 6 is an anhydrous polymorph of thecompound of Formula (1).

In some embodiments, a composition comprising polymorph Form 6 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form3, Form 4, Form 5, Form 7, Form 8, Form 9, Form 10, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 6 exhibits an exotherm between about245-260° C. as measured by DSC. For example, in some embodiments, theendotherms and exotherms are observed when using a scan rate of 10° C.per minute. In some embodiments, polymorph Form 6 has a melting point ofaround 364° C.

Provided herein is a process of preparing polymorph Form 6. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 6 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 6 as a residual solid. In some embodiments, thesolvent is IPAc. In some embodiments, the solvent is in a mixture withwater, for example the solvent can be a mixture of water and IPAc. Insome embodiments, the water is present in an amount of about 5% byweight. In some embodiments, the reslurrying takes place at RT. In someembodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph of the compound of Formula (1) is apolymorph known as Form 7. Form 7 is an anhydrous polymorph of thecompound of Formula (1). In one embodiment, polymorph Form 7 has an XRPDpattern, obtained with CuKα1-radiation, with at least peaks at ° 2θvalues of 7.1±0.2, 21.6±0.2, and 23.2±0.2. In some embodiments, Form 7has an XRPD pattern with at least peaks at ° 2θ values of 4.9±0.2,7.1±0.2, 18.5±0.2, 21.6±0.2, and 23.2±0.2. In some embodiments, Form 7has an XRPD pattern with at least peaks at ° 2θ values of 4.9±0.2,7.1±0.2, 10.9±0.2, 18.5±0.2, 19.4±0.2, 21.6±0.2, 23.2±0.2, and 30.3±0.2.For example, in some embodiments, Form 7 has an XRPD pattern with atleast peaks at ° 2θ values of 4.9±0.2, 7.1±0.2, 8.8±0.2, 10.9±0.2,18.5±0.2, 19.4±0.2, 21.6±0.2, 22.1±0.2, 23.2±0.2, and 30.3±0.2.

In some embodiments, a composition comprising polymorph Form 7 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form3, Form 4, Form 5, Form 6, Form 8, Form 9, Form 10, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 7 exhibits an exotherm between about227-235° C., e.g., around 232° C., as measured by DSC. In someembodiments, polymorph Form 7 exhibits an exotherm between about299-305° C., e.g., around 303° C. For example, in some embodiments, theendotherms and exotherms are observed when using a scan rate of 10° C.per minute.

In some embodiments, polymorph Form 7 has a melting point of around 365°C. In some embodiments, polymorph Form 7 undergoes a weight loss ofabout 12% before around 200° C., e.g., from about 36° C. to about 200°C., as measured by TGA.

Provided herein is a process of preparing polymorph Form 7. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 7 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 7 as a residual solid. In some embodiments, thesolvent is methyl ethyl ketone (MEK). In some embodiments, the solventis in a mixture with water, for example the solvent can be a mixture ofwater and MEK. In some embodiments, the water is present in an amount ofabout 5% by weight. In some embodiments, the reslurrying takes place atRT. In some embodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 8. Form 8 is an anhydrous polymorph of thecompound of Formula (1). In one embodiment, polymorph Form 8 has an XRPDpattern, obtained with CuKα1-radiation, with at least peaks at ° 2θvalues of 6.9±0.2, 17.7±0.2, and 21.5±0.2. In some embodiments, Form 8has an XRPD pattern with at least peaks at ° 2θ values of 6.9±0.2,11.5±0.2, 17.7±0.2, 21.5±0.2, and 27.6±0.2. In some embodiments, Form 8has an XRPD pattern with at least peaks at ° 2θ values of 6.9±0.2,11.5±0.2, 15.3±0.2, 16.9±0.2, 17.7±0.2, 21.5±0.2, 27.6±0.2, and28.9±0.2. For example, in some embodiments, Form 8 has an XRPD patternwith at least peaks at ° 2θ values of 6.9±0.2, 11.5±0.2, 12.7±0.2,14.2±0.2, 15.3±0.2, 16.9±0.2, 17.7±0.2, 21.5±0.2, 27.6±0.2, and28.9±0.2.

In some embodiments, a composition comprising polymorph Form 8 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form3, Form 4, Form 5, Form 6, Form 7, Form 9, Form 10, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 8 exhibits an endotherm betweenabout 41-60° C. as measured by DSC. In some embodiments, polymorph Form8 exhibits an exotherm at between about 221-235° C., e.g., around 231°C. In some embodiments, polymorph Form 8 exhibits an endotherm betweenabout 279-290° C., e.g., around 285° C. For example, in someembodiments, the endotherms and exotherms are observed when using a scanrate of 10° C. per minute.

In some embodiments, polymorph Form 8 has a melting point of around 364°C. In some embodiments, polymorph Form 8 undergoes a weight loss ofabout 4.2% before around 190° C. and about 3.9% between about 190-261°C. as measured by TGA.

Provided herein is a process of preparing polymorph Form 8. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 8 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 8 as a residual solid. In some embodiments, thesolvent is MIBK. In some embodiments, the reslurrying takes place at RT.In some embodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 9. Form 9 is an anhydrous polymorph of thecompound of Formula (1). In one embodiment, polymorph Form 9 has an XRPDpattern, obtained with CuKα1-radiation, with at least peaks at ° 2θvalues of 4.9±0.2, 18.6±0.2, and 21.1±0.2. In some embodiments, Form 9has an XRPD pattern with at least peaks at ° 2θ values of 4.9±0.2,18.6±0.2, 21.1±0.2, 24.1±0.2, and 25.2±0.2. In some embodiments, Form 9has an XRPD pattern with at least peaks at ° 2θ values of 4.9±0.2,15.3±0.2, 16.5±0.2, 18.6±0.2, 21.1±0.2, 22.4±0.2, 24.1±0.2, and25.2±0.2. For example, in some embodiments, Form 9 has an XRPD patternwith at least peaks at ° 2θ values of 4.9±0.2, 10.1±0.2, 15.3±0.2,16.5±0.2, 18.6±0.2, 21.1±0.2, 22.4±0.2, 24.1±0.2, 25.2±0.2, and28.6±0.2.

In some embodiments, a composition comprising polymorph Form 9 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form3, Form 4, Form 5, Form 6, Form 7, Form 8, Form 10, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 9 exhibits a single meltingendotherm at around 364° C. as measured by DSC. For example, in someembodiments, the endotherm is observed when using a scan rate of 10° C.per minute. In some embodiments, other polymorph forms provided herein,such as, e.g., Form 1 and Form 2, can convert to Form 9 when heated tojust before melting (i.e., around 364° C.).

In some embodiments, polymorph Form 9 has a melting point of around 364°C. In some embodiments, polymorph Form 9 undergoes a weight loss ofabout 0.28% before around 100° C., e.g., from about 30.5° C. to about100° C., as measured by TGA.

Provided herein is a process of preparing polymorph Form 9. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 9 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 9 as a residual solid. In some embodiments, thesolvent is n-butanol. In some embodiments, the solvent is IPAc. In someembodiments, the solvent is n-butyl acetate. In some embodiments, thesolvent is in a mixture with water, for example the solvent can be amixture of water and ethanol or water and n-propanol. In someembodiments, the water is present in an amount of about 5% by weight. Insome embodiments, the reslurrying takes place at RT. In someembodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 10. Polymorph Form 10 is associated withDMSO. For example, DMSO is on the surface of the polymorph. In oneembodiment, polymorph Form 10 has an XRPD pattern, obtained withCuKα1-radiation, with at least peaks at ° 2θ values of 20.7±0.2,21.7±0.2, and 24.2±0.2. In some embodiments, Form 10 has an XRPD patternwith at least peaks at ° 2θ values of 18.2±0.2, 19.0±0.2, 20.7±0.2,21.7±0.2, and 24.2±0.2. In some embodiments, Form 10 has an XRPD patternwith at least peaks at ° 2θ values of 17.8±0.2, 18.2±0.2, 19.0±0.2,20.7±0.2, 21.7±0.2, 23.4±0.2, 24.2±0.2, and 27.9±0.2. For example, insome embodiments, Form 10 has an XRPD pattern with at least peaks at °2θ values of 6.7±0.2, 17.8±0.2, 18.2±0.2, 19.0±0.2, 19.9±0.2, 20.7±0.2,21.7±0.2, 23.4±0.2, 24.2±0.2, and 27.9±0.2.

In some embodiments, a composition comprising polymorph Form 10 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form3, Form 4, Form 5, Form 6, Form 7, Form 8, Form 9, Form 11, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 10 exhibits an endotherm betweenabout 212-237° C. as measured by DSC. In some embodiments, polymorphForm 10 exhibits an endotherm at between about 234-245° C., e.g., around237° C. In some embodiments, polymorph Form 10 exhibits an exothermbetween about 300-325° C., e.g., around 308° C. For example, in someembodiments, the endotherms and exotherms are observed when using a scanrate of 10° C. per minute.

In some embodiments, polymorph Form 10 has a melting point of betweenabout 364-372° C., such as, e.g., around 369° C. In some embodiments,polymorph Form 10 undergoes a weight loss of about 0.6% before around100° C., a weight loss of about 3.8% between about 100-170° C., and aweight loss of about 7.1% between about 170-260° C. as measured by TGA.

Provided herein is a process of preparing polymorph Form 10. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 10 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 10 as a residual solid. In some embodiments, thesolvent is DMSO. In some embodiments, the solvent is in a mixture withwater, for example the solvent can be a mixture of water and DMSO. Insome embodiments, the water is present in an amount of about 5% byweight. In some embodiments, the reslurrying takes place at RT. In someembodiments, the reslurrying takes place at around 50° C.

In some embodiments, the polymorph form of the compound of Formula (1)is a polymorph known as Form 11. Form 11 is an anhydrous polymorph ofthe compound of Formula (1). In one embodiment, polymorph Form 11 has anXRPD pattern, obtained with CuKα1-radiation, with at least peaks at ° 2θvalues of 6.4±0.2, 18.5±0.2, and 22.4±0.2. In some embodiments, Form 11has an XRPD pattern with at least peaks at ° 2θ values of 6.4±0.2,17.8±0.2, 18.5±0.2, 19.9±0.2, and 22.4±0.2. In some embodiments, Form 11has an XRPD pattern with at least peaks at ° 20 values of 6.4±0.2,8.4±0.2, 17.8±0.2, 18.5±0.2, 19.9±0.2, 22.4±0.2, 24.5±0.2, and 26.8±0.2.For example, in some embodiments, Form 11 has an XRPD pattern with atleast peaks at ° 2θ values of 6.4±0.2, 8.4±0.2, 17.8±0.2, 18.5±0.2,19.9±0.2, 20.3±0.2, 22.4±0.2, 22.9±0.2, 24.5±0.2, and 26.8±0.2.

In some embodiments, a composition comprising polymorph Form 11 issubstantially pure. For example, the composition can have a purity of atleast about 90%. In some embodiments, the composition has a purity of atleast about 95%. In some embodiments, the composition has a purity of atleast about 98%. For example, the composition can have a purity of atleast 98.5%, 98.6%, 98.7%, 98.8%, 98.9%, 99%, 99.1%, 99.2%, 99.3%,99.4%, 99.5%, 99.6%, 99.7%, 99.8%, or 99.9%. In some embodiments, thecomposition is substantially free of other forms of the compound ofFormula (1). For example, in some embodiments, the composition issubstantially free of other anhydrous forms of the compound of Formula(1). In some embodiments, the composition contains less than 15% byweight of other forms of the compound of Formula (1), such as less than14%, 13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less byweight of other forms of the compound of Formula (1). In someembodiments, the composition contains less than 15% by weight of one ormore other forms of the compound of Formula (1), such as less than 14%,13%, 12%, 11%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or less by weightof one or more other forms of the compound of Formula (1). For example,the composition can contain less than about 15% of Form 1, Form 2, Form3, Form 4, Form 5, Form 6, Form 7, Form 8, Form 9, Form 10, anon-stoichiometric hydrate of Form 1, or a combination of two or morethereof.

In some embodiments, polymorph Form 11 exhibits an endotherm betweenabout 215-230° C. as measured by DSC. In some embodiments, polymorphForm 11 exhibits an exotherm at between about 230-240° C., e.g., around235° C. In some embodiments, polymorph Form 11 exhibits an exothermbetween about 300-315° C., e.g., around 310° C. For example, in someembodiments, the endotherms and exotherms are observed when using a scanrate of 10° C. per minute.

In some embodiments, polymorph Form 11 has a melting point of around368° C. In some embodiments, polymorph Form 11 undergoes a weight lossof about 0.8% before around 100° C. and a weight loss of about 7.0%between about 100-249° C., as measured by TGA.

Provided herein is a process of preparing polymorph Form 11. In someembodiments, the process comprises reslurrying a composition comprisingthe compound of Formula (1), including amorphous and polymorph formsthereof, in a solvent or mixture of solvents to generate Form 11 as aresidual solid. In some embodiments, the composition comprises anon-stoichiometric hydrate of Form 1 having between 1% and about 20% byweight water. In some embodiments, the reslurrying takes place at RT. Insome embodiments, the reslurrying takes place at around 50° C. In someembodiments, the process further comprises drying the residual solid,for example, under vacuum. In some embodiments, the drying is at atemperature of between about 60° C. and 90° C., such as, e.g., around75° C.

In some embodiments, the process comprises reslurrying a compositioncomprising a non-stoichiometric hydrate of Form 1 having between 1% andabout 20% by weight water in a solvent or mixture of solvents togenerate polymorph Form 11 as a residual solid. In some embodiments, thesolvent is dimethylformamide (DMF). In some embodiments, the solvent isin a mixture with water, for example the solvent can be a mixture ofwater and DMF. In some embodiments, the water is present in an amount ofabout 5% by weight. In some embodiments, the reslurrying takes place atRT. In some embodiments, the reslurrying takes place at around 50° C.

4. Processes for Preparing Compositions Including the Compound ofFormula (1)

Also provided herein is a process for preparing a pharmaceuticalcomposition, including mixing (i) a compound of Formula (1), or salt oramorphous or polymorph form thereof, prepared according to any of theprocesses described herein, and (ii) a pharmaceutically acceptablecarrier (excipient), to form the composition.

In making the compositions provided herein, the compound of Formula (1),or salt or amorphous or polymorph form thereof, can be mixed with anexcipient, diluted by an excipient, or enclosed within such a carrier inthe form of, for example, a capsule, sachet, paper, or other container.When the excipient serves as a diluent, it can be a solid, semi-solid,or liquid material, which acts as a vehicle, carrier, or medium for theactive ingredient. Thus, the compositions can be in the form of tablets,pills, powders, lozenges, sachets, cachets, elixirs, suspensions,emulsions, solutions, syrups, aerosols (as a solid or in a liquidmedium), ointments containing, for example, up to 10% by weight of theactive compound, soft and hard gelatin capsules, suppositories, sterileinjectable solutions, and sterile packaged powders. In some embodiments,the composition is formulated for oral administration. In someembodiments, the composition is formulated as a tablet or capsule.

As used herein, “pharmaceutically acceptable carrier” includes anymaterial which, when combined with an active ingredient, allows theingredient to retain biological activity and is non-reactive with thesubject's immune system. Examples include, but are not limited to, anyof the standard pharmaceutical carriers, such as a phosphate bufferedsaline solution, water, emulsions such as oil/water emulsion, andvarious types of wetting agents. Compositions comprising such carrierscan be formulated by well-known conventional methods (see, for example,Remington's Pharmaceutical Sciences, 18th edition, A. Gennaro, ed., MackPublishing Co., Easton, Pa., 1990; and Remington, The Science andPractice of Pharmacy, 20th Ed., Mack Publishing, 2000).

The compositions comprising the compound of Formula (1), or apharmaceutically acceptable salt or amorphous or polymorph form thereof,can be formulated in a unit dosage form. In some embodiments, eachdosage contains from about 1 mg to about 1,000 mg (1 g). The term “unitdosage form” refers to physically discrete units suitable as unitarydosages for human subjects and other patients, each unit containing apredetermined quantity of active material calculated to produce thedesired therapeutic effect, in association with a suitablepharmaceutical excipient. In some embodiments, the active material isthe compound of Formula (1), or a salt or amorphous or polymorph formthereof.

In some embodiments, the compositions provided herein contain from about5 mg to about 50 mg of the compound of Formula (1), or apharmaceutically acceptable salt or amorphous or polymorph form thereof.For example, the compositions provided herein can contain about 5 mg toabout 10 mg, about 10 mg to about 15 mg, about 15 mg to about 20 mg,about 20 mg to about 25 mg, about 25 mg to about 30 mg, about 30 mg toabout 35 mg, about 35 mg to about 40 mg, about 40 mg to about 45 mg, orabout 45 mg to about 50 mg of the compound of Formula (1), or apharmaceutically acceptable salt or amorphous or polymorph form thereof.

In some embodiments, the compositions provided herein contain from about50 mg to about 500 mg of the compound of Formula (1), or apharmaceutically acceptable salt or amorphous or polymorph form thereof.For example, the compositions provided herein can contain about 50 mg toabout 100 mg, about 100 mg to about 150 mg, about 150 mg to about 200mg, about 200 mg to about 250 mg, about 250 mg to about 300 mg, about350 mg to about 400 mg, or about 450 mg to about 500 mg of the compoundof Formula (1), or a pharmaceutically acceptable salt or amorphous orpolymorph form thereof.

In some embodiments, the compositions provided herein contain from about500 mg to about 1,000 mg of Formula (1), or a pharmaceuticallyacceptable salt or amorphous or polymorph form thereof. For example, thecompositions provided herein can contain about 500 mg to about 550 mg,about 550 mg to about 600 mg, about 600 mg to about 650 mg, about 650 mgto about 700 mg, about 700 mg to about 750 mg, about 750 mg to about 800mg, about 800 mg to about 850 mg, about 850 mg to about 900 mg, about900 mg to about 950 mg, or about 950 mg to about 1,000 mg of Formula(1), or a pharmaceutically acceptable salt or amorphous or polymorphform thereof.

EXAMPLES Example 1: Synthesis ofN-(5-(3-(7-(3-fluorophenyl)-3H-imidazo[4,5-c]pyridin-2-yl)-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide(1)

The compound of Formula (1) was synthesized as detailed in Scheme 7 anddescribed below.

Synthesis of5-(4,4,5,5-tetramethyl-1,3,2-dioxaborolan-2-yl)-1-trityl-1H-indazole-3-carbaldehyde(9)

To a multi-neck, 10 L, cylindrical jacketed reactor was added (8) (300.0g, 1.0 equiv., 87.5% potency assumed), bis(pinacolato)diboron (171.2 g,1.2 equiv.), and KOAc (110.2 g, 2.0 equiv.). DMF (1575 mL, 6 volumes)was added to the flask and the flask was evacuated and refilled with N₂three times. Next, Pd(dppf)Cl₂ (12.3 g, 0.03 equiv.) was added to theflask and the vessel was evacuated and refilled with N₂ three times. Theflask was heated to 90-95° C. using a temperature control unit (TCU)overnight (e.g., over 20 hours). The mixture was cooled to ambienttemperature and H₂O (2100 mL) was added drop-wise to the vessel over 104minutes while maintaining an internal temperature between 15-25° C. Theprecipitated solids were stirred for an additional 30 min and then thereaction mixture was filtered through filter paper on a Buchner funnel.Subsequently, the cake was rinsed with water (1575 mL, 6 vol). The cakewas conditioned until it ceased dripping. The wet cake weighed 840 g.The cake was kept under hi-vac at ambient temperature overnight. Theweight was reduced to 685 g.

Synthesis ofN-(5-(3-formyl-1-trityl-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide(11)

The crude boronate ester (9) was charged to a 5-L, 3-neck, roundbottomed flask and (10) (N-(5-bromopyridin-3-yl)-3-methylbutanamide)(159.9 g, 1.0 equiv., 90.3% potency assumed), K₃PO₄ monohydrate (388.2g, 3.00 equiv.), 1,4-dioxane (1269 mL, 5 v), and H₂O (390 mL, 1.5 v)were charged to the vessel. Agitation was started and the internaltemperature increased from 17° C. to 26.7° C. The flask underwent avacuum/N₂ cycle 3 times. Next, Pd(PPh₃)₄ (19.7 g, 0.03 equiv.) was addedto the flask. A vacuum/N₂ cycle was completed 3 times. The flask washeated by a heating mantle to 85-95° C. in 70 min. After 180 minutes,the mixture was cooled to ambient temperature and no remaining5-(4,4,5,5-tetramethyl-1,3,2-dioxaborolan-2-yl)-1-trityl-1H-indazole-3-carbaldehyde (9) was detected by HPLC.

The reaction mixture was cooled to room temperature and added drop-wise,via addition funnel, to a multi-neck, jacketed cylindrical reactorcontaining H₂O (4.8 L) over 126 minutes. The residual was rinsed withdioxane (200 mL) into the 10-L reactor. It was then stirred at 15-25° C.for 90 minutes and then filtered through filter paper over a Buchnerfunnel. The filtration took about 20 minutes, and the cake was rinsedwith water (1.6 L). This took 25 minutes, and the cake was conditionedfor 45 minutes. The cake was transferred to a drying dish and kept underhi-vac at room temperature overnight. The solids were charged back intothe 10-L reactor after losing approximately 150 g weight. 2-methyl THF(1.69 L) was added to the flask. A dark brown solution was obtainedafter stirring for approximately 30 minutes at 40-50° C. A 9% oxalicacid solution (1348 g) was added drop-wise to the reactor in 39 minuteswhile keeping the temperature at 40-50° C. A slurry was formed, and itwas aged for 4 h at 40-50° C. and then stirred at 0-10° C. for 16 h. Thebatch was filtered (17 minutes), and the reactor and the brown solidswere rinsed with 615 mL of cold 2-methyl THF, which removed asignificant amount of color from the solids. The pH of the filtratewas 1. The solids were charged back to the 10-L reactor, followed by theaddition of 2-methyl-THF (1.69 L). A solution of 10% K₂CO₃ (1 L, 1067 g)was added to the slurry to adjust the pH to 9 at 10-20° C. in 24minutes. The aqueous layer (lower, colorless) was removed and theorganic layer was cooled to 5-10° C. Aqueous oxalic acid (1360 g) wasadded to the solution in 60 minutes. Solids precipitated from solutionand, after aging overnight at 5-10° C., the solids (light brown) werecollected by filtration (94 minutes) and washed with cold 2-methyl-THF(615 mL, 68 minutes), which removed a significant amount of color fromthe solids. The solids were charged back to the 10-L reactor andsuspended in 2-methyl-THF (1.84 L). The pH of the mixture was adjustedto 9 with 10% K₂CO₃ (1.5 L) to form a biphasic homogeneous solution. Theaqueous layer was removed and the organic layer was washed with 25% NaCl(400 mL) and H₂O (1575 mL) twice. The pH of the aqueous phase wasapproximately 7 as determined by pH paper. The organic layer wastransferred to heptanes (3860 mL) dropwise while stirring at a rate tokeep the temperature below 25° C. The addition took 3.5 hours and a niceflowing slurry was obtained. The slurry was concentrated toapproximately 5 vol on a rotovap under vacuum and then filtered througha Buchner funnel (2 minutes). The cake was washed with heptanes (2.32 L)and dried under hi-vac at 40-50° C. overnight to afford 225 g ofN-(5-(3-formyl-1-trityl-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide(compound (11)) as an off-white powder in 71% yield. The crude compound(11), the first isolated compound (11) oxalate salt, the second isolatedcompound (11) oxalate salt, and the final product of compound (11) wereanalyzed. The purities were: 90.89%, 97.54%, 97.94%, and 98.27%,respectively.

Synthesis ofN-(5-(3-(7-(3-fluorophenyl)-3H-imidazo[4,5-c]pyridin-2-yl)-1-trityl-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide(12)

To a 2 L, multi-neck, round bottomed flask was charged compound (11) (70g, 1.0 equiv., 98% purity), compound (6)(5-(3-fluorophenyl)pyridine-3,4-diamine) (34.37 g, 1.00 equiv., 97.6%potency), grinded Na₂SO₃ (30.6 g, 2.0 equiv.) and NMP (1065 mL). A 0.1mL portion of the reaction was taken for Karl Fischer (KF) titrationanalysis, which showed 3129 ppm of H₂O content. The reaction mixture washeated to 110-115° C. by a heating mantle. The reaction went tocompletion after 24 hours with 14.1% of compound (1), 78.3% of compound(12), and 0.42% of compound (11). The reaction mixture was quenched intoa mixture of water (2135 mL), NaHCO₃(103 g), and 1030 mL EtOAc in a 10-Lreactor over 27 minutes. The flask was rinsed with NMP (67 mL) into thequench mixture. The mixture was filtered through a Celite pad and thefiltration took 16 minutes. The reactor and the cake were rinsed withEtOAc (200 mL). The filtrate was transferred back to the 10-L reactorand the phases were separated. The aqueous layer was extracted withEtOAc (760 mL). The combined organic layer was washed with a mixture ofwater (525 mL) and 25% NaCl solution (125 mL). A 9% oxalic acid solution(308 g) was added dropwise to the organic layer in 45 minutes to obtaina pH of 1. The slurry was filtered through filter paper over 21 minutes.The reactor and cake were rinsed with EtOAc (380 mL) and this tookanother 10 minutes. An aliquot of the wet cake was analyzed for purityand the result showed a 87.89% by area under curve (AUC) purity forcompound (12). The wet cake was charged back to a 5-L 4-neck RBFfollowed by the addition of MeOH (693 mL) and DCM (1654 mL). The mixturewas heated up to reflux (35° C.) and Celite (47 g) was added. A Buchnerfunnel was set up with a Celite pad on the bottom and a pad of activatedcarbon (60 g, Darco™ G-60) on the top. The mixture was stirred at refluxfor 70 minutes and then filtered hot through the Buchner funnel. Thefiltration took 13 minutes. The reactor and the cake were rinsed with amixed solvent of MeOH/DCM (173 mL/414 mL). It took 10 minutes tocomplete. The dark brown solution was concentrated on a rotovap toapproximately 4 vol and acetone (870 mL) was added. The mixture wasconcentrated to approximately 4 vol and once again acetone (2×870 mL)was added. The mixture was concentrated to approximately 3 vol anddiluted with acetone (260 mL). ¹H NMR analysis of the solvent showed2.8% by weight of MeOH to acetone and the solvent swap was deemedcomplete. The slurry was filtered and the cake was rinsed with acetone(430 mL). An aliquot of the wet cake was analyzed and it had a purity of99.10% AUC. The wet cake was charged back to a 5-L multi-neck RBFfollowed by the addition of 2-methyl-THF (878 mL). A 10% K₂CO₃ solution(440 mL) was added to the mixture over 20 minutes to obtain a pH ofapproximately 10. The mixture was transferred to a 2-L separatory funneland the phases were separated. The organic layer was washed with 4.8% aNa₂SO₄ solution (2×526 mL) and then diluted with tert-butyl methyl ether(MTBE; 927 mL). The organic solution was added to heptanes over 1 hourand 51 minutes; keeping the temperature at 15-25° C. The resultingslurry was concentrated to approximately 3 vol on a rotovap to afford avery thick slurry. It was filtered through filter paper (total 15minutes) and the cake was dried under hi-vac at 40-50° C. for 15 h.Compound (12) was obtained (61.1 g) in 66% yield. HPLC analysis showed99.16% purity.

Synthesis ofN-(5-(3-(7-(3-fluorophenyl)-3H-imidazo[4,5-c]pyridin-2-yl)-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide(1)

To a 1-L 3-neck round bottomed flask was charged TFA (250 mL). Compound(12) (55 g) was added portion-wise over 12 minutes to the flask whileusing an ice/water bath to control the temperature below 20° C. After 2h, a sample was analyzed by HPLC and showed that no compound (12) wasdetectable. TFA (37 mL) was added to the brown solution to make up therinse volume. H₂O (275 mL) was added dropwise over 1 hour and 37 minutesto the TFA mixture at a rate to keep the temperature below 10° C. Solidsprecipitated during the addition. A free-flowing slurry was obtained atthe beginning and turned into an extremely thick slurry at the end ofthe addition. The slurry was stirred at 0-10° C. for 84 minutes. Thebatch was filtered. The cake was rinsed with a 1.2:1 TFA/H₂O solution(110 mL). The wet cake was conditioned at room temperature overnight.The wet cake was slurried in 90% EtOH/water (672 mL) for 3 hours and 40minutes. The material was isolated by filtration through a tight weavefilter cloth. The cake was rinsed with 90% EtOH/water (134 mL) and ittook another 1 hour and 12 minutes. The wet cake was charged back to a1-L RBF, followed by the addition of water (385 mL). A 5% Na₂CO₃solution (19.25 g Na₂CO₃ was dissolved in 366 mL of water) was added tothe slurry over 29 minutes. The slurry was stirred at approximately 20°C. for 5 h and then filtered through a tight weave filter cloth. Thecake was rinsed with water (110 mL, it took 64 minutes) and then kept atroom temperature overnight. The wet cake was reslurried in water (550mL) at approximately 25° C. twice (5 hours and 2 hours, respectively).The filtrations took 47 min and 54 min, respectively. The wet cake wasreslurried in 90% IPA/water (669 mL) at approximately 25° C. for 67 minand then filtered through a tight weave filter cloth. The filtrationtook 2 hours and 9 minutes. The cake was rinsed with 90% IPA/water (200mL) and conditioned at RT overnight. The solid was reslurried in 90%MeOH/water (400 mL) at 30-35° C. for 46 hours and then filtered througha tight weave filter cloth. The cake was rinsed with 90% MeOH/water (134mL). After drying, 18.48 g of compound (1) was obtained in 50% yield.HPLC analysis showed 99.33% purity.

Example 2: Synthesis ofN-(5-(3-(7-(3-fluorophenyl)-3H-imidazo[4,5-c]pyridin-2-yl)-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide(1)

The synthesis of compound (1) (Scheme 8) started from the borylation ofcompound (8) with bis(pinacolato)diboron to form compound (9), followedby the in situ Suzuki-Miyaura cross-coupling with compound (10) to formcompound (11). The cyclization of compound (11) with compound (6) gavecompound (12). The synthesis was finalized with the deprotection of thetrityl group of compound (12) to afford compound (1).

Borylation and Suzuki-Miyaura Cross-Coupling Reaction. Compound (11) wasprepared and purified by first borylating compound (8) and subsequentlyperforming a Suzuki-Miyaura cross-coupling reaction as described in theprocess below.

Process 1. Charge 50.0 g (1.0 X, 1.00 eq.) active (8) into R1. (R1 =reactor). 2. Charge 32.6 g (0.652 X, 1.20 eq.) (0.625 ~ 0.679 X)bis(pinacolato)diboron into R1. 3. Charge 21.0 g (0.42 X, 2.00 eq.)(0.40 ~ 0.44 X) KOAc into R1. 4. Charge 275.0 g (5.5 X, 5.8 vol.) (5.0 ~6.0 X) DMF into R1. 5. Turn on R1 stir. 6. Degas R1 with N₂ for 3 times.7. Charge 2.35 g (0.047 X, 0.03 eq.) (0.039 ~ 0.055 X) Pd(dppf)Cl₂ intoR1. 8. Degas R1 with N₂ for 3 times. 9. Heat R1 to 92° C. (87 ~ 97° C.).10. Stir R1 for 18 h (16 ~ 20 h) at 92° C. (87 ~ 97° C.). 11. Cool thematerial in R1 to 20° C. (15 ~ 25° C.). 12. Add 375.0 g (7.5 X, 7.5vol.) (7.0 ~ 8.0 X) process water at 20° C. (15 ~ 25° C.) into R1dropwise via headtank NLT 1.5 h. 13. Stir the material in R1 for 45 min(30 ~ 60 min) at 20° C. (15 ~ 25° C.). 14. Filter the material. Transferthe mother liquid into T1. 15. Rinse R1 with 300.0 g (6.0 X, 6.0 vol.)(5.5 ~ 6.5 X) process water and then transfer to funnel to slurry thecake. Transfer the mother liquid into T1. 16. Test the purity by HPLC:report. 17 Charge (9) into R1. 18. Charge 27.5 g (0.550 X, 1.00 eq.)(0.539 ~ 0.561X) active (10) into R1. 19. Charge 85.5 g (1.71 X, 3.0eq.) (1.60 ~ 1.82 X) K₃PO₄ · 3H₂O into R1. 20. Charge 275.0 g (5.5 X,5.3 vol.) (5.0 ~ 6.0 X) 1,4-dioxane into R1. 21. Charge 40.0 g (0.8 X,0.8 vol.) (0.7 ~ 0.9 X) H₂O into R1. 22. Turn on R1 stir. 23. Degas R1with N₂ three times. 24. Charge 3.71 g (0.0741 X, 0.03 eq.) (0.0692 ~0.0790 X) Pd(PPh₃)₄ into R1 under N₂ protect. 25. Degas R1 with N₂ threetimes. 26. Heat R1 to 90° C. (85 ~ 95° C.). 27. Stir R1 at 90° C. (85 ~95° C.) for 2.5 h (2.0 ~ 3.0 h). 28. Cool R1 to 20° C. (15 ~ 25° C.).29. Transfer the material in R1 into drum. 30. Charge 775.0 g (15.5 X,15.5 vol.) (15.0 ~ 16.0 X) process water into R1. 31. Add the materialin step 29 drum into R1 slowly by dropwise while keeping R1 at 20° C.(15 ~ 25° C.) about 3.0 h (2.0 ~ 4.0 h). 32. Stir R1 for 45 min (30 ~ 60min) at 20° C. (15 ~ 25° C.). 33. Filter the material in R1. Transferthe mother liquid into T2 (T2 = tank). 34. Rinse R1 with 300.0 g (6.0 X,6.0 vol.) (5.5 ~ 6.5 X) process water and then transfer to funnel toslurry the solid. Transfer the mother liquid into T2. Test the wet cakeof purity by HPLC: report. Test the residual F1 in T2: report. 35.Charge the solid in funnel into R1. 36. Charge 275.0 g (5.5 X, 6.4 vol.)(5.0 ~ 6.0 X) 2-Me—THF into R1. 37. Stir R1 for 45 min (30 ~ 60 min) at20° C. (15 ~ 25° C.). 38. Heat R1 to 45° C. (40 ~ 50° C.). 39. Add 275.0g (5.5 X, 2.85 eq.) (5.0 ~ 6.0 X) 10% aqueous oxalic acid slowly bydropwise into R1 at 45° C. (40 ~ 50° C.). 40. Stir R1 at 45° C. (40 ~50° C.) for 5 h (4 ~ 6 h). 41. Cool R1 to 7° C. (5 ~ 10° C.). 42. StirR1 at 7° C. (5 ~ 10° C.) for 18 h (16 ~ 20 h). 43. Filter the materialin R1, and transfer the mother liquid into T2. 44. Rinse R1 with 125.0 g(2.5 X, 2.9 vol.) (2.0 ~ 3.0 X) 2-Me THF and then transfer to funnel toslurry the solid. Transfer the mother liquid into T3. 45. Charge thecake into R1. 46. Charge 275.0 g (5.5 X, 6.4 vol.) (5.0 ~ 6.0 X)2-Me THF into R1. 47. Stir R1 for 45 min (30 ~ 60 min) at 20° C. (15 ~25° C.). 48. Charge 300.0 g (6.0 X, 2.0 eq.) (5.0 ~ 7.0 X) 10% K₂CO₃aqueous into R1. 49. Stir R1 for 45 min (30 ~ 60 min) at 20° C. (15 ~25° C.). 50. Transfer the bottom layer into T4. 51. Cool R1 to 7° C. (5~ 10° C.). 52. Add 275.0 g (5.5 X, 2.85 eq.) (5.0 ~ 6.0 X) 10% aqueousoxalic acid slowly by dropwise into R1 at 7° C. (5 ~ 10° C.). 53. StirR1 at 7° C. (5 ~ 10° C.) for 5 h(4 ~ 6h). 54. Filter the material in R1,and transfer the mother liquid into T2. 55. Rinse R1 with 125.0 g (2.5X, 2.9 vol.) (2.0 ~ 3.0 X) 2-Me THF and then transfer to funnel toslurry the solid. Transfer the mother liquid into T3. 56. Charge thecake into R1. 57. Charge 350.0 g (7.0 X, 8.1 vol.) (6.5 ~ 7.5 X)2-Me THF into R1. 58. Stir for 45 min (30 ~ 60 min) at 20° C. (15 ~ 25°C.). 59. Charge 300.0 g (6.0 X, 2.0 eq.) (5.0 ~ 7.0 X) 10% K₂CO₃ aqueousinto R1. 60. Stir R1 for 45 min (30 ~ 60 min) at 20° C. (15 ~ 25° C.).61. Transfer the bottom layer into T4. 62. Charge 350.0 g (7.0 X) (6.0 ~8.0 X) 5% NaCl aqueous into R1. 63. Stir R1 for 25 min (15 ~ 35 min) at20° C. (15 ~ 25° C.). 64. Transfer the bottom layer into T3. 65. Charge350.0 g (7.0 X) (6.0 ~ 8.0 X) 5% NaCl aqueous into R1. 66. Stir R1 for25 min (15 ~ 35 min) at 20° C. (15 ~ 25° C.). 67. Transfer the bottomlayer into T4. 68. Charge 350.0 g (7.0 X) (6.0 ~ 8.0 X) 5% NaCl aqueousinto R1. 69. Stir R1 for 25 min (15 ~ 35 min) at 20° C. (15 ~ 25° C.).70. Transfer the bottom layer into T4. 71. Transfer the material in R1into drum. 72. Charge 475.0 g (9.5 X, 14.0 vol.) (9.0 ~ 10.0 X)n-heptane into R1. 73. Add the material in drum of step 71 into R1slowly at 20° C. (15 ~ 25° C.). 74. Stir R1 for 45 min (30 ~ 60 min) at20° C. (15 ~ 25° C.). 75. Concentrated R1 to 275.0 mL (5.5 vol.) (5.0 ~6.0 vol.) Under vacuum below 40° C. 76. Adjust R1 to 20° C. (15 ~ 25°C.). 77. Filter the material in R1. The filtrate is transferred to T5.78. Rinse R1 with 300.0 g (6.0 X, 8.8 vol.) (5.5 ~ 6.5 X) n-heptane andthen transfer to filter. Transfer the mother liquid into T5. 79. Dry theproduct (11) at 45° C. (40 ~ 50° C.) for 18 h (16 ~ 20 h).Imidazopyridine formation. The compound of Formula (11) can be convertedto the compound of Formula (12) and purified as described in the processbelow.

Process 1) Charge 50.0 g (1.0 X, 1.00 eq.) active (11) into R1. (R1 =reactor). 2) Charge 24.5 g (0.49 X, 1.00 eq.) (0.48 ~ 0.50 X) active (6)bis hydrochloride salt into R1. 3) Charge 12.5 g(0.25 X, 1.10 eq.) (0.24~ 0.26 X) Na₂SO₃ into R1 . 4) Charge 775.0 g (15.5 X, 15.5 vol.) (15.0 ~16.0 X) NMP in R1 . 5) Stir R1 for 20 min (10 ~ 30 min). 6) Degas withN₂ twice. 7) Heat R1 to 112° C. (110 ~ 115° C.). 8) Stir R1 at 112° C.(110 ~ 115° C.) for 8 h (7 ~ 9 h). 9) Cool R1 to 25° C. (20 ~ 30° C.).10) Transfer the material in R1 into drum. 11) Charge 1600.0 g (32 X)(31 ~ 33 X) 5% NaHCO₃ aqueous into R1 at 25° C. (20 ~ 30° C.). 12)Charge 675.0 g (13.5 X, 15.0 vol.) (13.0 ~ 14.0 X) EA (ethyl acetate)into R1. 13) Add the material in step 11 drum into R1 slowly whilekeeping R1 at 25° C. (20 ~ 30° C.). 14) Stir R1 for 45 min (30 ~ 60 min)at 25° C. (20 ~ 30° C.). 15) Stay R1 for 25 min (15 ~ 35 min) at 25° C.(20 ~ 30° C.). 16) Split the material in R1. Transfer the bottom layerinto T1. 17) Filter the material in R1 through diatomite pad, transferthe filtrate into T2. 18) Rinse diatomite pad with 100.0 g (2.0 X, 2.2vol.) (1.5 ~ 2.5 X) EA, transfer the filtrate into T2. 19) Transfer thefiltrate in T1 into R1. 20) Charge 475.0 g (9.5 X, 10.6 vol.) (9.0 ~10.0 X) EA into R1 at 25° C. (20 ~ 30° C.). 21) Stir R1 for 25 min (15 ~35 min) at 25° C. (20 ~ 30° C.). 22) Stay R1 for 25 min (15 ~ 35 min) at25° C. (20 ~ 30° C.). 23) Split the material in R1, transfer the aqueouslayer into T1. 24) Transfer the material in T2 into R1. 25) Charge 475.0g (9.5 X) (9.0 ~ 10.0 X) 5% NaC1 solution into R1 at 25° C. (20 ~ 30°C.). 26) Stir R1 for 25 min (15 ~ 35 min) at 25° C. (20 ~ 30° C.). 27)Stay R1 for 25 min (15 ~ 35 min) at 25° C. (20 ~ 30° C.). 28) Split thematerial in R1. Transfer the bottom layer into T1. 29) Add 225.0 g (4.5X, 2.5 eq.) (4.2 ~ 4.7 X) 9% oxalic acid solution into R1 slowly at 25°C. (20 ~ 30° C.). 30) Stir R1 for 1.0 h (0.5 ~ 1.5 h) at 25° C. (20 ~30° C.). 31) Filter the material in R1. Transfer the mother liquid intoT3. 32) Rinse R1 with 175.0 g (3.5 X, 3.9 vol.) (3.0 ~ 4.0 X) EA andthen transfer to funnel to slurry the solid. Transfer the mother liquidinto T3. Residual K1 in EA solution. 33) Charge the filter cake into R1.34) Charge 4000.0 g (80.0 X) (78.0 ~ 82.0 X) MeOH/DCM (m:m = 1:4) intoR1. 35) Heat R1 to 38° C. (35 ~ 40° C.). 36) Stir R1 for 45 min (30 ~ 60min) to clear at 38° C. (35 ~ 40° C.). 37) Filter the material in R1through diatomite pad and active carbon (0.15 X) (0.13 ~ 0.17 X). Thefiltrate is transferred to R1. 38) Rinse filter cake with 500.0 g (10.0X) (9.0 ~ 11.0 X) MeOH/DCM (m:m = 1:4) and then transfer to filter.Transfer the mother liquid into R1. 39) Concentrate to 275.0 mL (5.5vol.) (5.0 ~ 6.0 vol.) Under vacuum below 45° C. 40) Charge 475.0 g (9.5X, 12.0 vol.) (9.0 ~ 10.0 X) acetone into R1. 41) Concentrate to 225.0mL (4.5 vol.) (4.0 ~ 5.0 vol.) Under vacuum below 45° C. 42) Charge475.0 g (9.5 X, 12.0 vol.) (9.0 ~ 10.0 X) acetone into R1. 43)Concentrate to 275.0 mL (5.5 vol.) (5.0 ~ 6.0 vol.) Under vacuum below45° C. 44) Charge 125.0 g (2.5 X, 3.2 vol.) (2.0 ~ 3.0 X) acetone intoR1. Residual MeOH report. 45) Cool R1 to 25° C. (20 ~ 30° C.). 46)Filter the material in R1. Transfer the mother liquid into T3. 47) RinseR1 with 125.0 g (2.5 X, 3.2 vol.) (2.0 ~ 3.0 X) acetone and thentransfer to centrifuge to slurry the solid. Transfer the mother liquidinto T3. Report: residual K1 in acetone solution; Check purity of K1 wet≥ 98.5%, if pass proceed to following steps, otherwise repeat step 35 ~47, Residual Pd ≤ 20 ppm. 48) Charge the cake of STEP 47 into R1. 49)Charge 525.0 g (10.5 X, 12.2 vol.) (10.0 ~ 11.0 X) 2-Me THF into R1. 50)Stir for 25 min (15 ~ 35 min) at 25° C. (20 ~ 30° C.). 51) Charge 310.0g (6.2 X, 2.5 eq.) (6.0 ~ 6.4 X) 10% K₂CO₃ aqueous into R1 at 25° C. (20~ 30° C.). 52) Stir R1 at 25° C. (20 ~ 30° C.) for 45 min (30 ~ 60 min).53) Transfer the bottom layer into T4. 54) Charge 350.0 g (7.0 X, 1.38eq.) (6.5 ~ 7.5 X) 5% Na₂SO₄ solution into R1 at 25° C. (20 ~ 30° C.).55) Stir R1 for 25 min (15 ~ 35 min) at 25° C. (20 ~ 30° C.). 56)Transfer the bottom layer into T4. 57) Charge 350.0 g (7.0 X, 1.38 eq.)(6.5 ~ 7.5 X) 5% Na₂SO₄ solution into R1 at 25° C. (20 ~ 30° C.). 58)Stir R1 for 25 min (15 ~ 35 min) at 25° C. (20 ~ 30° C.). 59) Transferthe bottom layer into T4. 60) Charge 475.0 g (9.5 X, 12.5 vol.) (9.0 ~10.0 X) MTBE into R1. 61) Transfer the material in R1 into drum. 62)Charge 850.0 g (17.0 X, 25.0 vol.) (16.5 ~ 17.5 X) n-heptane into R1.63) Add the material in drum of step 61) into R1 slowly by dropwise at20° C. (15 ~ 25° C.). 64) Concentrate to 275 mL (5.5 vol.) (5.0 ~ 6.0vol.) Under vacuum below 45° C. 65) Cool R1 to 25° C. (20 ~ 30° C.). 66)Filter the material in R1. Transfer the mother liquid into T5. 67) RinseR1 with 200.0 g (4.0 X, 5.9 vol.) (3.5 ~ 4.5 X) n-heptane and thentransfer to funnel to slurry the solid. Transfer the mother liquid intoT5. Residual (12) in n-heptane solution. 68) Dry the product (12) at 45°C. (40 ~ 50° C.) for 18 h (16 ~ 20 h).Deprotection of the trityl group. The deprotection of the trityl groupto yield a compound of Formula (1) was accomplished as described in theprocedure below.

Process 1) Charge TFA into R1. 2) Charge (12) in portions into R1maintaining temperature at 15 ~ 25° C. 3) Stir the solution at 15 ~ 25°C. for 2 h. 4) Charge purified water dropwise by maintaining thetemperature of solution 0 ~ 10° C. 5) Charge crystal seed of TFA salt of(1) into the reactor. 6) Charge 2nd lot of purified water dropwise bymaintaining the temperature of solution 0 ~ 10° C. 7) Stir the materialsin R1 at 5 ~ 15° C. for 2 h. 8) Filtered the solids and washed withaqueous TFA solution. 9) Transfer the wet cake of step 8 to R1. 10)Reslurry the solid in 90% EtOH/water at 20 ~ 30° C. for 4 h. 11) Filterthe solids. 12) Suspend the solids in purified water. 13) Basify themixture to pH 9 ~ 10 by adding 5% Na₂CO₃ solution. 14) Stir the mixtureat 20 ~ 30° C. for 5 h. 15) Filter the solids and rinse with water. 16)Transfer the solids into clean R1 again. 17) Reslurry the solids inpurified water at 20 ~ 30° C. for 6 h. 18) Filter the solids. 19)Transfer the solids into R1 again. 20) Reslurry the solids in purifiedwater at 20 ~ 30° C. for 20 h. 21) Filter the solids and rinse withwater. 22) Transfer the solids into R1 again. 23) Reslurry the solids in90% isopropanol/water at 20 ~ 30° C. for 2 h. 24) Filter the solids andrinse with 90% isopropanol/water. 25) Transfer the solids into R1 again.26) Charge 90% methanol/water into R1. 27) Charge crystal seed of (1)into R1. 28) Reslurry the solids in 90% methanol/water at 30 ~ 35° C.for 48 h. 29) Filter the solids and rinse with 90% methanol/water. 30)Dry the product under vacuum at 40 ~ 50° C.

Example 3: Synthesis of Polymorph Form 1 ofN-(5-(3-(7-(3-fluorophenyl)-3H-imidazo[4,5-c]pyridin-2-yl)-1H-indazol-5-yl)pyridin-3-yl)-3-methylbutanamide(1)

The synthesis of polymorph Form 1 of compound (1) from compound (12)involved the deprotection of the trityl group followed bycrystallization as described below.

A. Synthesis of Compound (1)

A 3-L 3-neck round bottomed flask was charged with trifluoroacetic acid(TFA, 800 g). Compound (12) (100 g) was slowly added to the flask whilemaintaining the temperature of the reaction mixture at 20° C. Thereaction was stirred until at least 99% conversion to compound (1) wasobserved (typically 3 to 5 h). The reaction mixture was cooled to 5° C.Water (250 g) was slowly added to the flask while maintaining thetemperature of the reaction mixture at 5° C., and stirred for 45 minutesat 5° C. The resulting mixture was filtered. The reaction flask wasrinsed with 8:2.5 m:m TFA:water (150 g) and the resulting solution waspassed through the filter cake.

A round-bottomed flask was charged with the combined mother liquors ofthe previous two filtrations, and cooled to 5° C. Water (350 g) wasadded to the reaction mixture at 5° C., stirred for 1.5 h at 10° C., andthe resulting mixture was filtered. The reaction flask was rinsed with4:3 m/m TFA:water (200 g), the resulting mixture was slurried with thefilter cake, and the slurry was filtered. Residual compound (1) wastested for in the mother liquors of the previous two filtrations, aswell as the purity of compound (1) in the filter cake.

The filter cake was added to a round-bottomed flask, followed by 90%ethanol (950 g), and was stirred at 30° C. for 3 h. The resultingmixture was stirred at 30° C. for 2-4 hours, filtered, and the filtercake was rinsed with 90% ethanol (200 g). The mother liquors of theprevious two filtrations were tested for residual compound (1), and thepurity of compound (1) in the filter cake was tested.

The filter cake was added to a round-bottomed flask, followed by water(700 g), and was stirred at 25° C. for 1 h. Aqueous 5% Na₂CO₃ (740 g)was then added and the solution was stirred at 25° C. for 6 h. Theresulting mixture was filtered, and the filter cake was rinsed withwater (200 g).

The filter cake was added to a round-bottomed flask, followed by water(950 g), and was stirred at 25° C. for 6.5 h. The resulting mixture wasfiltered, and the filter cake was rinsed with water (200 g). The filtercake was added to a round-bottomed flask, followed by water (950 g), andwas stirred at 25° C. for 3.5 h. The resulting mixture was filtered, andthe filter cake was rinsed with water (200 g). The purity of compound(1) was tested, as well as the quantity of residual Pd in the filtercake. The residual TFA and residue on ignition of filter cake was alsotested. If the residual TFA was not 0.07% or lower, and/or residue onignition (after drying) was not 0.4% or lower, the filter cake was addedto a round bottomed flask, followed by water (950 g). The resultingmixture was stirred at 25° C. for 3.5 h, filtered, and rinsed with water(200 g). The residual TFA of the filter cake was again tested. If theresidual TFA concentration was 0.07% or lower and the residual onignition (after drying) was 0.4% or lower, the filter cake was added toa round bottomed flask, followed by 90% isopropyl alcohol (950 g). Theresulting mixture was stirred at 25° C. for 2 h. The resulting mixturewas filtered and the filter cake was rinsed with 90% isopropyl alcohol(200 g).

B. Preparation of Polymorph Form 1 of Compound (1)

The filter cake was added to a round-bottomed flask, followed by 90%methanol (600 g), and the resulting mixture was heated to 25° C. 4.5 gof polymorph Form 1 of compound (1) was added to the mixture, themixture was heated to 33° C., and the solution was reslurried at 33° C.for 13 h. Formation of polymorph Form 1 of compound (1) was monitored bytaking an X-ray powder diffractogram (XRPD) of a small sample, thenreslurrying continued at 33° C. for another 13 h. Another sample wasobtained. XRPD analysis was performed to test whether completeconversion of compound (1) to the polymorph Form 1 of compound (1) hadoccurred. Particle size distribution (PSD) was measured to test whetherthe crystals had a distribution of 2.0 μm≤D50≤5.0 μm, D90≤15.0 μm. Ifcomplete conversion to polymorph Form 1 had not occurred or the PSD wasoutside of the range, reslurrying continued at 33° C. XPRD and particlesize distribution analysis occurred every 13-15 hours until both testsyielded a positive result.

The mixture was then filtered, and the filter cake was rinsed with 90%methanol (200 g). Tests were performed to determine whether (1) thepurity of compound (1) was at least 98% (positive result), (2) residualpalladium had a concentration of, at most, 10 ppm (positive result), (3)the XRPD indicated complete conversion to polymorph Form 1 (positiveresult), and (4) the particle size distribution was 2.0 μm≤D50≤5.0 μm,D90≤15.0 μm (positive result). When each of the four aforementionedtests yielded a positive result, polymorph Form 1 of compound (1) wasdried at 55° C. for 27 h. If any of the four aforementioned testsyielded a negative result, the filter cake was added to a round-bottomedflask, followed by 90% methanol (600 g), and was reslurried at 33° C.for 4 h. The mixture was filtered, and the filter cake was rinsed with90% methanol (200 g). The filter cake was added to a round-bottomedflask, followed by 90% methanol (600 g), and reslurrying at 33° C. for18 h. The mixture was filtered, and the filter cake was rinsed with 90%methanol (200 g) to obtain polymorph Form 1 of compound (1). PolymorphForm 1 of compound (1) was dried at 55° C. for 27 h.

Example 4: Polymorph Screen

A polymorph screen was performed on the compound of Formula (1) todetermine solubility, polymorphism, and thermodynamic stability.

A. Analysis of the Starting Solid

X-ray powder diffraction (XRD), differential scanning calorimetry (DSC),and thermal gravimetric analysis (TGA) scans of the starting solidcompound of Formula (1) obtained from Example 3A, above, indicated thatthe starting solid was a crystalline material and was a mixture of Form1 and a non-stoichiometric hydrate of Form 1 having between 1% and about20% by weight water. According to the DSC scan (FIG. 12B), the solidshowed an endotherm between 50° C.-100° C.; it also showed an exothermat 284° C.; and the solid eventually melted at 364° C. According to theTGA scan (FIG. 12C), a 1.4% weight loss was observed before 100° C.

The solubility of the starting solid was measured by the gravimetricmethod and indicated that the compound had low solubility at RT and at50° C. in all solvents tested except DMF and DMSO. Results from thesolubility data test at RT and at 50° C. are shown in Table 1.

TABLE 1 Solubility data of the starting solid obtained from Example 3ASolubility at Solubility at Solvents RT (mg/mL) 50° C. (mg/mL) Acetone 11 Acetontrile ~0 0 MeOH 1 1 Toluene 1 1 EtOH 2 2 IPAc ~0 ~0 EA 1 1 MtBE~0 ~0 IPA 2 5 MEK 1 1 MA ~0 ~0 n-Propanol 1 2 MIBK 1 1 n-Butyl acetate~0 ~0 water 1 1 Heptane ~0 ~0 n-Butanol 1 2 DMSO n/a n/a DMF 12 16 DCM 22 Acetic acid ~0 3

Reslurry experiments in various solvents were performed. Approximately30-80 mg of the starting solid (a non-stoichiometric hydrate of Form 1having between 1% and about 20% by weight water) was slurried in 39different solvents (pure and binary solvents; the ratio of organicsolvent/water (V/V) was 95%/5%) at RT and 50° C. for 5 days. Threesolvates, one non-stoichiometric hydrate, and eleven non-solvated formswere identified. A “*” after a particular Form, e.g., Form 2*, indicatesthat the forms had similar XRD scans with minor differences and wereconsidered to belong to the same class. Generally, the identified formsshowed multiple endotherms/exotherms on differential scanningcalorimetry (DSC) scans; Form 9 showed a single endotherm. XRD of bothwet and dry samples were scanned (FIG. 12A (dry sample)). The data isshown in Tables 2 and 3 below.

TABLE 2 Results of reslurry experiments at RT Crystalline FormCrystalline Form Solvent (wet/dry) Solvent (wet/dry) Acetone Solvate 1Form 2 Acetone/water Solvate 2 Form 4** Acetontrile Form 2 Form 1Acetontrile/water Form 12 Form 1 MeOH Form 13 Form 1 MeOH/water Form 12Form 1 Toluene Form 1 Form 2* Toluene/water Form 13 Form 1 EtOH Form 2*Form 3 EtOH/water Solvate 3 Form 2 IPAc Form 3 Form 4 IPAc/water Form 12Form 1 EA Form 4* Form 5 EA/water Form 12 Form 1 MtBE Form 5* Form 6MtBE/water Form 12 Form 1 IPA Form 6 Form 7 IPA/water Form 6 Form 6 MEKForm 7 Form 4 MEK/water Form 7 Form 7 MA Form 4 Form 4* MA/water Form 13Form 1 n-Propanol Form 4* Form 8 n-Propanol/water Form 2** Form 2** MIBKForm 8 Form 3 MIBK/water Form 12 Form 1 n-Butyl Form 3* Form 1 n-ButylForm 13 Form 12 acetate acetate/water Water Form 13 Form 1 Heptane/waterForm 13 Form 12 Heptane Form 1 Form 9 n-Butanol/water Form 13 Form 13n-Butanol Form 9 Form 10 DMSO/water amorphous Form 10 DMSO amorphousForm 11 DMF/water Form 11 Form 11 DMF Form 11 Form 1 DCM/water Form 13Form 1 DCM Form 1 Form 2

TABLE 3 Results of reslurry experiments at 50° C. Crystalline FormCrystalline Form Solvent (wet/dry) Solvent (wet/dry) Acetone Solvate 2Form 4** Acetone/water Form 4** Form 4** Acetontrile Form 2* Form 2Acetontrile/water Form 13 Form 13 MeOH Form 1 Form 1 MeOH/water Form 13Form 13 Toluene Form 1 Form 1 Toluene/water Form 13 Form 13 EtOH Form 2*Form 2* EtOH/water Form 9 Form 9 IPAc Form 9 Form 9 IPAc/water Form 13Form 13 EA Form 4* Form 4 EA/water Form 4* Form 4* MtBE Form 5* Form 4MtBE/water Form 13 Form 13 IPA Form 6 Form 6 IPA/water Form 6 Form 6 MEKForm 7 Form 7 MEK/water Form 7 Form 7 MA Form 4 Form 4 MA/water Form 12Form 4 n-Propanol Form 4 Form 4** n-Propanol/water Form 9 Form 9 MIBKForm 8 Form 8 MIBK/water Form 13 Form 1 n-Butyl Form 9 Form 9 n-ButylForm 13 Form 1 acetate acetate/water water Form 13 Form 13 Heptane/waterForm 13 Form 1 Heptane Form 13 Form 13 n-Butanol/water Form 13 Form 1n-Butanol Form 9 Form 9 DMSO/water Amorphous Form 10 DMSO Amorphous Form10* DMF/water Form 11 Form 11 DMF Form 11 Form 11* DCM/water Form 13Form 1 DCM Form 13 Form 13

The slurry experiments identified 3 solvated forms from wet samples(Solvates 1, 2, and 3); 2 non-stoichiometric hydrates of Form 1 (Forms12 and 13); and 11 non-solvated forms (Forms 1-11). In some instances,similar XRD scans with minor differences were obtained. These wereconsidered to be part of the same class (e.g., the same form). Forexample, XRD scans of Form 2 and Form 2* were similar and wereconsidered to belong to the same class. The solvated forms were obtainedfrom wet sample analysis; after drying, the sample indicated a differentXRD.

Solvate 1 was obtained from acetone at RT, and after drying, a lowcrystallinity solid was generated. Solvate 2 was obtained from acetone(at RT) and acetone/water (at RT), and after drying, Form 4** wasgenerated. Solvate 3 was obtained from EtOH/water at RT, and afterdrying, Form 2 was generated.

B. Form 1

The experiments that generated Form 1 are shown in Table 4, below. Form1 was generally obtained from drying Form 13 or Form 12. Form 1 can beconsidered a dehydrated hydrate. Reslurry in many binary solvents (with5% water) generated Form 1. Purity of the residual solid was 98.9%. KFof Form 1 (one sample) solid was 5.8%; residual MeOH of Form 1 solid was0.01%. A TGA scan of fully dried Form 1 solid was performed (FIG. 1C). A0.33% weight loss was observed before 100° C.

Form 1 showed sharp crystalline peaks on the XRD scan (FIG. 1A). The XRDpeaks of Form 1 are shown in Table 5, below. According to the DSC scan(FIG. 1B), the solid showed an endotherm between 50-100° C.; it showedan exotherm at 281° C.; and the melting point was 363° C.

The Form 1 solid was dried at 75° C. under vacuum overnight, and XRD,DSC, and TGA scans were performed. Comparison of the first and thesecond XRD scans (after drying at 75° C. under vacuum overnight), showedno change. However, the DSC scans indicated the absence of endotherm.The loss of the early peak on the DSC scan had no effect on the XRDtrace, showing that the endotherm between 50-100° C. on DSC scan was dueto the free solvent.

The Form 1 solid was heated in a DSC chamber to 305° C. (past theendotherm/exotherm around 280° C.), and then scanned by XRD. Comparisonof the first and the third XRD and DSC scans showed that after heatingto 305° C., Form 1 converted to Form 9. Thus, the endotherm/exothermaround 280° C. might be due to melting/crystallization events.

Form 1 tended to convert to a non-stoichiometric hydrate of Form 1having between 1% and about 20% by weight water (e.g., Form 13) at arelative humidity (RH) above 40˜50%. The hydrate lost its water below30% RH. Form 1 converted to a non-stoichiometric hydrate of Form 1 whenexposed to air.

The dynamic vapor sorption (DVS) scan of Form 1 solid showed a 17% waterabsorption at 90% RH (FIG. 1D). The XRD data indicated that the solidused in the DVS test converted to the hydrate form before the start ofthe DVS test. However, at 0% RH, water was lost, perhaps indicating thatthe solid was Form 1.

TABLE 4 Summary of experiments that generated Form 1 Form SolventTemperature Wet Dry Form 1 MeOH RT Form 13 Form 1 MeOH 50° C. Form 1Form 1 Toluene RT Form 1 Form 1 Toluene 50° C. Form 1 Form 1 water RTForm 13 Form 1 Heptane RT Form 1 Form 1 DCM RT Form 1 Form 1Acetontrile/water RT Form 12 Form 1 MeOH/water RT Form 12 Form 1Toluene/water RT Form 13 Form 1 IPAc/water RT Form 13 Form 1 EA/water RTForm 12 Form 1 MtBE/water RT Form 12 Form 1 MA/water RT Form 13 Form 1MIBK/water RT Form 12 Form 1 MIBK/water 50° C. Form 13 Form 1 DCM/waterRT Form 13 Form 1 DCM/water 50° C. Form 13 Form 1 n-Butyl 50° C. Form 13Form 1 acetate/water Heptane/water 50° C. Form 13 Form 1 n-Butanol/water50° C. Form 13 Form 1 *Amount of water in binary solvents is 5%

TABLE 5 XRD peaks of Form 1 2-Theta d(A) BG Height I % Area I % FWHM5.778 15.2835 57 97 28.3 1765 18.5 0.309 6.801 12.9871 19 343 100 830687.1 0.412 9.26 9.5427 20 178 51.9 3884 40.7 0.371 12.421 7.1203 30 23167.3 4862 51 0.358 13.919 6.357 35 147 42.9 3668 38.5 0.424 14.5016.1033 40 133 38.8 3439 36.1 0.44 16.5 5.3681 47 196 57.1 4286 44.90.372 17.26 5.1333 53 46 13.4 560 5.9 0.207 18.52 4.7868 68 342 99.79539 100 0.474 19.161 4.6282 54 215 62.7 4130 43.3 0.327 20.302 4.370649 133 38.8 2823 29.6 0.361 20.619 4.304 43 80 23.3 2047 21.5 0.43523.056 3.8543 41 38 11.1 765 8 0.342 24.642 3.6098 33 175 51 7235 75.80.703 25.302 3.5171 86 80 23.3 2345 24.6 0.498 26.1 3.4113 83 69 20.11545 16.2 0.381 27.46 3.2453 52 46 13.4 872 9.1 0.322 28.739 3.1038 3984 24.5 2146 22.5 0.434 30.444 2.9337 34 32 9.3 1080 11.3 0.54 33.3022.6882 30 27 7.9 683 7.2 0.405

C. Forms 2, 2*, and 2***

The experiments that generated Forms 2, 2*, and 2** are shown in Table6, below. XRD scans of Forms 2, 2* and 2** were performed (FIGS. 2A, 2D,and 2G show the XRD scans of Forms 2, 2*, and 2**, respectively). TheXRD peaks of Forms 2 and 2* are shown in Tables 7 and 8, below,respectively. DSC scans were also performed (FIGS. 2B, 2E, and 2H showthe DSC scans of Forms 2, 2*, and 2**, respectively). According to theDSC scans, Forms 2, 2* and 2** each showed an endotherm between 50°C.-100° C., and multiple endotherms and exotherms before melting at 363°C. The endotherm before 100° C. may be due to the containment ofwater/solvent in the solid. Form 2 was obtained from acetonitrile; Form2* from ethanol; Form 2** from n-propanol/5% water.

A TGA scan of Form 2 (FIG. 2C) showed a 2.7% weight loss before 116° C.FIG. 2F shows the TGA scan of Form 2*

A PLM photo of Form 2 was taken (not shown), indicating that theparticle size of this solid was around 50 um.

The Form 2 solid was heated in a DSC machine to 90° C. (past theendotherm between 50-100° C.); to 270° C. (past the endotherm/exothermaround 240° C.); and finally to 330° C. (past the exotherm around 330°C.). The residual solid was analyzed by XRD. According to the first andsecond XRD and DSC scans, the form did not change before and afterheating to 90° C. The endotherm between 50-100° C. might be free solventor hydrate. According to the first and third XRD and DSC scans, afterheating a Form 2 sample to 270° C., the solid converted to lowcrystalline solids. According to the first and fourth XRD and DSC scans,after heating the sample to 330° C., the solid converted to Form 9.Thus, the exotherm around 290° C. was a re-crystallization event.According to an XRD and DSC overlay, the behavior of Form 2* was similarto Form 2.

Residual acetonitrile and EtOH in Form 2 and 2* was not detected.

TABLE 6 Summary of experiments that generated Forms 2, 2*, and 2** FormSolvent Temperature Wet Dry Form 2 Acetontrile RT Form 2 Form 2Acetontrile 50° C. Form 2* Form 2 EtOH/water RT Solvate 3 Form 2 Form 2*EtOH RT Form 2* Form 2* EtOH 50° C. Form 2* Form 2* Acetontrile 50° C.Form 2* Form 2 Form 2** n- RT Form 2** Form 2** Propanol/water *Amountof water in binary solvents is 5%

TABLE 7 XRD peaks of Form 2 2-Theta d(A) BG Height I % Area I % FWHM7.021 12.5802 164 2202 54.1 36151 38.2 0.279 8.298 10.6462 156 194 4.82332 2.5 0.204 10.399 8.5 193 397 9.8 6246 6.6 0.267 11.258 7.8531 206151 3.7 1407 1.5 0.158 12.239 7.2259 181 287 7 5980 6.3 0.354 14.16.2759 186 648 15.9 14147 15 0.371 14.597 6.0632 195 182 4.5 7983 8.40.746 16.18 5.4734 235 201 4.9 4033 4.3 0.341 16.561 5.3484 251 280 6.98382 8.9 0.509 17.033 5.2013 288 160 3.9 1810 1.9 0.192 17.639 5.0238295 366 9 3542 3.7 0.165 18.878 4.6968 316 1210 29.7 29303 31 0.41219.22 4.614 333 585 14.4 21169 22.4 0.615 19.863 4.4662 340 95 2.3 4370.5 0.078 20.411 4.3474 385 86 2.1 671 0.7 0.133 21.48 4.1335 532 194447.8 61345 64.8 0.536 22.04 4.0297 647 4071 100 94605 100 0.395 23.0363.8576 634 142 3.5 1478 1.6 0.177 24.24 3.6686 497 1688 41.5 28976 30.60.292 25.561 3.482 422 120 2.9 2545 2.7 0.361 25.918 3.4349 365 271 6.711426 12.1 0.717 26.379 3.3759 349 497 12.2 15133 16 0.518 26.739 3.3313387 181 4.4 2845 3 0.267 27.979 3.1863 297 235 5.8 4050 4.3 0.293 29.0433.072 338 347 8.5 4584 4.8 0.225 29.661 3.0094 321 310 7.6 7879 8.30.432 30.204 2.9565 355 135 3.3 1501 1.6 0.189 31.58 2.8308 232 206 5.13991 4.2 0.329 32.602 2.7443 193 63 1.5 1129 1.2 0.305

TABLE 8 XRD peaks of Form 2* 2-Theta d(A) BG Height I % Area I % FWHM4.859 18.1701 127 87 1.2 1714 1.9 0.335 7.119 12.4067 148 3587 48.444853 50.4 0.213 8.321 10.6166 149 407 5.5 4871 5.5 0.203 10.439 8.4669186 1184 16 13629 15.3 0.196 11.319 7.8109 190 413 5.6 4673 5.3 0.19212.3 7.1899 179 1010 13.6 13220 14.9 0.223 12.803 6.9089 182 140 1.91587 1.8 0.193 14.121 6.2667 179 1966 26.5 27290 30.7 0.236 14.5596.0791 199 169 2.3 4381 4.9 0.441 16.236 5.4546 244 436 5.9 5696 6.40.222 16.62 5.3297 271 674 9.1 7919 8.9 0.2 17.059 5.1935 313 629 8.56279 7.1 0.17 17.699 5.0071 303 1094 14.7 12619 14.2 0.196 18.858 4.7018359 2334 31.5 31734 35.7 0.231 19.321 4.5903 325 1650 22.2 28313 31.80.292 19.823 4.4751 412 127 1.7 582 0.7 0.078 20.321 4.3665 327 333 4.53361 3.8 0.172 21.479 4.1336 451 3245 43.8 56365 63.3 0.295 22.1194.0154 612 7417 100 89000 100 0.204 22.782 3.9 536 327 4.4 11890 13.40.618 23.098 3.8475 466 638 8.6 11127 12.5 0.296 24.3 3.6597 361 487365.7 61170 68.7 0.213 25.599 3.4769 487 475 6.4 7278 8.2 0.26 25.883.4399 541 562 7.6 10968 12.3 0.332 26.361 3.3782 372 1289 17.4 2085923.4 0.275 26.739 3.3312 266 660 8.9 13196 14.8 0.34 27.938 3.1909 284560 7.6 9888 11.1 0.3 28.641 3.1142 319 210 2.8 2324 2.6 0.188 29.3983.0357 357 100 1.3 2376 2.7 0.404 29.779 2.9977 295 708 9.5 13168 14.80.316 30.3 2.9473 283 451 6.1 6600 7.4 0.249 31.658 2.8239 239 667 99228 10.4 0.235 32.519 2.7511 221 191 2.6 2896 3.3 0.258 33.903 2.6419213 72 1 876 1 0.207 34.82 2.5744 229 110 1.5 3822 4.3 0.591 35.5042.5264 230 97 1.3 3876 4.4 0.679

D. Form 3

The experiments that generated Form 3 are shown in Table 9, below. XRDand DSC scans of Form 3 were taken (FIGS. 3A and 3B, respectively).Table 10, below, shows the XRD peaks of Form 3. Multiple exotherms andendotherms were observed from the DSC scan of Form 3.

A TGA scan of Form 3 was taken (FIG. 3C) and showed a 1.6% weight lossof the solid before 81° C., followed by a 1.7% weight loss between 81°C. and 169° C.

Form 3 was obtained from IPAc at RT, while Form 3* was obtained fromreslurry in n-butyl acetate.

TABLE 9 Summary of experiments that generated Form 3 and Form 3* FormSolvent Temperature Wet Dry Form 3 IPAc RT Form 3 Form 3 n-Butyl acetateRT Form 3* Form 3 Form 3* n-Butyl acetate RT Form 3* Form 3

TABLE 10 XRD peaks of Form 3 2-Theta d(A) BG Height I % Area I % FWHM5.024 17.5739 231 87 4.4 845 1.9 0.165 6.34 13.9294 368 1030 52.5 1236127.5 0.204 7.219 12.2357 182 1962 100 36491 81.1 0.316 8.441 10.4665 188159 8.1 3261 7.2 0.349 9.237 9.5659 207 320 16.3 3365 7.5 0.179 10.5618.37 240 278 14.2 6270 13.9 0.383 10.998 8.0381 217 849 43.3 17119 38.10.343 11.46 7.715 256 87 4.4 662 1.5 0.129 12.439 7.11 215 311 15.9 650214.5 0.355 12.865 6.8756 209 92 4.7 1599 3.6 0.295 14.22 6.2233 231 52226.6 12265 27.3 0.399 15.524 5.7034 273 311 15.9 2957 6.6 0.162 16.0215.5276 309 218 11.1 2669 5.9 0.208 16.78 5.2792 368 330 16.8 3780 8.40.195 17.181 5.1567 384 99 5 2614 5.8 0.449 17.782 4.9837 428 496 25.36264 13.9 0.215 18.381 4.8227 509 551 28.1 5102 11.3 0.157 19.02 4.6622447 589 30 20513 45.6 0.592 19.758 4.4896 487 423 21.6 14362 31.9 0.57720.8 4.267 520 214 10.9 1518 3.4 0.121 21.19 4.1893 408 418 21.3 458110.2 0.186 21.6 4.1107 553 1017 51.8 41986 93.3 0.702 22.181 4.0044 6621736 88.5 44981 100 0.44 23.185 3.8333 508 259 13.2 3327 7.4 0.218 24.443.6392 467 1441 73.4 29510 65.6 0.348 25.198 3.5313 551 232 11.8 1362 30.1 25.618 3.4745 557 79 4 365 0.8 0.079 26.103 3.4109 512 180 9.2 737416.4 0.696 26.479 3.3634 475 306 15.6 11652 25.9 0.647 27.3 3.264 455133 6.8 1016 2.3 0.13 28.04 3.1796 378 93 4.7 1485 3.3 0.271 28.823.0953 372 201 10.2 3455 7.7 0.292 29.258 3.0499 362 76 3.9 2580 5.70.577 29.88 2.9878 334 191 9.7 4011 8.9 0.357 31.802 2.8115 251 205 10.44094 9.1 0.34 32.62 2.7429 231 87 4.4 1109 2.5 0.217 32.943 2.7167 21552 2.7 1107 2.5 0.362 33.961 2.6375 217 101 5.1 1686 3.7 0.284

E. Form 4

The experiments that generated Forms 4, 4*, and 4** are shown in Table11, below. XRD of Forms 4, 4*, and 4** were taken (FIGS. 4A, 4D, and 4G,respectively). Tables 12 and 13, below, show the XRD peaks of Form 4 andForm 4*, respectively. DSC scans of Forms 4, 4*, and 4** were alsoperformed (FIGS. 4B, 4E, and 4H, respectively). According to the DSCscans, Form 4 showed an endotherm between 50° C.-100° C., followed bymultiple endotherms/exotherms, and then melted at around 367° C. Forms4* and 4** showed similar DSC patterns as Form 4.

TGA scans of Form 4, Form 4*, and Form 4** were taken (FIGS. 4C, 4F, and4I, respectively). For Form 4, there was an 8.3% weight loss before 200°C.; for Form 4*, there was a 4.4% weight loss before 102° C., followedby a 0.5% weight loss between 102° C. and 250° C.; and for Form 4**,there were three stages of weight loss, which were 2.8%, 1.9%, and 1.3%,respectively.

These solid forms were obtained from methyl acetate, n-propanol, MIBK,MtBE, ethyl acetate, acetone/water, and ethyl acetate/water.

TABLE 11 Summary of experiments that generated Forms 4, 4*, and 4** FormSolvent Temperature Wet Dry Form 4 EA RT Form 4* Form 4 EA 50° C. Form4* Form 4 MA RT Form 4 Form 4 MA 50° C. Form 4 Form 4 MA/water 50° C.Form 12 Form 4 MtBE 50° C. Form 5* Form 4 n-Propanol RT Form 4 Form 4*Form 4* EA RT Form 4* Form 4* EA 50° C. Form 4* Form 4 EA/water 50° C.Form 4* Form 4* n-Propanol RT Form 4 Form 4* Form 4** Acetone/water RTSolvate 2 Form 4** Acetone 50° C. Solvate 2 Form 4** n-Propanol 50° C.Form 4 Form 4** Acetone/water 50° C. Form 4** Form 4** *Amount of waterin binary solvents is 5%

TABLE 12 XRD peaks of Form 4 2-Theta d(A) BG Height I % Area I % FWHM3.433 25.7129 197 48 1 697 0.7 0.247 7.019 12.5829 222 3897 77.3 6696869.4 0.292 8.659 10.203 242 448 8.9 8198 8.5 0.311 8.98 9.8395 223 2194.3 7649 7.9 0.594 9.64 9.1672 251 516 10.2 6969 7.2 0.23 10.917 8.0978210 77 1.5 1041 1.1 0.23 12.339 7.1673 220 465 9.2 9572 9.9 0.35 13.826.4023 268 501 9.9 11493 11.9 0.39 14.278 6.1981 271 192 3.8 7288 7.60.645 14.923 5.9314 288 172 3.4 1636 1.7 0.162 16.462 5.3804 310 329 6.53066 3.2 0.158 17.041 5.199 375 105 2.1 942 1 0.153 17.638 5.0241 4351073 21.3 13511 14 0.214 18.281 4.8488 487 772 15.3 9782 10.1 0.21519.52 4.5437 504 1590 31.5 31949 33.1 0.342 21.759 4.081 677 5040 10096504 100 0.326 23.22 3.8275 693 1457 28.9 28109 29.1 0.328 25.12 3.5421710 3091 61.3 69330 71.8 0.381 25.76 3.4556 455 827 16.4 22029 22.80.453 27.221 3.2733 419 180 3.6 2915 3 0.275 28.638 3.1145 409 210 4.24338 4.5 0.351 29.259 3.0498 461 568 11.3 11998 12.4 0.359 30.137 2.9629409 149 3 1946 2 0.222 31.817 2.8102 253 110 2.2 4034 4.2 0.623 32.3192.7677 245 137 2.7 3829 4 0.475

TABLE 13 XRD peaks of Form 4* 2-Theta d(A) BG Height I % Area I % FWHM4.981 17.7282 270 684 15.8 12231 12.6 0.304 7.22 12.2329 244 3416 7965744 67.8 0.327 8.459 10.4447 202 335 7.7 4814 5 0.244 10.56 8.3707 219629 14.5 10739 11.1 0.29 11.42 7.7419 240 203 4.7 2908 3 0.244 12.427.1209 221 614 14.2 11445 11.8 0.317 13.019 6.7947 238 59 1.4 423 0.40.122 14.26 6.2057 227 1052 24.3 20787 21.4 0.336 16.318 5.4274 409 85 2665 0.7 0.133 16.722 5.2973 332 496 11.5 8980 9.3 0.308 17.199 5.1515393 226 5.2 3448 3.6 0.259 17.82 4.9733 402 725 16.8 8502 8.8 0.19918.98 4.672 432 1352 31.3 36895 38.1 0.464 19.44 4.5623 439 990 22.928546 29.4 0.49 20.46 4.3371 444 119 2.8 1163 1.2 0.166 21.58 4.1144 4581982 45.8 71568 73.8 0.614 22.22 3.9974 837 4325 100 96937 100 0.38123.16 3.8373 758 114 2.6 1085 1.1 0.162 24.42 3.6421 522 2466 57 4897750.5 0.338 25.679 3.4663 590 252 5.8 5211 5.4 0.352 26.5 3.3607 470 67115.5 23177 23.9 0.587 26.95 3.3056 356 313 7.2 3645 3.8 0.198 28.1183.1709 385 255 5.9 5045 5.2 0.336 29.9 2.9858 360 383 8.9 13112 13.50.582 30.421 2.9359 346 239 5.5 5602 5.8 0.398 31.779 2.8134 293 336 7.85905 6.1 0.299 32.618 2.743 267 124 2.9 1934 2 0.265

F. Forms 5 and 5*

The experiments that generated Forms 5 and 5* are shown in Table 14,below. XRD scans of Forms 5 and 5* were taken (FIGS. 5A and 5D,respectively). The XRD peaks of Form 5 are shown in Table 15, below. ADSC scan of Form 5 was also performed and showed an endotherm between50° C.-100° C., and multiple endotherms and exotherms before melting at363° C. (FIG. 5B).

A TGA scan of Form 5 solid showed a 3.1% weight loss before 100° C.,followed by a 1.7% weight loss between 100° C. and 250° C. (FIG. 5C).

Forms 5 and 5* were obtained from reslurrying Form 12 in MtBE at RT and50° C. Wet solid showed Form 5*, while dry solid indicated Form 5.

TABLE 14 Summary of experiments that generated Forms 5 and 5* FormSolvent Temperature Wet Dry Form 5 MtBE RT Form 5* Form 5 Form 5* MtBERT Form 5* Form 5 MtBE 50° C. Form 5* Form 4

TABLE 15 XRD peaks of Form 5 2-Theta d(A) BG Height I % Area I % FWHM5.098 17.3185 260 155 2.4 2464 2.1 0.27 6.38 13.8428 256 1778 27.7 3473329.6 0.332 7.28 12.1332 214 3964 61.6 78158 66.5 0.335 8.518 10.3715 234241 3.7 3170 2.7 0.224 9.24 9.5627 227 472 7.3 6614 5.6 0.238 10.6398.3083 266 765 11.9 20508 17.5 0.456 11.019 8.0226 242 1596 24.8 3762032 0.401 11.483 7.6998 398 133 2.1 949 0.8 0.121 12.44 7.1091 246 5849.1 11910 10.1 0.347 12.94 6.8358 249 152 2.4 4189 3.6 0.469 14.3016.1883 279 1114 17.3 22226 18.9 0.339 14.839 5.9648 300 167 2.6 5989 5.10.61 15.581 5.6827 404 376 5.8 4045 3.4 0.183 16.08 5.5073 452 459 7.19013 7.7 0.334 16.357 5.4146 509 260 4 11967 10.2 0.782 16.839 5.2606521 473 7.4 7195 6.1 0.259 17.254 5.1351 550 258 4 4373 3.7 0.288 17.8394.968 562 414 6.4 4207 3.6 0.173 18.439 4.8078 667 590 9.2 5946 5.10.171 19.059 4.6527 616 1603 24.9 35964 30.6 0.381 19.5 4.5486 671 116318.1 30384 25.9 0.444 20.882 4.2506 850 305 4.7 2860 2.4 0.159 21.6794.0959 935 2272 35.3 66194 56.4 0.495 22.28 3.9867 1083 6430 100 117449100 0.311 23.221 3.8273 856 564 8.8 9429 8 0.284 24.461 3.6361 697 425066.1 74709 63.6 0.299 25.276 3.5206 726 170 2.6 1349 1.1 0.135 26.0813.4137 756 442 6.9 17518 14.9 0.674 26.52 3.3582 689 1014 15.8 3461529.5 0.58 28.139 3.1686 528 306 4.8 4846 4.1 0.269 28.821 3.0952 533 4637.2 7067 6 0.259 29.94 2.9819 499 755 11.7 15565 13.3 0.35 30.458 2.9324435 467 7.3 9861 8.4 0.359 31.86 2.8065 343 648 10.1 13697 11.7 0.35932.642 2.741 314 125 1.9 2403 2 0.327 34.002 2.6344 298 123 1.9 1956 1.70.27

G. Form 6

The experiments that generated Form 6 are shown in Table 16, below. XRDand DSC scans of Form 6 were taken (FIGS. 6A and 6B, respectively).According to the DSC scan, the solid showed a small exotherm at 250° C.and a melting endotherm at 358° C.

Form 6 was obtained by reslurrying starting material in IPA and IPA/5%water at RT and 50° C.

TABLE 16 Summary of experiments that generated Form 6 Form SolventTemperature Wet Dry Form 6 IPA RT Form 6 Form 6 IPA 50° C. Form 6 Form 6IPA/water RT Form 6 Form 6 IPA/water 50° C. Form 6 Form 6 *Amount ofwater in binary solvents is 5%

H. Form 7

The experiments that generated Form 7 are shown in Table 17, below. XRDand DSC scans of Form 7 were taken (FIGS. 7A and 7B, respectively). TheXRD peaks of Form 7 are shown in Table 18, below. According to the DSCscan, the solid showed two exotherms at 227° C. and 299° C., followed bya melting endotherm at 365° C. Form 7 showed a low degree ofcrystallinity on XRD. The double exotherm on the DSC scans may beassociated with the low crystallinity observed on the XRD scan.

A TGA scan of Form 7 solid showed a 12% weight loss before 200° C. (FIG.7C).

Form 7 was obtained from MEK and MEK/5% water at RT and 50° C.

TABLE 17 Summary of experiments that generated Form 7 Form SolventTemperature Wet Dry Form 7 MEK RT Form 7 Form 7 MEK 50° C. Form 7 Form 7MEK/water RT Form 7 Form 7 MEK/water 50° C. Form 7 Form 7 *Amount ofwater in binary solvents is 5%

TABLE 18 XRD peaks of Form 7 2-Theta d(A) BG Height I % Area I % FWHM4.94 17.8745 362 1384 23.3 50829 29.2 0.624 7.06 12.5111 286 3171 53.369159 39.8 0.371 8.759 10.0876 370 628 10.6 9606 5.5 0.26 9.9 8.9272 429537 9 11110 6.4 0.352 10.881 8.1241 546 879 14.8 16425 9.4 0.318 11.847.4681 588 413 6.9 7187 4.1 0.296 12.997 6.8061 463 135 2.3 1351 0.80.17 14.404 6.1442 604 126 2.1 3331 1.9 0.449 15.1 5.8626 791 596 108819 5.1 0.252 15.92 5.5622 792 593 10 24460 14.1 0.701 16.581 5.3421739 641 10.8 14919 8.6 0.396 18.5 4.7919 1066 1555 26.1 43174 24.8 0.47219.4 4.5717 1087 930 15.6 17521 10.1 0.32 20.382 4.3535 1178 154 2.6 8670.5 0.096 21.56 4.1183 1424 5949 100 173972 100 0.497 22.098 4.0192 1830692 11.6 17678 10.2 0.434 23.22 3.8275 1749 1971 33.1 42151 24.2 0.36424.203 3.6743 1776 351 5.9 11935 6.9 0.578 24.884 3.5751 1658 271 4.62378 1.4 0.149 25.759 3.4556 1416 492 8.3 19894 11.4 0.687 26.3 3.38581335 499 8.4 23631 13.6 0.805 27.34 3.2594 1192 307 5.2 4494 2.6 0.24928.641 3.1142 1004 382 6.4 18030 10.4 0.802 29.078 3.0684 979 324 5.414234 8.2 0.747 30.28 2.9492 759 711 12 16004 9.2 0.383 31.985 2.7959551 111 1.9 4816 2.8 0.738 33.402 2.6804 509 102 1.7 2060 1.2 0.34334.24 2.6167 474 92 1.5 1901 1.1 0.351

I. Form 8

The experiments that generated Form 8 are shown in Table 19, below. XRDand DSC scans of Form 8 were taken (FIGS. 8A and 8B, respectively). TheXRD peaks of Form 8 are shown in Table 20, below. According to the DSCscan, the solid showed two endotherms at 205° C. and 231° C., followedby an exotherm at 279° C., followed by a melting endotherm at 362° C.Form 8 showed a low degree of crystallinity on the XRD scan. The doubleexotherm on the DSC scan may confirm the low crystallinity seen on XRD(low crystalline material convert to higher crystallinity solid).

A TGA scan of Form 8 showed a 4.2% weight loss before 190° C., followedby a 3.9% weight loss between 190° C. and 261° C. (FIG. 8C).

Form 8 was obtained from MIBK at RT and 50° C. An MIBK/5% water reslurrydoes not produce the same form.

TABLE 19 Summary of experiments that generated Form 8 Form SolventTemperature Wet Dry Form 8 MIBK RT Form 8 Form 8 MIBK 50° C. Form 8 Form8

TABLE 20 XRD peaks of Form 8 2-Theta d(A) BG Height I % Area I % FWHM6.88 12.8368 318 2815 80.8 71578 51.7 0.432 10.699 8.2619 380 70 2 7220.5 0.175 11.48 7.7016 344 466 13.4 9513 6.9 0.347 12.66 6.9866 348 1363.9 1759 1.3 0.22 14.16 6.2496 435 166 4.8 3298 2.4 0.338 15.259 5.8017483 269 7.7 6267 4.5 0.396 16.879 5.2484 669 333 9.6 7638 5.5 0.3917.681 5.0121 780 1959 56.2 76035 54.9 0.66 19.618 4.5213 833 134 3.82110 1.5 0.268 21.5 4.1296 1116 3484 100 138450 100 0.676 24.244 3.6682899 99 2.8 2643 1.9 0.454 27.559 3.234 753 366 10.5 11182 8.1 0.51928.881 3.0889 636 279 8 8137 5.9 0.496 30.878 2.8935 403 87 2.5 1890 1.40.369 31.221 2.8624 386 69 2 1898 1.4 0.468

J. Form 9

The experiments that generated Form 9 are shown in Table 21, below. XRDand DSC scans of Form 9 were taken (FIGS. 9A and 9B, respectively). TheXRD peaks of Form 9 are shown in Table 22, below. According to the DSCscan, the solid showed a single melting endotherm at 364° C.

A TGA scan of Form 9 showed a 0.28% weight loss before 100° C. (FIG.9C).

Other forms, when heated to just before melting at 364° C., seemed toconvert to Form 9. This has been confirmed for Forms 1 and 2.

A DVS scan of Form 9 showed a 0.8% water absorption at 90% RH. Form 9did not change its form before and after the DVS scan (FIG. 9D).

TABLE 21 Summary of experiments that generated Form 9 Form SolventTemperature Wet Dry n-Butanol RT Form 9 Form 9 Form 9 IPAc 50° C. Form 9Form 9 n-Butyl acetate 50° C. Form 9 Form 9 n-Butanol 50° C. Form 9 Form9 EtOH/water 50° C. Form 9 Form 9 n- 50° C. Form 9 Form 9 Propanol/water*Amount of water in binary solvents is 5%

TABLE 22 XRD peaks of Form 9 2-Theta d(A) BG Height I % Area I % FWHM4.94 17.8746 21 895 100 23398 100 0.444 6.26 14.1076 21 34 3.8 513 2.20.257 10.099 8.7516 28 66 7.4 1172 5 0.302 11.883 7.4413 30 46 5.1 8283.5 0.306 13.16 6.7221 27 37 4.1 400 1.7 0.184 15.341 5.771 39 71 7.91541 6.6 0.369 16.518 5.3622 40 93 10.4 1728 7.4 0.316 18.622 4.7608 46260 29.1 7069 30.2 0.462 19.74 4.4938 80 138 15.4 1937 8.3 0.239 21.1014.2068 64 342 38.2 8314 35.5 0.413 22.42 3.9622 56 77 8.6 1721 7.4 0.3824.1 3.6897 58 198 22.1 3904 16.7 0.335 25.2 3.5311 63 157 17.5 361515.5 0.391 26.897 3.312 46 44 4.9 1307 5.6 0.505 28.577 3.121 35 54 61754 7.5 0.552 29.884 2.9874 32 30 3.4 477 2 0.254 30.926 2.8891 35 323.6 682 2.9 0.341

K. Forms 10 and 10*

The experiments that generated Forms 10 and 10* are shown in Table 23,below. XRD scans of Forms 10 and 10* were taken (FIGS. 10A and 10D,respectively). The XRD peaks of Form 10 are shown in Table 24, below.DSC scans of Forms 10 and 10* were also taken and indicated multipleendotherms/exotherms, followed by melting at 367° C. (FIGS. 10B and 10E,respectively).

Forms 10 and 10* were produced by drying of amorphous solids (obtainedfrom DMSO and DMSO/water reslurry at RT and 50° C.). Both Form 10 and10* are associated with DMSO.

A TGA scan of Form 10 solid showed a 0.6% weight loss before 100° C.,followed by a 3.8% weight loss between 100° C. and 170° C., followed bya 7.1% weight loss between 170° C. and 260° C. (FIG. 10C).

TABLE 23 Summary of experiments that generated Forms 10 and 10* FormSolvent Temperature Wet Dry Form 10 DMSO RT amorphous Form 10 DMSO/waterRT amorphous Form 10 DMSO/water 50° C. amorphous Form 10 Form 10* DMSO50° C. amorphous Form 10* *Amount of water in binary solvents is 5%

TABLE 24 XRD peaks of Form 10 2-Theta d(A) BG Height I % Area I % FWHM6.701 13.1792 148 1553 32.1 31364 34.4 0.343 8.3 10.6444 207 1026 21.217914 19.6 0.297 9.38 9.4203 212 1352 27.9 21528 23.6 0.271 10.8198.1705 223 514 10.6 8714 9.6 0.288 11.919 7.4192 271 635 13.1 9435 10.30.253 12.919 6.8469 266 1160 24 22094 24.2 0.324 13.718 6.45 242 81 1.7856 0.9 0.18 14.84 5.9646 271 244 5 4716 5.2 0.329 15.536 5.6988 312 1473 1304 1.4 0.151 16.58 5.3424 392 1813 37.5 30451 33.4 0.286 17.8214.9731 434 2208 45.6 58342 64 0.449 18.16 4.881 434 2862 59.2 89029 97.60.529 19.001 4.6667 1021 3215 66.5 45840 50.2 0.242 19.88 4.4623 11631454 30.1 19014 20.8 0.222 20.701 4.2873 1514 4838 100 78140 85.7 0.27521.66 4.0994 596 4067 84.1 91229 100 0.381 23.38 3.8017 596 2251 46.564928 71.2 0.49 24.22 3.6717 663 4578 94.6 84228 92.3 0.313 26 3.4242595 430 8.9 11172 12.2 0.442 27.12 3.2853 639 146 3 1986 2.2 0.231 27.883.1974 642 2073 42.8 48132 52.8 0.395 28.88 3.089 638 477 9.9 14155 15.50.504 29.867 2.9891 544 205 4.2 4572 5 0.379 30.32 2.9454 528 568 11.711936 13.1 0.357 31.098 2.8735 517 443 9.2 5841 6.4 0.224 31.661 2.8236433 118 2.4 953 1 0.137 33.379 2.6822 433 311 6.4 9235 10.1 0.505 34.222.6181 444 281 5.8 6059 6.6 0.367 34.822 2.5743 460 84 1.7 2707 3 0.54835.438 2.5309 465 89 1.8 858 0.9 0.164

L. Forms 11 and 11*

The experiments that generated Forms 11 and 11* are shown in Table 25,below. XRD scans of Forms 11 and 11* were taken (FIGS. 11A and 11D,respectively). The XRD peaks of Form 11 and Form 11* are shown in Tables26 and 27, below, respectively. DSC scans of Forms 11 and 11* were alsotaken (FIGS. 11B and 11E, respectively). According to the DSC scans, thesolid showed multiple endotherms/exotherms and eventually melted at 368°C. Amorphous halo was observed in the XRD of both Forms. The doubleexotherm on the DSC of both forms may also be associated with theamorphous halo observed on XRD scans.

TGA scans of Form 11 and 11* were taken (FIGS. 11C and 11F,respectively). Form 11 solids showed a 0.8% weight loss before 100° C.,followed by a 7.0% weight loss between 100° C. and 249° C. Form 11*solids showed a 1.0% weight loss before 100° C., followed by a 7.0%weight loss before 250° C.

Forms 11 and 11* were obtained from DMF and DMF/5% water at RT and 50°C.

TABLE 25 Summary of experiments that generated Forms 11 and 11* FormSolvent Temperature Wet Dry Form 11 DMF RT Form 11 Form 11 DMF 50° C.Form 11 Form 11* DMF/water RT Form 11 Form 11 DMF/water 50° C. Form 11Form 11 Form 11* DMF 50° C. Form 11 Form 11* *Amount of water in binarysolvents is 5%

TABLE 26 XRD peaks of Form 11 2-Theta d(A) BG Height I % Area I % FWHM6.42 13.7554 19 496 81.7 9502 100 0.326 8.421 10.4908 20 335 55.2 577560.8 0.293 8.86 9.9726 24 166 27.3 4268 44.9 0.437 10.859 8.1404 21 9115 1292 13.6 0.241 12.479 7.0871 44 83 13.7 1004 10.6 0.206 12.9776.8165 29 51 8.4 1542 16.2 0.514 14.519 6.0957 28 91 15 1421 15 0.26516.801 5.2727 57 104 17.1 2226 23.4 0.364 17.801 4.9787 103 358 59 510953.8 0.243 18.519 4.7871 101 607 100 8460 89 0.237 18.861 4.7011 102 12520.6 1763 18.6 0.24 19.922 4.453 85 383 63.1 7376 77.6 0.327 20.258 4.3879 180 29.7 5778 60.8 0.546 20.899 4.247 76 105 17.3 1291 13.6 0.20921.738 4.085 86 55 9.1 757 8 0.234 22.441 3.9585 94 471 77.6 7125 750.257 22.859 3.8871 78 167 27.5 3724 39.2 0.379 24.458 3.6365 60 29849.1 4544 47.8 0.259 26.82 3.3213 45 195 32.1 4777 50.3 0.416 29 3.076443 99 16.3 3112 32.8 0.534 29.524 3.023 63 37 6.1 190 2 0.087 31.042.8788 38 46 7.6 826 8.7 0.305 31.825 2.8095 36 56 9.2 737 7.8 0.22432.456 2.7563 31 40 6.6 857 9 0.364

TABLE 27 XRD peaks of Form 11* 2-Theta d(A) BG Height I % Area I % FWHM6.441 13.7116 24 424 93.4 8643 100 0.347 6.944 12.7196 20 84 18.5 207824 0.421 8.518 10.3718 22 227 50 4871 56.4 0.365 8.86 9.9721 23 147 32.43581 41.4 0.414 10.859 8.141 26 107 23.6 1695 19.6 0.269 12.519 7.064834 90 19.8 2165 25 0.409 13.021 6.7935 31 54 11.9 1517 17.6 0.478 14.6186.0547 32 76 16.7 1605 18.6 0.359 16.638 5.3238 55 115 25.3 2410 27.90.356 17.838 4.9684 71 368 81.1 6709 77.6 0.31 18.522 4.7864 130 454 1007473 86.5 0.28 19.96 4.4447 109 315 69.4 6433 74.4 0.347 20.26 4.3795109 146 32.2 5359 62 0.624 20.904 4.2461 127 58 12.8 559 6.5 0.16421.639 4.1034 142 194 42.7 4690 54.3 0.411 22.441 3.9586 161 368 81.15409 62.6 0.25 22.94 3.8735 78 150 33 6057 70.1 0.686 23.398 3.7988 78116 25.6 2330 27 0.341 24.44 3.6391 75 305 67.2 5097 59 0.284 26.8193.3215 68 206 45.4 4795 55.5 0.396 29.018 3.0745 56 109 24 4093 47.40.638 29.566 3.0188 82 43 9.5 341 3.9 0.135 31.022 2.8804 58 55 12.1 5095.9 0.157 31.881 2.8047 49 48 10.6 482 5.6 0.171 32.338 2.7661 42 50 111360 15.7 0.462

M. Form 13 and Form 12

The experiments that generated Form 13 and Form 12 are shown in Tables28 and 30, below, respectively. Forms 12 and 13 are examples ofnon-stoichiometric hydrate forms of Form 1 that have between 1% andabout 20% by weight water. XRD scans of Form 13 and Form 12 were taken(FIGS. 13A and 12A, respectively). The XRD peaks of Form 13 are shown inTable 29, below. DSC scans of Form 13 and Form 12 were also taken (FIGS.13B and 12B, respectively). According to the DSC scan, Form 13 solidsshowed an endotherm between 50° C.-100° C., followed by a small exothermat 278° C.; and a melting endotherm at 363° C. According to the DSCscan, Form 12 solids showed an endotherm between 50° C.-100° C.,followed by an exotherm at 283° C.; and a melting endotherm at 364° C.

The purity of the Form 13 sample was 98.8%; the KF of an undried Form 13sample was 35.7%. A DVS scan of Form 13 solid showed a 17% watersorption at 90% RH (FIG. 13D). Form 13 converted to Form 1 upon drying.

A TGA scan of Form 13 solid showed a 1.9% weight loss before 100° C.(FIG. 13C).

Form 13 solid was heated in a DSC chamber to 170° C. (past the endothermbetween 50-100° C.), and then scanned by XRD. A comparison of the firstand the second XRD and DSC scans, after heating to 170° C., showed thatForm 13 converted to Form 1. It can be concluded that the endothermbetween 50-100° C. is due to bonded water.

Form 13 solid was heated in a DSC chamber to 330° C. (past theendotherm/exotherm around 300° C.), and then scanned by XRD. Acomparison of the first and the third XRD and DSC scans, after heatingto 170° C., showed that Form 13 converted to Form 9. It can be concludedthat the endotherm/exotherm is due to melting/crystallization events.

TABLE 28 Summary of experiments that generated Form 13 Form SolventTemperature Wet Dry Form 13 MeOH RT Form 13 Form 1 MeOH/water 50° C.Form 13 Form 13 water RT Form 13 Form 1 water 50° C. Form 13 Form 13Toluene/water RT Form 13 Form 1 Toluene/water 50° C. Form 13 Form 13MA/water RT Form 13 Form 1 n-Butyl RT Form 13 Form 12 acetate/watern-Butyl 50° C. Form 13 Form 1 acetate/water Heptane 50° C. Form 13 Form13 Heptane/water RT Form 13 Form 12 Heptane/water 50° C. Form 13 Form 1n-Butanol/water RT Form 13 Form 13 n-Butanol/water 50° C. Form 13 Form 1DCM 50° C. Form 13 Form 13 DCM/water RT Form 13 Form 1 DCM/water 50° C.Form 13 Form 1 Acetontrile/water 50° C. Form 13 Form 13 IPAc/water 50°C. Form 13 Form 13 MtBE/water 50° C. Form 13 Form 13 MIBK/water 50° C.Form 13 Form 1 *Amount of water in binary solvents is 5%

TABLE 29 XRD peaks of Form 13 2-Theta d(A) BG Height I % Area I % FWHM5.06 17.45 278 309 6.5 3685 4.8 0.203 6.379 13.8451 223 4743 100 76110100 0.273 9.24 9.5632 164 1370 28.9 20018 26.3 0.248 11 8.0364 173 344572.6 51777 68 0.256 12.899 6.8574 195 173 3.6 3114 4.1 0.306 13.4626.572 199 204 4.3 2376 3.1 0.198 14.159 6.2498 202 390 8.2 5424 7.10.236 15.56 5.6901 262 1335 28.1 19295 25.4 0.246 16.059 5.5145 302 100221.1 17561 23.1 0.298 16.841 5.26 313 774 16.3 7797 10.2 0.171 17.465.075 322 314 6.6 3863 5.1 0.209 18.419 4.8128 339 2354 49.6 29374 38.60.212 19.3 4.5951 357 210 4.4 8112 10.7 0.657 19.741 4.4935 329 1566 3330236 39.7 0.328 20.202 4.3919 342 210 4.4 2880 3.8 0.233 20.84 4.2589300 1054 22.2 18033 23.7 0.291 21.201 4.1873 284 964 20.3 15700 20.60.277 22.121 4.015 259 197 4.2 2208 2.9 0.191 23.2 3.8307 268 482 10.27844 10.3 0.277 24.42 3.642 280 1101 23.2 16244 21.3 0.251 24.839 3.5816303 468 9.9 9306 12.2 0.338 25.219 3.5284 385 1093 23 16646 21.9 0.25926.164 3.4032 359 357 7.5 5064 6.7 0.241 26.499 3.3609 402 317 6.7 73169.6 0.392 26.798 3.324 346 179 3.8 8025 10.5 0.762 27.339 3.2594 394 72015.2 13063 17.2 0.308 27.639 3.2247 341 318 6.7 5673 7.5 0.303 28.7993.0974 256 805 17 16756 22 0.354 29.902 2.9857 262 234 4.9 3508 4.60.255 31.234 2.8613 230 106 2.2 1473 1.9 0.236 31.96 2.798 226 308 6.53908 5.1 0.216 32.939 2.717 208 117 2.5 1444 1.9 0.21 33.962 2.6375 199266 5.6 4617 6.1 0.295 34.917 2.5675 217 73 1.5 736 1 0.171

TABLE 30 Summary of experiments that generated Form 12 Form SolventTemperature Wet Dry Form 12 Acetontrile/water RT Form 12 Form 1MeOH/water RT Form 12 Form 1 IPAc/water RT Form 12 Form 1 EA/water RTForm 12 Form 1 MtBE/water RT Form 12 Form 1 MIBK/water RT Form 12 Form 1n-Butyl RT Form 13 Form 12 acetate/water Heptane/water RT Form 13 Form12 MA/water 50° C. Form 12 Form 4 *Amount of water in binary solvents is5%

N. Solvates 1-3

The experiments that generated Solvates 1, 2, and 3 are shown in Table31, below. Solvates 1 and 2 solids were exposed to air overnight, andthen analyzed by XRD. After the analysis, the solids were dried at 50°C. under vacuum, and then analyzed by XRD again.

After exposure to air overnight, Solvate 1 converted to lowcrystallinity; after drying at 50° C., the sample was still a lowcrystallinity solid. After exposure to air overnight, the XRD pattern ofSolvate 2 changed a little; after drying at 50° C., the form remainedthe same as the solid exposed to air overnight.

TABLE 31 Summary of experiments that generated solvates 1-3 Form SolventTemperature Wet Dry Solvate 1 Acetone RT Solvate 1 Low crystallinitySolvate 2 Acetone/water RT Solvate 2 Form 4** Acetone 50° C. Solvate 2Form 4** Solvate 3 EtOH/water RT Solvate 3 Form 2 *Amount of water inbinary solvent is 5%

Example 5: Competitive Reslurry Experiments Between Polymorph Forms

In order to find out the thermodynamic stability between the differentforms, several competitive reslurry experiments were carried out. Form1, Form 2, Form 2*, Form 3, Form 4, Form 4*, Form 4**, Form 5, Form 7,Form 8, Form 9, Form 10, Form 11, Form 11*, and Form 13 (10 mg for each)were mixed and slurried in 2 mL of solvent at both RT and 50° C. Thesolids were slurried for 3-5 days and then analyzed by XRD. According tothe analytical data, Form 2* was the most stable form in a MeOH, EtOH,and acetone system at both RT and 50° C. Form 4 or 4* was most stable inEA at RT and 50° C. Form 13 was most stable in water at RT and 50° C.Table 32 shows the XRD scan results from the competitive reslurryexperiments.

TABLE 32 XRD scan results of competitive reslurry experiments Form after3 days; Form after 5 days; Temperature Solvent wet/dry wet/dry RT MeOHForm 2*/Form 2* Form 2*/Form 2* EtOH Form 2*/Form 2* Form 2*/Form 2*Acetone Form 2*/Form 2* Form 2*/Form 2* EA Form 4/Form 4 Form 4/Form 4water Form 13/Form 13 Form 13/Form 1&Form 13 50° C. MeOH Form 2*/Form 2*Form 2*/Form 2* EtOH Form 2*/Form 2* Form 2*/Form 2* Acetone Form2*/Form 2* Form 2*/Form 2* EA Form 4/Form 4 Form 4*/Form 4* water Form13/Form 13 Form 13/Form 13

In order to find out the thermodynamic stability between Form 13 andForm 9, several competitive reslurry experiments were carried out. 15 mgof Form 1, Form 9 and Form 13 solids were mixed in 1 mL of toluene,IPAc, and n-butyl acetate, and slurried for 3 days at RT and 50° C.

The residual solid was analyzed by XRD. After a three-day reslurry, itwas difficult to tell which one was more stable between Form 13 and Form9. The XRD scan results of the experiment are shown in Table 33, below.

TABLE 33 XRD scan results competitive reslurry experiments TemperatureSolvent Form after 3 days; wet/dry RT Toluene Form 13/Form 1 IPAc Form9 + Form 13/Form 9 + Form 1 n-Butyl acetate Form 9 + Form 13/Form 9 +Form 1 50° C. Toluene Form 9 + Form 13/Form 9 + Form 1 IPAc Form 9/Form9 n-Butyl acetate Form 9 + Form 13/Form 9 + Form 1

1. (canceled)
 2. A process for preparing a polymorph form of a compoundof Formula (1)

the process comprising: (a) reacting a compound of Formula (8)

or a salt thereof, with bis(pinacolato)diboron and Pd(dppf)Cl₂ toproduce a compound of Formula (9)

or a salt thereof; (b) reacting the compound of Formula (9), or the saltthereof, with a compound of Formula (10)

or a salt thereof, Pd(PPh₃)₄ and K₃PO₄ to prepare a compound of Formula(11)

or a salt thereof, (c) reacting the compound of Formula (11), or thesalt thereof, with a compound of Formula (6)

or a salt thereof, to prepare a compound of Formula (12)

or a salt thereof; (d) deprotecting the compound of Formula (12), or thesalt thereof, to prepare the compound of Formula (1), or a salt thereof,wherein deprotecting the compound of Formula (12) to prepare thecompound of Formula (1) comprises reacting the compound of Formula (12)with TFA; (e) reslurrying the compound of Formula (1) in a solvent,wherein the solvent is selected from acetonitrile, n-butyl acetate,n-butanol, dichloromethane (DCM), heptane, isopropyl alcohol, methanol,methyl acetate (MA), methyl tert-butyl ether (MtBE), methyl isobutylketone (MIBK), toluene, water, or a mixture thereof; wherein reslurryingis performed at a temperature of about room temperature to about 50° C.;wherein reslurrying is performed for a time of about 10 hours to about80 hours; (f) filtering to provide the compound of Formula (1) as aresidual solid; (g) drying the residual solid; (h) reslurrying theresidual solid in a solvent to generate the polymorph; and (i) filteringto provide the polymorph as a residual solid; wherein the polymorph hasan MUD pattern with at least peaks at ° 2θ positions of 4.9±0.2,18.6±0.2, and 21.1±0.2.
 3. The process of claim 2, wherein the TFA instep (d) is neat TFA.
 4. The process of claim 2, wherein reslurrying instep (e) is performed at room temperature.
 5. The process of claim 2,wherein reslurrying in step (e) is performed at a temperature of about50° C.
 6. The process of claim 2, wherein reslurrying in step (e) isperformed at a temperature of about 30° C. to about 35° C.
 7. Theprocess of claim 2, wherein reslurrying in step (e) is performed for atime of about 58 hours to about 80 hours.
 8. The process of claim 7,wherein the solvent in step (e) is selected from methanol, water, or amixture thereof.
 9. The process of claim 8, wherein the solvent in step(e) is 90% methanol/water.
 10. The process of claim 8, wherein thesolvent in step (e) is methanol; and wherein reslurrying is performed ata temperature of about 50° C.
 11. The process of claim 2, wherein thedrying in step (g) is performed under vacuum.
 12. The process of claim11, wherein the drying in step (g) is at a temperature of between about60° C. and 90° C.
 13. The process of claim 12, wherein the drying instep (g) is at a temperature of about 75° C.
 14. The process of claim 2,wherein the solvent in step (h) is selected from n-butanol, isopropylalcohol, n-propyl alcohol, isopropyl acetate, n-butyl acetate, ethanol,methanol, water, or a mixture thereof.
 15. The process of claim 14,wherein the solvent in step (h) is isopropyl acetate.
 16. The process ofclaim 14, wherein the solvent in step (h) is a mixture of methanol andwater.
 17. The process of claim 16, wherein the solvent in step (h) is90% methanol/water.
 18. The process of claim 2, wherein reslurrying instep (h) is performed at a temperature of about 50° C.
 19. The processof claim 2, wherein the polymorph in step (i) has an XRPD pattern withat least peaks at ° 2θ positions 4.9±0.2, 18.6±0.2, 21.1±0.2, 24.1±0.2,and 25.2±0.2.
 20. The process of claim 19, wherein the polymorph in step(i) has an XRPD pattern with at least peaks at ° 2θ positions 4.9±0.2,10.1±0.2, 15.3±0.2, 16.5±0.2, 18.6±0.2, 21.1±0.2, 22.4±0.2, 24.1±0.2,25.2±0.2, and 28.6±0.2.
 21. The process of claim 2, wherein thepolymorph exhibits an endotherm at around 364° C. as measured by DSC.22. The process of claim 2, wherein the polymorph undergoes a weightloss of about 0.28% between about 30.5° C. to about 100° C., as measuredby TGA.
 23. The process of claim 2, wherein the polymorph is ananhydrous polymorph.